JPH1167762A - 半導体デバイスの金属配線及びその形成方法 - Google Patents

半導体デバイスの金属配線及びその形成方法

Info

Publication number
JPH1167762A
JPH1167762A JP10104427A JP10442798A JPH1167762A JP H1167762 A JPH1167762 A JP H1167762A JP 10104427 A JP10104427 A JP 10104427A JP 10442798 A JP10442798 A JP 10442798A JP H1167762 A JPH1167762 A JP H1167762A
Authority
JP
Japan
Prior art keywords
metal wiring
spaces
semiconductor device
conductive layer
grain size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10104427A
Other languages
English (en)
Japanese (ja)
Inventor
Yoru I Kan
カン・ヨル・イ
Soku Jin Kyon
キョン・ソク・ジン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
LG Semicon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Semicon Co Ltd filed Critical LG Semicon Co Ltd
Publication of JPH1167762A publication Critical patent/JPH1167762A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP10104427A 1997-08-14 1998-04-15 半導体デバイスの金属配線及びその形成方法 Pending JPH1167762A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR38885/1997 1997-08-14
KR1019970038885A KR19990016355A (ko) 1997-08-14 1997-08-14 반도체소자의 금속배선 및 그 형성방법

Publications (1)

Publication Number Publication Date
JPH1167762A true JPH1167762A (ja) 1999-03-09

Family

ID=19517510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10104427A Pending JPH1167762A (ja) 1997-08-14 1998-04-15 半導体デバイスの金属配線及びその形成方法

Country Status (2)

Country Link
JP (1) JPH1167762A (ko)
KR (1) KR19990016355A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009528705A (ja) * 2006-03-02 2009-08-06 フリースケール セミコンダクター インコーポレイテッド 金属エレクトロマイグレーション設計を有するｒｆパワートランジスタデバイス、及びその製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8617982B2 (en) 2010-10-05 2013-12-31 Novellus Systems, Inc. Subtractive patterning to define circuit components
US9899234B2 (en) 2014-06-30 2018-02-20 Lam Research Corporation Liner and barrier applications for subtractive metal integration

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009528705A (ja) * 2006-03-02 2009-08-06 フリースケール セミコンダクター インコーポレイテッド 金属エレクトロマイグレーション設計を有するｒｆパワートランジスタデバイス、及びその製造方法

Also Published As

Publication number Publication date
KR19990016355A (ko) 1999-03-05

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