JPH115064A5 - - Google Patents

Info

Publication number
JPH115064A5
JPH115064A5 JP1997159038A JP15903897A JPH115064A5 JP H115064 A5 JPH115064 A5 JP H115064A5 JP 1997159038 A JP1997159038 A JP 1997159038A JP 15903897 A JP15903897 A JP 15903897A JP H115064 A5 JPH115064 A5 JP H115064A5
Authority
JP
Japan
Prior art keywords
sample
liquid
substrate
separation
porous layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1997159038A
Other languages
English (en)
Japanese (ja)
Other versions
JPH115064A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9159038A priority Critical patent/JPH115064A/ja
Priority claimed from JP9159038A external-priority patent/JPH115064A/ja
Priority to SG1998001381A priority patent/SG67512A1/en
Priority to TW087109174A priority patent/TW398039B/zh
Priority to US09/096,285 priority patent/US6427747B1/en
Priority to CA002240701A priority patent/CA2240701C/en
Priority to EP98110922A priority patent/EP0886300A3/en
Priority to AU71869/98A priority patent/AU724851B2/en
Priority to KR10-1998-0022476A priority patent/KR100372810B1/ko
Priority to CN98114865A priority patent/CN1208672A/zh
Publication of JPH115064A publication Critical patent/JPH115064A/ja
Publication of JPH115064A5 publication Critical patent/JPH115064A5/ja
Withdrawn legal-status Critical Current

Links

JP9159038A 1997-06-16 1997-06-16 試料の分離装置及びその方法並びに基板の製造方法 Withdrawn JPH115064A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP9159038A JPH115064A (ja) 1997-06-16 1997-06-16 試料の分離装置及びその方法並びに基板の製造方法
SG1998001381A SG67512A1 (en) 1997-06-16 1998-06-09 Apparatus and method of separating sample and substrate fabrication method
TW087109174A TW398039B (en) 1997-06-16 1998-06-09 Apparatus and method of separating sample and substrate fabrication method
US09/096,285 US6427747B1 (en) 1997-06-16 1998-06-11 Apparatus and method of separating sample and substrate fabrication method
AU71869/98A AU724851B2 (en) 1997-06-16 1998-06-15 Apparatus and method of separating sample and substrate fabrication method
CA002240701A CA2240701C (en) 1997-06-16 1998-06-15 Apparatus and method of separating sample and substrate fabrication method
EP98110922A EP0886300A3 (en) 1997-06-16 1998-06-15 Apparatus and method of separating sample and substrate fabrication method
KR10-1998-0022476A KR100372810B1 (ko) 1997-06-16 1998-06-16 시료의분리장치및그분리방법과기판의제조방법
CN98114865A CN1208672A (zh) 1997-06-16 1998-06-16 分离试样的方法和设备,以及基片制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9159038A JPH115064A (ja) 1997-06-16 1997-06-16 試料の分離装置及びその方法並びに基板の製造方法

Publications (2)

Publication Number Publication Date
JPH115064A JPH115064A (ja) 1999-01-12
JPH115064A5 true JPH115064A5 (enExample) 2005-04-07

Family

ID=15684894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9159038A Withdrawn JPH115064A (ja) 1997-06-16 1997-06-16 試料の分離装置及びその方法並びに基板の製造方法

Country Status (9)

Country Link
US (1) US6427747B1 (enExample)
EP (1) EP0886300A3 (enExample)
JP (1) JPH115064A (enExample)
KR (1) KR100372810B1 (enExample)
CN (1) CN1208672A (enExample)
AU (1) AU724851B2 (enExample)
CA (1) CA2240701C (enExample)
SG (1) SG67512A1 (enExample)
TW (1) TW398039B (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6382292B1 (en) * 1997-03-27 2002-05-07 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid
US6418999B1 (en) * 1997-12-26 2002-07-16 Cannon Kabushiki Kaisha Sample separating apparatus and method, and substrate manufacturing method
SG71182A1 (en) 1997-12-26 2000-03-21 Canon Kk Substrate processing apparatus substrate support apparatus substrate processing method and substrate manufacturing method
JPH11243050A (ja) 1998-02-24 1999-09-07 Canon Inc 露光装置
US6540861B2 (en) 1998-04-01 2003-04-01 Canon Kabushiki Kaisha Member separating apparatus and processing apparatus
JP4343295B2 (ja) * 1998-11-06 2009-10-14 キヤノン株式会社 試料の処理システム
TW484184B (en) 1998-11-06 2002-04-21 Canon Kk Sample separating apparatus and method, and substrate manufacturing method
JP2000150611A (ja) * 1998-11-06 2000-05-30 Canon Inc 試料の処理システム
US6672358B2 (en) 1998-11-06 2004-01-06 Canon Kabushiki Kaisha Sample processing system
JP4365920B2 (ja) 1999-02-02 2009-11-18 キヤノン株式会社 分離方法及び半導体基板の製造方法
JP2000223683A (ja) * 1999-02-02 2000-08-11 Canon Inc 複合部材及びその分離方法、貼り合わせ基板及びその分離方法、移設層の移設方法、並びにｓｏｉ基板の製造方法
FR2796491B1 (fr) * 1999-07-12 2001-08-31 Commissariat Energie Atomique Procede de decollement de deux elements et dispositif pour sa mise en oeuvre
US6221740B1 (en) * 1999-08-10 2001-04-24 Silicon Genesis Corporation Substrate cleaving tool and method
JP2002075917A (ja) * 2000-08-25 2002-03-15 Canon Inc 試料の分離装置及び分離方法
JP4803884B2 (ja) 2001-01-31 2011-10-26 キヤノン株式会社 薄膜半導体装置の製造方法
JP4708577B2 (ja) 2001-01-31 2011-06-22 キヤノン株式会社 薄膜半導体装置の製造方法
JP2002229473A (ja) 2001-01-31 2002-08-14 Canon Inc 表示装置の製造方法
DE10108369A1 (de) * 2001-02-21 2002-08-29 B L E Lab Equipment Gmbh Verfahren und Vorrichtung zum Ablösen eines Halbleiterwafers von einem Träger
FR2823373B1 (fr) * 2001-04-10 2005-02-04 Soitec Silicon On Insulator Dispositif de coupe de couche d'un substrat, et procede associe
JP2002353423A (ja) * 2001-05-25 2002-12-06 Canon Inc 板部材の分離装置及び処理方法
JP2003017668A (ja) * 2001-06-29 2003-01-17 Canon Inc 部材の分離方法及び分離装置
JP2005311199A (ja) * 2004-04-23 2005-11-04 Canon Inc 基板の製造方法
JP2008135690A (ja) * 2006-10-30 2008-06-12 Denso Corp 半導体力学量センサおよびその製造方法
KR102061359B1 (ko) * 2011-10-31 2019-12-31 글로벌웨이퍼스 씨오., 엘티디. 본딩된 웨이퍼 구조물 절개를 위한 클램핑 장치 및 절개 방법
KR102082271B1 (ko) * 2013-05-24 2020-04-16 엘지디스플레이 주식회사 캐리어기판 분리 시스템 및 분리 방법
KR101898121B1 (ko) * 2015-10-22 2018-09-12 저지앙 마이크로테크 머테리얼 컴퍼니 리미티드 워크피스 처리 방법 및 그러한 방법을 위해 설계된 장치
US11538698B2 (en) * 2019-09-27 2022-12-27 Globalwafers Co., Ltd. Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures
JP7309191B2 (ja) * 2019-11-06 2023-07-18 中村留精密工業株式会社 ウェハー分割装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3147142A (en) * 1961-01-25 1964-09-01 Frank S Rudo Precision coating devices
US3583634A (en) * 1968-12-02 1971-06-08 Fmc Corp Spray nozzle
US3664586A (en) * 1970-07-06 1972-05-23 Charles R Harris Sr Sprinkler head
US4326553A (en) * 1980-08-28 1982-04-27 Rca Corporation Megasonic jet cleaner apparatus
DE4100526A1 (de) * 1991-01-10 1992-07-16 Wacker Chemitronic Vorrichtung und verfahren zum automatischen vereinzeln von gestapelten scheiben
US5255853A (en) * 1991-04-02 1993-10-26 Ingersoll-Rand Company Adjustable fluid jet cleaner
US5232155A (en) * 1991-05-17 1993-08-03 Ingersoll-Rand Company Integrity sensor for fluid jet nozzle
FR2699852B1 (fr) 1992-12-29 1995-03-17 Gaz De France Procédé et dispositif d'usinage à jet de fluide haute pression asservi.
JP3257580B2 (ja) 1994-03-10 2002-02-18 キヤノン株式会社 半導体基板の作製方法
JPH098095A (ja) * 1995-06-22 1997-01-10 Fuji Electric Co Ltd 積層半導体ウエハの分離装置およびその分離方法
KR0165467B1 (ko) 1995-10-31 1999-02-01 김광호 웨이퍼 디본더 및 이를 이용한 웨이퍼 디본딩법
JPH1022238A (ja) * 1996-06-29 1998-01-23 Komatsu Electron Metals Co Ltd 半導体ウェハのエアーブロー装置
US6382292B1 (en) 1997-03-27 2002-05-07 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid
US6048411A (en) * 1997-05-12 2000-04-11 Silicon Genesis Corporation Silicon-on-silicon hybrid wafer assembly

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