JP2000049062A5 - - Google Patents
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- Publication number
- JP2000049062A5 JP2000049062A5 JP1998211510A JP21151098A JP2000049062A5 JP 2000049062 A5 JP2000049062 A5 JP 2000049062A5 JP 1998211510 A JP1998211510 A JP 1998211510A JP 21151098 A JP21151098 A JP 21151098A JP 2000049062 A5 JP2000049062 A5 JP 2000049062A5
- Authority
- JP
- Japan
- Prior art keywords
- separation
- sample
- layer
- region
- separation layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000926 separation method Methods 0.000 claims 62
- 239000012530 fluid Substances 0.000 claims 7
- 230000000717 retained effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21151098A JP4365907B2 (ja) | 1998-07-27 | 1998-07-27 | 試料の分離方法 |
| US09/359,575 US6427748B1 (en) | 1998-07-27 | 1999-07-22 | Sample processing apparatus and method |
| TW88112483A TW522488B (en) | 1998-07-27 | 1999-07-22 | Sample processing apparatus and method |
| EP19990305837 EP0977242A3 (en) | 1998-07-27 | 1999-07-23 | Sample processing apparatus and method |
| US10/175,201 US6773534B2 (en) | 1998-07-27 | 2002-06-20 | Sample processing apparatus and method |
| US10/175,004 US6609553B2 (en) | 1998-07-27 | 2002-06-20 | Sample processing apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21151098A JP4365907B2 (ja) | 1998-07-27 | 1998-07-27 | 試料の分離方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000049062A JP2000049062A (ja) | 2000-02-18 |
| JP2000049062A5 true JP2000049062A5 (enExample) | 2005-10-13 |
| JP4365907B2 JP4365907B2 (ja) | 2009-11-18 |
Family
ID=16607126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21151098A Expired - Fee Related JP4365907B2 (ja) | 1998-07-27 | 1998-07-27 | 試料の分離方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4365907B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005039114A (ja) * | 2003-07-17 | 2005-02-10 | Disco Abrasive Syst Ltd | 半導体ウェーハ移し替え装置 |
| JP4484739B2 (ja) * | 2005-03-23 | 2010-06-16 | 株式会社スギノマシン | ウォータジェットノズル装置 |
| JP5561666B2 (ja) * | 2009-09-07 | 2014-07-30 | 国立大学法人埼玉大学 | 基板スライス方法 |
-
1998
- 1998-07-27 JP JP21151098A patent/JP4365907B2/ja not_active Expired - Fee Related
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