JP2000049061A5 - - Google Patents
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- Publication number
- JP2000049061A5 JP2000049061A5 JP1998211509A JP21150998A JP2000049061A5 JP 2000049061 A5 JP2000049061 A5 JP 2000049061A5 JP 1998211509 A JP1998211509 A JP 1998211509A JP 21150998 A JP21150998 A JP 21150998A JP 2000049061 A5 JP2000049061 A5 JP 2000049061A5
- Authority
- JP
- Japan
- Prior art keywords
- sample
- separation
- region
- separation layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000926 separation method Methods 0.000 claims 21
- 238000003672 processing method Methods 0.000 claims 10
- 239000012530 fluid Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10211509A JP2000049061A (ja) | 1998-07-27 | 1998-07-27 | 試料の処理装置及び処理方法 |
| TW88112483A TW522488B (en) | 1998-07-27 | 1999-07-22 | Sample processing apparatus and method |
| US09/359,575 US6427748B1 (en) | 1998-07-27 | 1999-07-22 | Sample processing apparatus and method |
| EP19990305837 EP0977242A3 (en) | 1998-07-27 | 1999-07-23 | Sample processing apparatus and method |
| US10/175,201 US6773534B2 (en) | 1998-07-27 | 2002-06-20 | Sample processing apparatus and method |
| US10/175,004 US6609553B2 (en) | 1998-07-27 | 2002-06-20 | Sample processing apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10211509A JP2000049061A (ja) | 1998-07-27 | 1998-07-27 | 試料の処理装置及び処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000049061A JP2000049061A (ja) | 2000-02-18 |
| JP2000049061A5 true JP2000049061A5 (enExample) | 2005-10-13 |
Family
ID=16607112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10211509A Pending JP2000049061A (ja) | 1998-07-27 | 1998-07-27 | 試料の処理装置及び処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000049061A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2823373B1 (fr) * | 2001-04-10 | 2005-02-04 | Soitec Silicon On Insulator | Dispositif de coupe de couche d'un substrat, et procede associe |
| JP6101084B2 (ja) * | 2013-01-17 | 2017-03-22 | 株式会社ディスコ | 分離装置 |
| WO2025070639A1 (ja) * | 2023-09-29 | 2025-04-03 | 芝浦メカトロニクス株式会社 | 基板分離装置 |
-
1998
- 1998-07-27 JP JP10211509A patent/JP2000049061A/ja active Pending
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