JP2000049061A - 試料の処理装置及び処理方法 - Google Patents

試料の処理装置及び処理方法

Info

Publication number
JP2000049061A
JP2000049061A JP10211509A JP21150998A JP2000049061A JP 2000049061 A JP2000049061 A JP 2000049061A JP 10211509 A JP10211509 A JP 10211509A JP 21150998 A JP21150998 A JP 21150998A JP 2000049061 A JP2000049061 A JP 2000049061A
Authority
JP
Japan
Prior art keywords
sample
separation
layer
bonded substrate
separated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10211509A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000049061A5 (enExample
Inventor
Kazutaka Yanagida
一隆 柳田
Kiyobumi Sakaguchi
清文 坂口
Kazuaki Omi
和明 近江
Takao Yonehara
隆夫 米原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP10211509A priority Critical patent/JP2000049061A/ja
Priority to US09/359,575 priority patent/US6427748B1/en
Priority to TW88112483A priority patent/TW522488B/zh
Priority to EP19990305837 priority patent/EP0977242A3/en
Publication of JP2000049061A publication Critical patent/JP2000049061A/ja
Priority to US10/175,004 priority patent/US6609553B2/en
Priority to US10/175,201 priority patent/US6773534B2/en
Publication of JP2000049061A5 publication Critical patent/JP2000049061A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
JP10211509A 1998-07-27 1998-07-27 試料の処理装置及び処理方法 Pending JP2000049061A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP10211509A JP2000049061A (ja) 1998-07-27 1998-07-27 試料の処理装置及び処理方法
US09/359,575 US6427748B1 (en) 1998-07-27 1999-07-22 Sample processing apparatus and method
TW88112483A TW522488B (en) 1998-07-27 1999-07-22 Sample processing apparatus and method
EP19990305837 EP0977242A3 (en) 1998-07-27 1999-07-23 Sample processing apparatus and method
US10/175,004 US6609553B2 (en) 1998-07-27 2002-06-20 Sample processing apparatus and method
US10/175,201 US6773534B2 (en) 1998-07-27 2002-06-20 Sample processing apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10211509A JP2000049061A (ja) 1998-07-27 1998-07-27 試料の処理装置及び処理方法

Publications (2)

Publication Number Publication Date
JP2000049061A true JP2000049061A (ja) 2000-02-18
JP2000049061A5 JP2000049061A5 (enExample) 2005-10-13

Family

ID=16607112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10211509A Pending JP2000049061A (ja) 1998-07-27 1998-07-27 試料の処理装置及び処理方法

Country Status (1)

Country Link
JP (1) JP2000049061A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004527400A (ja) * 2001-04-10 2004-09-09 エス　オー　イ　テク　シリコン　オン　インシュレータ　テクノロジース 基板の層を切断するための装置及びその方法
JP2014138092A (ja) * 2013-01-17 2014-07-28 Disco Abrasive Syst Ltd 分離装置
WO2025070639A1 (ja) * 2023-09-29 2025-04-03 芝浦メカトロニクス株式会社 基板分離装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004527400A (ja) * 2001-04-10 2004-09-09 エス　オー　イ　テク　シリコン　オン　インシュレータ　テクノロジース 基板の層を切断するための装置及びその方法
JP2014138092A (ja) * 2013-01-17 2014-07-28 Disco Abrasive Syst Ltd 分離装置
WO2025070639A1 (ja) * 2023-09-29 2025-04-03 芝浦メカトロニクス株式会社 基板分離装置

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