JPH11315383A5 - - Google Patents

Info

Publication number
JPH11315383A5
JPH11315383A5 JP1998096974A JP9697498A JPH11315383A5 JP H11315383 A5 JPH11315383 A5 JP H11315383A5 JP 1998096974 A JP1998096974 A JP 1998096974A JP 9697498 A JP9697498 A JP 9697498A JP H11315383 A5 JPH11315383 A5 JP H11315383A5
Authority
JP
Japan
Prior art keywords
plating
zone
substrate
clean
contaminated zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998096974A
Other languages
English (en)
Japanese (ja)
Other versions
JP3830272B2 (ja
JPH11315383A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP09697498A external-priority patent/JP3830272B2/ja
Priority to JP09697498A priority Critical patent/JP3830272B2/ja
Priority to TW087115386A priority patent/TW405158B/zh
Priority to US09/154,895 priority patent/US6294059B1/en
Priority to DE69839066T priority patent/DE69839066T2/de
Priority to KR1019980038368A priority patent/KR100554855B1/ko
Priority to EP98117633A priority patent/EP0903774B1/en
Priority to KR1020007009676A priority patent/KR100597024B1/ko
Priority to TW088103121A priority patent/TW589399B/zh
Priority to PCT/JP1999/000994 priority patent/WO1999045170A1/ja
Priority to US09/623,361 priority patent/US6582580B1/en
Priority to EP99905338A priority patent/EP1061157A4/en
Publication of JPH11315383A publication Critical patent/JPH11315383A/ja
Priority to US09/945,711 priority patent/US6929722B2/en
Priority to US10/786,110 priority patent/US20040163947A1/en
Publication of JPH11315383A5 publication Critical patent/JPH11315383A5/ja
Publication of JP3830272B2 publication Critical patent/JP3830272B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP09697498A 1997-09-17 1998-03-26 基板のめっき装置 Expired - Lifetime JP3830272B2 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP09697498A JP3830272B2 (ja) 1998-03-05 1998-03-26 基板のめっき装置
TW087115386A TW405158B (en) 1997-09-17 1998-09-16 Plating apparatus for semiconductor wafer processing
US09/154,895 US6294059B1 (en) 1997-09-17 1998-09-17 Substrate plating apparatus
DE69839066T DE69839066T2 (de) 1997-09-17 1998-09-17 Vorrichtung zur Substratbeschichtung
KR1019980038368A KR100554855B1 (ko) 1997-09-17 1998-09-17 기판도금장치
EP98117633A EP0903774B1 (en) 1997-09-17 1998-09-17 Substrate plating apparatus
PCT/JP1999/000994 WO1999045170A1 (en) 1998-03-02 1999-03-02 Substrate plating device
TW088103121A TW589399B (en) 1998-03-02 1999-03-02 Apparatus for plating a substrate
KR1020007009676A KR100597024B1 (ko) 1998-03-02 1999-03-02 기판의 도금장치
US09/623,361 US6582580B1 (en) 1998-03-02 1999-03-02 Substrate plating apparatus
EP99905338A EP1061157A4 (en) 1998-03-02 1999-03-02 SUBSTRATE COATING DEVICE
US09/945,711 US6929722B2 (en) 1997-09-17 2001-09-05 Substrate plating apparatus
US10/786,110 US20040163947A1 (en) 1997-09-17 2004-02-26 Substrate plating apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7137098 1998-03-05
JP10-71370 1998-03-05
JP09697498A JP3830272B2 (ja) 1998-03-05 1998-03-26 基板のめっき装置

Publications (3)

Publication Number Publication Date
JPH11315383A JPH11315383A (ja) 1999-11-16
JPH11315383A5 true JPH11315383A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2004-12-24
JP3830272B2 JP3830272B2 (ja) 2006-10-04

Family

ID=26412475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09697498A Expired - Lifetime JP3830272B2 (ja) 1997-09-17 1998-03-26 基板のめっき装置

Country Status (1)

Country Link
JP (1) JP3830272B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4664320B2 (ja) * 2000-03-17 2011-04-06 株式会社荏原製作所 めっき方法
US6824612B2 (en) * 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
DE102004032659B4 (de) * 2004-07-01 2008-10-30 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum chemischen oder elektrolytischen Behandeln von Behandlungsgut sowie die Verwendung der Vorrichtung
JP2008121062A (ja) * 2006-11-10 2008-05-29 Ebara Corp めっき装置及びめっき方法
JP2009263758A (ja) * 2008-04-30 2009-11-12 Ebara Corp 電解めっき装置及び電解めっき方法
US9388504B2 (en) 2013-03-26 2016-07-12 Ebara Corporation Plating apparatus and plating method
JP2015018894A (ja) * 2013-07-10 2015-01-29 株式会社荏原製作所 めっき装置
JP6899042B1 (ja) * 2020-12-28 2021-07-07 株式会社荏原製作所 めっき装置、およびめっき装置の動作制御方法
CN114808090B (zh) * 2022-06-10 2023-06-27 江西勇骏实业有限公司 一种用电设备生产用铜板带双镀机组镀锡设备
CN118843721A (zh) * 2023-08-23 2024-10-25 株式会社荏原制作所 基板处理装置

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