JPH11240919A - 新規なポリマ―及びフォトレジスト組成物 - Google Patents
新規なポリマ―及びフォトレジスト組成物Info
- Publication number
- JPH11240919A JPH11240919A JP10349241A JP34924198A JPH11240919A JP H11240919 A JPH11240919 A JP H11240919A JP 10349241 A JP10349241 A JP 10349241A JP 34924198 A JP34924198 A JP 34924198A JP H11240919 A JPH11240919 A JP H11240919A
- Authority
- JP
- Japan
- Prior art keywords
- group
- substituent
- optionally substituted
- polymer
- photoresist composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/41—Compounds containing sulfur bound to oxygen
- C08K5/42—Sulfonic acids; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1811—C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B29/00—Monoazo dyes prepared by diazotising and coupling
- C09B29/06—Monoazo dyes prepared by diazotising and coupling from coupling components containing amino as the only directing group
- C09B29/08—Amino benzenes
- C09B29/0805—Amino benzenes free of acid groups
- C09B29/0807—Amino benzenes free of acid groups characterised by the amino group
- C09B29/0809—Amino benzenes free of acid groups characterised by the amino group substituted amino group
- C09B29/0811—Amino benzenes free of acid groups characterised by the amino group substituted amino group further substituted alkylamino, alkenylamino, alkynylamino, cycloalkylamino aralkylamino or arylamino
- C09B29/0813—Amino benzenes free of acid groups characterised by the amino group substituted amino group further substituted alkylamino, alkenylamino, alkynylamino, cycloalkylamino aralkylamino or arylamino substituted by OH, O-C(=X)-R, O-C(=X)-X-R, O-R (X being O,S,NR; R being hydrocarbonyl)
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/115—Cationic or anionic
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/963,922 US6057083A (en) | 1997-11-04 | 1997-11-04 | Polymers and photoresist compositions |
| US963922 | 1997-11-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11240919A true JPH11240919A (ja) | 1999-09-07 |
| JPH11240919A5 JPH11240919A5 (OSRAM) | 2005-10-27 |
Family
ID=25507904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10349241A Pending JPH11240919A (ja) | 1997-11-04 | 1998-11-04 | 新規なポリマ―及びフォトレジスト組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6057083A (OSRAM) |
| EP (1) | EP0915382A3 (OSRAM) |
| JP (1) | JPH11240919A (OSRAM) |
| KR (1) | KR19990044985A (OSRAM) |
| TW (1) | TW513620B (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001272783A (ja) * | 1999-10-07 | 2001-10-05 | Shipley Co Llc | フォトレジスト組成物 |
| US7547753B2 (en) | 2002-06-26 | 2009-06-16 | Ashland Licensing And Intellectual Property Llc | Copolymers for avoiding deposits in water supply systems, production and use thereof |
Families Citing this family (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6057083A (en) * | 1997-11-04 | 2000-05-02 | Shipley Company, L.L.C. | Polymers and photoresist compositions |
| JPH11231541A (ja) * | 1998-02-17 | 1999-08-27 | Daicel Chem Ind Ltd | 放射線感光材料及びそれを使用したパターン形成方法 |
| KR100382960B1 (ko) | 1998-07-03 | 2003-05-09 | 닛뽕덴끼 가부시끼가이샤 | 락톤 구조를 갖는 (메트)아크릴레이트 유도체, 중합체,포토레지스트 조성물, 및 이것을 사용한 패턴 형성 방법 |
| CN1190706C (zh) * | 1998-08-26 | 2005-02-23 | 住友化学工业株式会社 | 一种化学增强型正光刻胶组合物 |
| JP4131062B2 (ja) * | 1998-09-25 | 2008-08-13 | 信越化学工業株式会社 | 新規なラクトン含有化合物、高分子化合物、レジスト材料及びパターン形成方法 |
| KR20000047909A (ko) * | 1998-12-10 | 2000-07-25 | 마티네즈 길러모 | 이타콘산 무수물 중합체 및 이를 함유하는 포토레지스트조성물 |
| KR100604780B1 (ko) * | 1999-07-23 | 2006-07-28 | 삼성전자주식회사 | 백본에 지환식 화합물과 아세탈 작용기를 가지는 감광성 폴리머와 이를 포함하는 감광성 코폴리머 |
| US6492086B1 (en) | 1999-10-08 | 2002-12-10 | Shipley Company, L.L.C. | Phenolic/alicyclic copolymers and photoresists |
| JP4991074B2 (ja) * | 2000-02-27 | 2012-08-01 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 光反応性酸発生剤およびそれを含有してなるフォトレジスト |
| US6306554B1 (en) * | 2000-05-09 | 2001-10-23 | Shipley Company, L.L.C. | Polymers containing oxygen and sulfur alicyclic units and photoresist compositions comprising same |
| US6749987B2 (en) * | 2000-10-20 | 2004-06-15 | Fuji Photo Film Co., Ltd. | Positive photosensitive composition |
| JP4554889B2 (ja) | 2001-03-22 | 2010-09-29 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | フォトレジスト組成物 |
| JP4371206B2 (ja) * | 2002-09-30 | 2009-11-25 | 信越化学工業株式会社 | エステル化合物、高分子化合物、レジスト材料、及びパターン形成方法 |
| JP4434762B2 (ja) * | 2003-01-31 | 2010-03-17 | 東京応化工業株式会社 | レジスト組成物 |
| TWI322334B (en) | 2004-07-02 | 2010-03-21 | Rohm & Haas Elect Mat | Method for processing a photoresist composition in an immersion photolithography process and system and organic barrier composition used therein |
| JP4789599B2 (ja) | 2004-12-06 | 2011-10-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | フォトレジスト組成物 |
| EP1691238A3 (en) | 2005-02-05 | 2009-01-21 | Rohm and Haas Electronic Materials, L.L.C. | Coating compositions for use with an overcoated photoresist |
| EP1762895B1 (en) | 2005-08-29 | 2016-02-24 | Rohm and Haas Electronic Materials, L.L.C. | Antireflective Hard Mask Compositions |
| EP1829942B1 (en) | 2006-02-28 | 2012-09-26 | Rohm and Haas Electronic Materials, L.L.C. | Coating compositions for use with an overcoated photoresist |
| TWI485064B (zh) | 2006-03-10 | 2015-05-21 | 羅門哈斯電子材料有限公司 | 用於光微影之組成物及製程 |
| US9244355B2 (en) | 2006-10-30 | 2016-01-26 | Rohm And Haas Electronic Materials, Llc | Compositions and processes for immersion lithography |
| TWI374478B (en) | 2007-02-13 | 2012-10-11 | Rohm & Haas Elect Mat | Electronic device manufacture |
| US20080248331A1 (en) | 2007-04-06 | 2008-10-09 | Rohm And Haas Electronic Materials Llc | Coating composition |
| CN101526737B (zh) | 2007-11-05 | 2014-02-26 | 罗门哈斯电子材料有限公司 | 浸渍平版印刷用组合物和浸渍平版印刷方法 |
| JP2009199061A (ja) | 2007-11-12 | 2009-09-03 | Rohm & Haas Electronic Materials Llc | オーバーコートされたフォトレジストと共に用いるためのコーティング組成物 |
| EP2189847A3 (en) | 2008-11-19 | 2010-07-21 | Rohm and Haas Electronic Materials LLC | Compositions comprising hetero-substituted carbocyclic aryl component and processes for photolithography |
| EP2189845B1 (en) | 2008-11-19 | 2017-08-02 | Rohm and Haas Electronic Materials LLC | Compositions and processes for photolithography |
| EP2784584A1 (en) | 2008-11-19 | 2014-10-01 | Rohm and Haas Electronic Materials LLC | Compositions comprising sulfonamide material and processes for photolithography |
| EP2189846B1 (en) | 2008-11-19 | 2015-04-22 | Rohm and Haas Electronic Materials LLC | Process for photolithography applying a photoresist composition comprising a block copolymer |
| EP2204694A1 (en) | 2008-12-31 | 2010-07-07 | Rohm and Haas Electronic Materials LLC | Compositions and processes for photolithography |
| EP2204392A1 (en) | 2008-12-31 | 2010-07-07 | Rohm and Haas Electronic Materials LLC | Compositions and processes for photolithography |
| EP2216684B1 (en) | 2009-02-08 | 2015-10-07 | Rohm and Haas Electronic Materials LLC | Method of forming a photoresist image comprising an undercoat layer |
| JP5719514B2 (ja) | 2009-02-08 | 2015-05-20 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 上塗りフォトレジストと共に使用するのに好適なコーティング組成物 |
| US9244352B2 (en) | 2009-05-20 | 2016-01-26 | Rohm And Haas Electronic Materials, Llc | Coating compositions for use with an overcoated photoresist |
| US8501383B2 (en) | 2009-05-20 | 2013-08-06 | Rohm And Haas Electronic Materials Llc | Coating compositions for use with an overcoated photoresist |
| JP5814516B2 (ja) | 2009-06-08 | 2015-11-17 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | フォトリソグラフィー方法 |
| US8883407B2 (en) | 2009-06-12 | 2014-11-11 | Rohm And Haas Electronic Materials Llc | Coating compositions suitable for use with an overcoated photoresist |
| US8338077B2 (en) | 2009-06-22 | 2012-12-25 | Rohm And Haas Electronic Materials Llc | Photoacid generators and photoresists comprising same |
| EP2360153B1 (en) | 2009-12-10 | 2015-04-08 | Rohm and Haas Electronic Materials LLC | Photoacid generators and photoresists comprising same |
| CN102212100A (zh) | 2009-12-10 | 2011-10-12 | 罗门哈斯电子材料有限公司 | 胆酸酯光酸发生剂和包含该发生剂的光致抗蚀剂 |
| CN102180822B (zh) | 2009-12-14 | 2014-08-13 | 罗门哈斯电子材料有限公司 | 磺酰光酸产生剂和包含该磺酰光酸产生剂的光刻胶 |
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| JP2011175241A (ja) | 2009-12-15 | 2011-09-08 | Rohm & Haas Electronic Materials Llc | フォトレジストおよびその使用方法 |
| EP2336827B1 (en) | 2009-12-15 | 2015-09-16 | Rohm and Haas Electronic Materials LLC | Method for providing an ion-implanted semiconductor substrate |
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| JP5782283B2 (ja) | 2010-03-31 | 2015-09-24 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 新規のポリマーおよびフォトレジスト組成物 |
| JP5969171B2 (ja) | 2010-03-31 | 2016-08-17 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 光酸発生剤およびこれを含むフォトレジスト |
| EP2383611A3 (en) | 2010-04-27 | 2012-01-25 | Rohm and Haas Electronic Materials LLC | Photoacid generators and photoresists comprising same |
| IL213195A0 (en) | 2010-05-31 | 2011-07-31 | Rohm & Haas Elect Mat | Photoresist compositions and emthods of forming photolithographic patterns |
| JP2012073612A (ja) | 2010-09-14 | 2012-04-12 | Rohm & Haas Electronic Materials Llc | マルチアミド成分を含むフォトレジスト |
| JP6144005B2 (ja) | 2010-11-15 | 2017-06-07 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 糖成分を含む組成物およびフォトリソグラフィ方法 |
| JP2012113302A (ja) | 2010-11-15 | 2012-06-14 | Rohm & Haas Electronic Materials Llc | 塩基反応性成分を含む組成物およびフォトリソグラフィーのための方法 |
| EP2472320A2 (en) | 2010-12-30 | 2012-07-04 | Rohm and Haas Electronic Materials LLC | Compositions comprising base-reactive component and processes for photolithography |
| EP2472327A1 (en) | 2010-12-30 | 2012-07-04 | Rohm and Haas Electronic Materials LLC | Photoresists and methods for use thereof |
| EP2472328B1 (en) | 2010-12-31 | 2013-06-19 | Rohm and Haas Electronic Materials LLC | Coating compositions for use with an overcoated photoresist |
| EP2472329B1 (en) | 2010-12-31 | 2013-06-05 | Rohm and Haas Electronic Materials LLC | Coating compositions for use with an overcoated photoresist |
| US9011591B2 (en) | 2011-09-21 | 2015-04-21 | Dow Global Technologies Llc | Compositions and antireflective coatings for photolithography |
| US9366964B2 (en) | 2011-09-21 | 2016-06-14 | Dow Global Technologies Llc | Compositions and antireflective coatings for photolithography |
| US9541834B2 (en) | 2012-11-30 | 2017-01-10 | Rohm And Haas Electronic Materials Llc | Ionic thermal acid generators for low temperature applications |
| KR101785426B1 (ko) | 2015-04-30 | 2017-10-17 | 롬엔드하스전자재료코리아유한회사 | 포토레지스트 조성물 및 방법 |
| US11480878B2 (en) | 2016-08-31 | 2022-10-25 | Rohm And Haas Electronic Materials Korea Ltd. | Monomers, polymers and photoresist compositions |
| CN108264605A (zh) | 2016-12-30 | 2018-07-10 | 罗门哈斯电子材料韩国有限公司 | 单体、聚合物和光致抗蚀剂组合物 |
| JP6730417B2 (ja) | 2017-12-31 | 2020-07-29 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | フォトレジスト組成物および方法 |
| US11874603B2 (en) | 2021-09-15 | 2024-01-16 | Rohm And Haas Electronic Materials Korea Ltd. | Photoresist composition comprising amide compound and pattern formation methods using the same |
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-
1997
- 1997-11-04 US US08/963,922 patent/US6057083A/en not_active Expired - Fee Related
-
1998
- 1998-09-02 EP EP98116532A patent/EP0915382A3/en not_active Withdrawn
- 1998-09-25 TW TW087115997A patent/TW513620B/zh not_active IP Right Cessation
- 1998-11-04 KR KR1019980047058A patent/KR19990044985A/ko not_active Ceased
- 1998-11-04 JP JP10349241A patent/JPH11240919A/ja active Pending
-
1999
- 1999-06-11 US US09/330,418 patent/US6749983B1/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001272783A (ja) * | 1999-10-07 | 2001-10-05 | Shipley Co Llc | フォトレジスト組成物 |
| US7547753B2 (en) | 2002-06-26 | 2009-06-16 | Ashland Licensing And Intellectual Property Llc | Copolymers for avoiding deposits in water supply systems, production and use thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| US6749983B1 (en) | 2004-06-15 |
| EP0915382A3 (en) | 2000-08-09 |
| KR19990044985A (ko) | 1999-06-25 |
| TW513620B (en) | 2002-12-11 |
| EP0915382A2 (en) | 1999-05-12 |
| US6057083A (en) | 2000-05-02 |
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