JPH11162832A5 - - Google Patents

Info

Publication number
JPH11162832A5
JPH11162832A5 JP1997339349A JP33934997A JPH11162832A5 JP H11162832 A5 JPH11162832 A5 JP H11162832A5 JP 1997339349 A JP1997339349 A JP 1997339349A JP 33934997 A JP33934997 A JP 33934997A JP H11162832 A5 JPH11162832 A5 JP H11162832A5
Authority
JP
Japan
Prior art keywords
sensitive substrate
scanning exposure
exposure method
substrate
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997339349A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11162832A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9339349A priority Critical patent/JPH11162832A/ja
Priority claimed from JP9339349A external-priority patent/JPH11162832A/ja
Priority to US09/196,157 priority patent/US6117598A/en
Publication of JPH11162832A publication Critical patent/JPH11162832A/ja
Publication of JPH11162832A5 publication Critical patent/JPH11162832A5/ja
Pending legal-status Critical Current

Links

JP9339349A 1997-11-25 1997-11-25 走査露光方法及び走査型露光装置 Pending JPH11162832A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9339349A JPH11162832A (ja) 1997-11-25 1997-11-25 走査露光方法及び走査型露光装置
US09/196,157 US6117598A (en) 1997-11-25 1998-11-20 Scanning exposure method with alignment during synchronous movement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9339349A JPH11162832A (ja) 1997-11-25 1997-11-25 走査露光方法及び走査型露光装置

Publications (2)

Publication Number Publication Date
JPH11162832A JPH11162832A (ja) 1999-06-18
JPH11162832A5 true JPH11162832A5 (enExample) 2005-07-14

Family

ID=18326621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9339349A Pending JPH11162832A (ja) 1997-11-25 1997-11-25 走査露光方法及び走査型露光装置

Country Status (2)

Country Link
US (1) US6117598A (enExample)
JP (1) JPH11162832A (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4290499A (en) * 1998-06-29 2000-01-17 Nikon Corporation Scanning exposure method, scanning exposure apparatus and method for producing the same, and device and method for manufacturing the same
JP2000021765A (ja) * 1998-07-03 2000-01-21 Nikon Corp 照明装置及びそれを用いた投影露光装置
JP2000049087A (ja) * 1998-07-28 2000-02-18 Nikon Corp パターン転写方法
JP2000124122A (ja) * 1998-10-19 2000-04-28 Canon Inc 半導体露光装置および同装置を用いるデバイス製造方法
US6558883B2 (en) * 2001-03-08 2003-05-06 Infineon Technologies Ag Apparatus and method for patterning a semiconductor wafer
JP2002334826A (ja) * 2001-05-09 2002-11-22 Canon Inc 露光方法、面位置合わせ方法、露光装置及びデバイス製造方法
US7085673B2 (en) * 2004-08-31 2006-08-01 Hewlett-Packard Development Company, L.P. Displacement estimation system and method
US20080204682A1 (en) * 2005-06-28 2008-08-28 Nikon Corporation Exposure method and exposure apparatus, and device manufacturing method
US8041103B2 (en) * 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
JP2007231324A (ja) * 2006-02-28 2007-09-13 Canon Inc マルチ荷電ビーム加工装置
WO2008086282A2 (en) 2007-01-05 2008-07-17 Kla-Tencor Corporation Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US8213704B2 (en) 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
US7975245B2 (en) 2007-08-20 2011-07-05 Kla-Tencor Corp. Computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects
US8139844B2 (en) 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
KR101623747B1 (ko) 2008-07-28 2016-05-26 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8643835B2 (en) * 2010-07-09 2014-02-04 Kla-Tencor Corporation Active planar autofocus
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
WO2014149197A1 (en) 2013-02-01 2014-09-25 Kla-Tencor Corporation Detecting defects on a wafer using defect-specific and multi-channel information
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
JP6207671B1 (ja) * 2016-06-01 2017-10-04 キヤノン株式会社 パターン形成装置、基板配置方法及び物品の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2580668B2 (ja) * 1988-01-21 1997-02-12 株式会社ニコン 露光方法、露光条件測定方法及ぴパターン測定方法
KR100300618B1 (ko) * 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JP3308063B2 (ja) * 1993-09-21 2002-07-29 株式会社ニコン 投影露光方法及び装置
JP3521543B2 (ja) * 1994-05-18 2004-04-19 株式会社ニコン 走査露光方法及び装置
JP3371406B2 (ja) * 1994-08-26 2003-01-27 株式会社ニコン 走査露光方法
JP3387074B2 (ja) * 1993-12-08 2003-03-17 株式会社ニコン 走査露光方法、及び走査型露光装置
JP3572430B2 (ja) * 1994-11-29 2004-10-06 株式会社ニコン 露光方法及びその装置
JP3437327B2 (ja) * 1995-04-26 2003-08-18 キヤノン株式会社 半導体露光装置の位置決め装置
JP3460131B2 (ja) * 1995-06-29 2003-10-27 株式会社ニコン 投影露光装置
US5737063A (en) * 1995-07-11 1998-04-07 Nikon Corporation Projection exposure apparatus
JP3940824B2 (ja) * 1995-08-14 2007-07-04 株式会社ニコン 荷電粒子線によるパターン転写方法および転写装置
JP3634530B2 (ja) * 1996-02-29 2005-03-30 キヤノン株式会社 位置決め装置および露光装置
JPH09320933A (ja) * 1996-05-28 1997-12-12 Nikon Corp 走査型露光装置
JPH1097987A (ja) * 1996-09-25 1998-04-14 Canon Inc 走査型露光装置および方法
JPH11176746A (ja) * 1997-10-07 1999-07-02 Nikon Corp 走査型露光方法、装置及び素子製造方法
JPH10340853A (ja) * 1997-04-11 1998-12-22 Nikon Corp 走査型露光装置及び露光方法、並びに回路製造方法
JPH10270303A (ja) * 1997-03-24 1998-10-09 Nikon Corp 走査型露光装置及び走査型露光方法

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