JPH11135679A5 - - Google Patents

Info

Publication number
JPH11135679A5
JPH11135679A5 JP1998204002A JP20400298A JPH11135679A5 JP H11135679 A5 JPH11135679 A5 JP H11135679A5 JP 1998204002 A JP1998204002 A JP 1998204002A JP 20400298 A JP20400298 A JP 20400298A JP H11135679 A5 JPH11135679 A5 JP H11135679A5
Authority
JP
Japan
Prior art keywords
connection terminals
device hole
main surface
wiring film
semiconductor package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998204002A
Other languages
English (en)
Japanese (ja)
Other versions
JP3724954B2 (ja
JPH11135679A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP20400298A priority Critical patent/JP3724954B2/ja
Priority claimed from JP20400298A external-priority patent/JP3724954B2/ja
Priority to TW087113727A priority patent/TW466718B/zh
Priority to US09/140,541 priority patent/US6097085A/en
Priority to KR1019980034779A priority patent/KR100308137B1/ko
Publication of JPH11135679A publication Critical patent/JPH11135679A/ja
Publication of JPH11135679A5 publication Critical patent/JPH11135679A5/ja
Application granted granted Critical
Publication of JP3724954B2 publication Critical patent/JP3724954B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP20400298A 1997-08-29 1998-07-17 電子装置および半導体パッケージ Expired - Fee Related JP3724954B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP20400298A JP3724954B2 (ja) 1997-08-29 1998-07-17 電子装置および半導体パッケージ
TW087113727A TW466718B (en) 1997-08-29 1998-08-20 Electronic device and semiconductor package
US09/140,541 US6097085A (en) 1997-08-29 1998-08-26 Electronic device and semiconductor package
KR1019980034779A KR100308137B1 (ko) 1997-08-29 1998-08-27 전자장치및반도체패키지

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23369597 1997-08-29
JP9-233695 1997-08-29
JP20400298A JP3724954B2 (ja) 1997-08-29 1998-07-17 電子装置および半導体パッケージ

Publications (3)

Publication Number Publication Date
JPH11135679A JPH11135679A (ja) 1999-05-21
JPH11135679A5 true JPH11135679A5 (enExample) 2005-04-07
JP3724954B2 JP3724954B2 (ja) 2005-12-07

Family

ID=26514231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20400298A Expired - Fee Related JP3724954B2 (ja) 1997-08-29 1998-07-17 電子装置および半導体パッケージ

Country Status (4)

Country Link
US (1) US6097085A (enExample)
JP (1) JP3724954B2 (enExample)
KR (1) KR100308137B1 (enExample)
TW (1) TW466718B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5719440A (en) * 1995-12-19 1998-02-17 Micron Technology, Inc. Flip chip adaptor package for bare die
US6861290B1 (en) 1995-12-19 2005-03-01 Micron Technology, Inc. Flip-chip adaptor package for bare die
USRE43112E1 (en) 1998-05-04 2012-01-17 Round Rock Research, Llc Stackable ball grid array package
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
US6198166B1 (en) * 1999-07-01 2001-03-06 Intersil Corporation Power semiconductor mounting package containing ball grid array
KR100377471B1 (ko) * 1999-12-10 2003-03-26 앰코 테크놀로지 코리아 주식회사 반도체패키지 및 그 제조방법
JP2002057252A (ja) * 2000-08-07 2002-02-22 Hitachi Ltd 半導体装置及びその製造方法
KR100680731B1 (ko) * 2000-09-01 2007-02-09 삼성전자주식회사 반도체 패키지 및 제조방법
JP2002270717A (ja) * 2001-03-12 2002-09-20 Rohm Co Ltd 半導体装置
US20030218246A1 (en) * 2002-05-22 2003-11-27 Hirofumi Abe Semiconductor device passing large electric current
CN100475004C (zh) * 2003-05-23 2009-04-01 富士通株式会社 布线板制造方法
TWI246760B (en) * 2004-12-22 2006-01-01 Siliconware Precision Industries Co Ltd Heat dissipating semiconductor package and fabrication method thereof
US7851904B2 (en) * 2006-12-06 2010-12-14 Panasonic Corporation Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure
DE102008006390A1 (de) * 2008-01-28 2009-07-30 Tesa Ag Verfahren zur Verklebung von flexiblen Leiterplatten mit Polymermaterialien zur partiellen oder vollständigen Versteifung
US8804339B2 (en) 2011-02-28 2014-08-12 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same
CN102790034A (zh) * 2011-05-17 2012-11-21 飞思卡尔半导体公司 具有散热器的半导体器件
KR101432486B1 (ko) * 2012-10-08 2014-08-21 에스티에스반도체통신 주식회사 집적회로 패키지 제조방법
US20210043466A1 (en) 2019-08-06 2021-02-11 Texas Instruments Incorporated Universal semiconductor package molds

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08213497A (ja) * 1995-02-03 1996-08-20 Fujitsu Ltd 半導体装置及びその製造方法
SG45122A1 (en) * 1995-10-28 1998-01-16 Inst Of Microelectronics Low cost and highly reliable chip-sized package
JPH09181209A (ja) * 1995-12-26 1997-07-11 Hitachi Ltd 半導体装置およびその製造方法
US5760465A (en) * 1996-02-01 1998-06-02 International Business Machines Corporation Electronic package with strain relief means
US5900312A (en) * 1996-11-08 1999-05-04 W. L. Gore & Associates, Inc. Integrated circuit chip package assembly
US5835355A (en) * 1997-09-22 1998-11-10 Lsi Logic Corporation Tape ball grid array package with perforated metal stiffener

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