JPH11123658A - ドレッサ及びドレッシング装置 - Google Patents

ドレッサ及びドレッシング装置

Info

Publication number
JPH11123658A
JPH11123658A JP9306621A JP30662197A JPH11123658A JP H11123658 A JPH11123658 A JP H11123658A JP 9306621 A JP9306621 A JP 9306621A JP 30662197 A JP30662197 A JP 30662197A JP H11123658 A JPH11123658 A JP H11123658A
Authority
JP
Japan
Prior art keywords
dresser
scraper
main body
brush
dressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9306621A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11123658A5 (enExample
Inventor
Toshinari Suzuki
俊成 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Priority to JP9306621A priority Critical patent/JPH11123658A/ja
Priority to US09/134,695 priority patent/US6152813A/en
Publication of JPH11123658A publication Critical patent/JPH11123658A/ja
Publication of JPH11123658A5 publication Critical patent/JPH11123658A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP9306621A 1997-10-21 1997-10-21 ドレッサ及びドレッシング装置 Pending JPH11123658A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9306621A JPH11123658A (ja) 1997-10-21 1997-10-21 ドレッサ及びドレッシング装置
US09/134,695 US6152813A (en) 1997-10-21 1998-08-14 Dresser and dressing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9306621A JPH11123658A (ja) 1997-10-21 1997-10-21 ドレッサ及びドレッシング装置

Publications (2)

Publication Number Publication Date
JPH11123658A true JPH11123658A (ja) 1999-05-11
JPH11123658A5 JPH11123658A5 (enExample) 2005-06-09

Family

ID=17959299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9306621A Pending JPH11123658A (ja) 1997-10-21 1997-10-21 ドレッサ及びドレッシング装置

Country Status (2)

Country Link
US (1) US6152813A (enExample)
JP (1) JPH11123658A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10046893A1 (de) * 2000-09-21 2002-01-31 Wacker Siltronic Halbleitermat Doppelseiten-Polierverfahren mit Tuchkonditionierung
CN110744450A (zh) * 2019-10-21 2020-02-04 西安奕斯伟硅片技术有限公司 一种抛光垫的修整器及修整方法
JP2023012299A (ja) * 2021-07-13 2023-01-25 東京エレクトロン株式会社 洗浄ブラシ、基板加工装置、及び基板加工方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6386963B1 (en) * 1999-10-29 2002-05-14 Applied Materials, Inc. Conditioning disk for conditioning a polishing pad
DE10162597C1 (de) * 2001-12-19 2003-03-20 Wacker Siltronic Halbleitermat Verfahren zur Herstellung beidseitig polierter Halbleiterscheiben
US6821190B1 (en) * 2002-05-06 2004-11-23 Silterra Malaysia Sdn. Bhd. Static pad conditioner
US6764389B1 (en) * 2002-08-20 2004-07-20 Lsi Logic Corporation Conditioning bar assembly having an abrasion member supported on a polycarbonate member
US7170190B1 (en) * 2003-12-16 2007-01-30 Lam Research Corporation Apparatus for oscillating a head and methods for implementing the same
US7033253B2 (en) * 2004-08-12 2006-04-25 Micron Technology, Inc. Polishing pad conditioners having abrasives and brush elements, and associated systems and methods
JP5390750B2 (ja) * 2007-03-30 2014-01-15 ラムバス・インコーポレーテッド 研磨装置、および研磨パッド再生処理方法
JP2010179407A (ja) * 2009-02-05 2010-08-19 Elpida Memory Inc Ｃｍｐ装置
JP2011079076A (ja) * 2009-10-05 2011-04-21 Toshiba Corp 研磨装置及び研磨方法
JP7728108B2 (ja) * 2021-06-23 2025-08-22 株式会社ディスコ 剥離装置
CN113927470A (zh) * 2021-11-10 2022-01-14 中航动力株洲航空零部件制造有限公司 一种高刚度珩磨装置
CN114952452B (zh) * 2022-04-19 2023-09-26 赛莱克斯微系统科技（北京）有限公司 抛光垫修整器、化学机械抛光装置和方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54129891A (en) * 1978-03-30 1979-10-08 Matsushita Electric Ind Co Ltd Semiconductor laser unit
FI73277C (fi) * 1985-10-15 1987-09-10 Lundin Lars Patent Rengoeringsredskapskombination foer rening av strandvatten och strandomraode som nedsmutsats av olja.
US5091753A (en) * 1991-05-13 1992-02-25 Eastman Kodak Company Cleaning apparatus having a surface-conforming blade
JPH04364730A (ja) * 1991-06-12 1992-12-17 Hitachi Ltd 自動ドレッシング装置
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
JP2622069B2 (ja) * 1993-06-30 1997-06-18 三菱マテリアル株式会社 研磨布のドレッシング装置
USD362019S (en) 1993-11-03 1995-09-05 A.T. Cross Company Writing instrument
US5518542A (en) * 1993-11-05 1996-05-21 Tokyo Electron Limited Double-sided substrate cleaning apparatus
JP3044277B2 (ja) * 1994-12-21 2000-05-22 信越半導体株式会社 ウェーハの洗浄及び洗浄乾燥装置
TW316995B (enExample) * 1995-01-19 1997-10-01 Tokyo Electron Co Ltd
JP2887095B2 (ja) * 1995-08-31 1999-04-26 芝浦メカトロニクス株式会社 洗浄装置
US5746302A (en) * 1996-04-02 1998-05-05 Bowman; John H. Apparatus for cleaning conveyors
US5802667A (en) * 1996-09-09 1998-09-08 Paula Steates Duct cleaning device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10046893A1 (de) * 2000-09-21 2002-01-31 Wacker Siltronic Halbleitermat Doppelseiten-Polierverfahren mit Tuchkonditionierung
CN110744450A (zh) * 2019-10-21 2020-02-04 西安奕斯伟硅片技术有限公司 一种抛光垫的修整器及修整方法
CN110744450B (zh) * 2019-10-21 2021-11-26 西安奕斯伟材料科技有限公司 一种抛光垫的修整器及修整方法
JP2023012299A (ja) * 2021-07-13 2023-01-25 東京エレクトロン株式会社 洗浄ブラシ、基板加工装置、及び基板加工方法

Also Published As

Publication number Publication date
US6152813A (en) 2000-11-28

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