JPH11123658A5 - - Google Patents
Info
- Publication number
- JPH11123658A5 JPH11123658A5 JP1997306621A JP30662197A JPH11123658A5 JP H11123658 A5 JPH11123658 A5 JP H11123658A5 JP 1997306621 A JP1997306621 A JP 1997306621A JP 30662197 A JP30662197 A JP 30662197A JP H11123658 A5 JPH11123658 A5 JP H11123658A5
- Authority
- JP
- Japan
- Prior art keywords
- dresser
- dresser body
- scraper
- brush
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9306621A JPH11123658A (ja) | 1997-10-21 | 1997-10-21 | ドレッサ及びドレッシング装置 |
| US09/134,695 US6152813A (en) | 1997-10-21 | 1998-08-14 | Dresser and dressing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9306621A JPH11123658A (ja) | 1997-10-21 | 1997-10-21 | ドレッサ及びドレッシング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11123658A JPH11123658A (ja) | 1999-05-11 |
| JPH11123658A5 true JPH11123658A5 (enExample) | 2005-06-09 |
Family
ID=17959299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9306621A Pending JPH11123658A (ja) | 1997-10-21 | 1997-10-21 | ドレッサ及びドレッシング装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6152813A (enExample) |
| JP (1) | JPH11123658A (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6386963B1 (en) * | 1999-10-29 | 2002-05-14 | Applied Materials, Inc. | Conditioning disk for conditioning a polishing pad |
| DE10046893A1 (de) * | 2000-09-21 | 2002-01-31 | Wacker Siltronic Halbleitermat | Doppelseiten-Polierverfahren mit Tuchkonditionierung |
| DE10162597C1 (de) * | 2001-12-19 | 2003-03-20 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung beidseitig polierter Halbleiterscheiben |
| US6821190B1 (en) * | 2002-05-06 | 2004-11-23 | Silterra Malaysia Sdn. Bhd. | Static pad conditioner |
| US6764389B1 (en) * | 2002-08-20 | 2004-07-20 | Lsi Logic Corporation | Conditioning bar assembly having an abrasion member supported on a polycarbonate member |
| US7170190B1 (en) * | 2003-12-16 | 2007-01-30 | Lam Research Corporation | Apparatus for oscillating a head and methods for implementing the same |
| US7033253B2 (en) * | 2004-08-12 | 2006-04-25 | Micron Technology, Inc. | Polishing pad conditioners having abrasives and brush elements, and associated systems and methods |
| JP5390750B2 (ja) * | 2007-03-30 | 2014-01-15 | ラムバス・インコーポレーテッド | 研磨装置、および研磨パッド再生処理方法 |
| JP2010179407A (ja) * | 2009-02-05 | 2010-08-19 | Elpida Memory Inc | Cmp装置 |
| JP2011079076A (ja) * | 2009-10-05 | 2011-04-21 | Toshiba Corp | 研磨装置及び研磨方法 |
| CN110744450B (zh) * | 2019-10-21 | 2021-11-26 | 西安奕斯伟材料科技有限公司 | 一种抛光垫的修整器及修整方法 |
| JP7728108B2 (ja) * | 2021-06-23 | 2025-08-22 | 株式会社ディスコ | 剥離装置 |
| JP7680125B2 (ja) * | 2021-07-13 | 2025-05-20 | 東京エレクトロン株式会社 | 洗浄ブラシ、基板加工装置、及び基板加工方法 |
| CN113927470A (zh) * | 2021-11-10 | 2022-01-14 | 中航动力株洲航空零部件制造有限公司 | 一种高刚度珩磨装置 |
| CN114952452B (zh) * | 2022-04-19 | 2023-09-26 | 赛莱克斯微系统科技(北京)有限公司 | 抛光垫修整器、化学机械抛光装置和方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54129891A (en) * | 1978-03-30 | 1979-10-08 | Matsushita Electric Ind Co Ltd | Semiconductor laser unit |
| FI73277C (fi) * | 1985-10-15 | 1987-09-10 | Lundin Lars Patent | Rengoeringsredskapskombination foer rening av strandvatten och strandomraode som nedsmutsats av olja. |
| US5091753A (en) * | 1991-05-13 | 1992-02-25 | Eastman Kodak Company | Cleaning apparatus having a surface-conforming blade |
| JPH04364730A (ja) * | 1991-06-12 | 1992-12-17 | Hitachi Ltd | 自動ドレッシング装置 |
| US5427644A (en) * | 1993-01-11 | 1995-06-27 | Tokyo Seimitsu Co., Ltd. | Method of manufacturing semiconductor wafer and system therefor |
| JP2622069B2 (ja) * | 1993-06-30 | 1997-06-18 | 三菱マテリアル株式会社 | 研磨布のドレッシング装置 |
| USD362019S (en) | 1993-11-03 | 1995-09-05 | A.T. Cross Company | Writing instrument |
| US5518542A (en) * | 1993-11-05 | 1996-05-21 | Tokyo Electron Limited | Double-sided substrate cleaning apparatus |
| JP3044277B2 (ja) * | 1994-12-21 | 2000-05-22 | 信越半導体株式会社 | ウェーハの洗浄及び洗浄乾燥装置 |
| TW316995B (enExample) * | 1995-01-19 | 1997-10-01 | Tokyo Electron Co Ltd | |
| JP2887095B2 (ja) * | 1995-08-31 | 1999-04-26 | 芝浦メカトロニクス株式会社 | 洗浄装置 |
| US5746302A (en) * | 1996-04-02 | 1998-05-05 | Bowman; John H. | Apparatus for cleaning conveyors |
| US5802667A (en) * | 1996-09-09 | 1998-09-08 | Paula Steates | Duct cleaning device |
-
1997
- 1997-10-21 JP JP9306621A patent/JPH11123658A/ja active Pending
-
1998
- 1998-08-14 US US09/134,695 patent/US6152813A/en not_active Expired - Fee Related
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