JPH10511726A - エレクトロニクス用感圧接着テープ - Google Patents
エレクトロニクス用感圧接着テープInfo
- Publication number
- JPH10511726A JPH10511726A JP8520961A JP52096196A JPH10511726A JP H10511726 A JPH10511726 A JP H10511726A JP 8520961 A JP8520961 A JP 8520961A JP 52096196 A JP52096196 A JP 52096196A JP H10511726 A JPH10511726 A JP H10511726A
- Authority
- JP
- Japan
- Prior art keywords
- vinyl
- acrylate
- antistatic
- adhesive
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/122—Ionic conductors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/18—Spheres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/54—Inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
- C08L31/02—Homopolymers or copolymers of esters of monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S83/00—Cutting
- Y10S83/906—Chip making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.対向する面を有する柔軟な基材から成るウェーハダイシングテープとして 使用するのに適した耐水性、帯電防止感圧接着テープであって、少なくとも1つ の表面は、ポリエチレンオキシド、ポリフェニレンオキシド、硫化ポリフェニレ ン、硫化ポリエチレン、ポリエチレンイミン、ポリプロピレンオキシド、ポリブ チレンオキシド、硫化ポリブチレンおよびポリブチレンイミンから成る群から選 択された高分子電解質系ポリマーとアルカリ金属の塩類およびアルカリ土類金属 の塩類から成る群から選択された少なくとも1種のイオン塩で形成されたイオン 伝導性物質をその上に担持した表面を有する微粒子を含む、着脱可能な、アジリ ジン架橋微粒子接着剤を担持し、前記微粒子の平均直径は少なくとも1μmであ り、前記接着剤のスチールに対する接着力は約0.5ニュートン/100mm(N/ 100mm)〜約10N/100mmである、感圧接着テープ。 2.ペンタエリトリトール-トリス-(β-(N-アジリジニル)プロピオネート)、 トリメチロールプロパン-トリス-(β-(N-アジリジニル)プロピオネート)、トリ メチロールプロパン-トリス-(β-(N-メチルアジリジニル)プロピオネート)およ びそれらの混合物から選択されたアジリジン架橋剤を含む、請求項1に記載の耐 水性帯電防止粒状感圧接着剤。 3.前記微粒子接着剤は、 a)少なくとも1種のアルキル(メタ)アクリレートエステルまたはビニ ルエステルを少なくとも70部と、 b)相応じて、モノマー100部とするための、少なくとも1種の極性モ ノマーを最高30重量部と、 を含むモノマーのポリマーを含み、 かつ前記イオン伝導性物質は、高分子電解質系ポリマーから形成された高分子電 解質、0.1部から10部の量で加えられた前記高分子電解質系ポリマー、高分 子電解質基本単位1モル当たり0.01モルから10モルの少なくとも1種のア ルカリ金属塩またはアルカリ土類金属塩を含む、請求項1に記載の帯電防止感圧 接着テープ。 4.高分子電解質系ポリマーはポリエチレンオキシドである、請求項1に記載 の帯電防止粒状感圧接着剤。 5.前記イオン塩類は、LiCl、LiNO3、LiCF3SO3、LiSO4、 LiOH、KOH、NaSCN、NaI、BaSO3CF3、LiN(SO2CF3 )2、およびNH4OHから成る群から選択される、請求項3に記載の帯電防止感 圧接着テープ。 6.前記モノマーは、 a)少なくとも1種のアルキル(メタ)アクリレートエステルまたはビニ ルエステルを少なくとも85重量部と、 b)相応じて、モノマー100部とするための、少なくとも1種の極性モ ノマーを最高15重量部と、 を含み、 前記イオン伝導性物質は、0.1部から10部の高分子電解質系ポリマー高分子 電解質と、高分子電解質基本単位1モル当たり0.01モルから10モルの少な くとも1種のアルカリ金属塩またはアルカリ土類金属塩を含む、 請求項3に記載の帯電防止感圧接着テープ。 7.アルキル(メタ)アクリレートは、イソオクチル(メタ)アクリレート、 2-エチレルヘキシル(メタ)アクリレート、イソノニル(メタ)アクリレート、 イソアミル(メタ)アクリレート、イソデシル(メタ)アクリレート、およびブ チル(メタ)アクリレートから成る群から選択される、請求項8に記載の帯電防 止感圧先着テ ープ。 8.ビニルエステルは、ビニル2-エチルヘキサノエート、ビニルカプロエート 、ビニルラウレート、ビニルペラルゴネート、ビニルヘキサノエート、ビニルプ ロピオネート、ビニルデカノエート、およびビニルオクタノエートから成る群か ら選択される、請求項6に記載の帯電防止感圧接着テープ。 9.前記極性モノマーは、N-ビニル-2-ピロリドン、N-ビニルカプロラクタ ム、アクリロニトリル、ビニルアクリレート、ジアリルフタレート、アクリル酸 、メタクリル酸、イタコン酸、ヒドロキシアルキルアクリレート類、シアノアル キルアクリレート類、アクリルアミド類、置換アクリルアミド類から成る群から 選択される請求項6に記載の帯電防止感圧接着テープ。 10.前記柔軟な基材は、(ポリ)塩化ビニリジエン、ポリエステル類、ポリ エチレンテレフタレート、硫化ポリフェニレン、ポリプロピレン、ポリエチレン 、ポリエーテルイミド、ポリエーテルスルホンから成る群から選択される請求項 1に記載の帯電防止感圧接着テープ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/365,748 US5508107A (en) | 1993-07-28 | 1994-12-29 | Pressure-sensitive adhesive tapes for electronics applications |
US08/365,748 | 1994-12-29 | ||
PCT/US1995/014486 WO1996020983A1 (en) | 1994-12-29 | 1995-11-08 | Pressure-sensitive adhesive tapes for electronics applications |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10511726A true JPH10511726A (ja) | 1998-11-10 |
JP3537143B2 JP3537143B2 (ja) | 2004-06-14 |
Family
ID=23440183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52096196A Expired - Fee Related JP3537143B2 (ja) | 1994-12-29 | 1995-11-08 | エレクトロニクス用感圧接着テープ |
Country Status (5)
Country | Link |
---|---|
US (1) | US5508107A (ja) |
EP (1) | EP0800560B1 (ja) |
JP (1) | JP3537143B2 (ja) |
DE (1) | DE69505275T2 (ja) |
WO (1) | WO1996020983A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002235055A (ja) * | 2001-02-13 | 2002-08-23 | Nitto Denko Corp | ダイシング用粘着シート |
JP2002285134A (ja) * | 2001-03-26 | 2002-10-03 | Sumitomo Bakelite Co Ltd | 半導体加工用粘着シート |
JP2005306937A (ja) * | 2004-04-19 | 2005-11-04 | Nitto Denko Corp | 粘着剤組成物、および粘着シート類 |
JP2006045475A (ja) * | 2004-08-09 | 2006-02-16 | Nitto Denko Corp | 粘着剤組成物、粘着シート類および表面保護フィルム |
JP2011038108A (ja) * | 2010-09-28 | 2011-02-24 | Nitto Denko Corp | 粘着剤組成物、粘着シート類および表面保護フィルム |
CN110075934A (zh) * | 2019-03-25 | 2019-08-02 | 绍兴钠钇光电有限公司 | 一种3d打印微流控器件及其大通量制备单分散乳液的方法 |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997008260A1 (en) * | 1995-08-22 | 1997-03-06 | Minnesota Mining And Manufacturing Company | Optically clear antistatic pressure-sensitive adhesive film |
JP4256481B2 (ja) * | 1997-02-14 | 2009-04-22 | リンテック株式会社 | 粘着剤組成物およびその利用方法 |
US5885708A (en) * | 1997-02-14 | 1999-03-23 | Minnesota Mining And Manufacturing Company | Antistatic latex adhesives |
WO1999029795A1 (en) * | 1997-12-05 | 1999-06-17 | Minnesota Mining And Manufacturing Company | Optically clear antistatic pressure-sensitive adhesive film |
JP2001323228A (ja) * | 2000-05-15 | 2001-11-22 | Nitto Denko Corp | 加熱剥離型粘着シート |
US20050158475A1 (en) * | 2000-11-09 | 2005-07-21 | David Bell | Films and compositions |
KR100902463B1 (ko) * | 2001-07-30 | 2009-06-11 | 산꼬 가가꾸 고교 가부시끼가이샤 | 제전성 조성물 및 그 제조방법 |
US20030091777A1 (en) * | 2001-08-14 | 2003-05-15 | Peter Jones | Clean release tape for EMI shielding |
EP1546279A1 (en) * | 2002-09-26 | 2005-06-29 | Surface Specialties, S.A. | Removable, water-whitening resistant pressure sensitive adhesives |
JP2005314579A (ja) * | 2004-04-30 | 2005-11-10 | Nitto Denko Corp | 粘着剤組成物、および粘着シート類 |
JP4562070B2 (ja) * | 2004-05-14 | 2010-10-13 | 日東電工株式会社 | 粘着剤組成物、粘着シート類、および表面保護フィルム |
US20080166523A1 (en) * | 2007-01-04 | 2008-07-10 | Asahi Kasei Chemicals Corporation | Tab leader tape made of polyphenylene ether-based resin |
KR100694445B1 (ko) * | 2004-08-24 | 2007-03-12 | 주식회사 엘지화학 | 대전 방지 성능을 갖는 아크릴계 점착제 조성물 |
JP4531628B2 (ja) | 2004-09-16 | 2010-08-25 | 日東電工株式会社 | 粘着剤組成物、粘着シート類、および表面保護フィルム |
JP4917267B2 (ja) * | 2004-09-16 | 2012-04-18 | 日東電工株式会社 | 粘着剤組成物、粘着シート類、および表面保護フィルム |
US7750075B2 (en) * | 2004-10-21 | 2010-07-06 | Lg Chem, Ltd. | Acrylic pressure sensitive adhesive with good antistatic property |
KR100784991B1 (ko) * | 2005-06-10 | 2007-12-11 | 주식회사 엘지화학 | 아크릴계 점착제 조성물 |
JP5259940B2 (ja) * | 2005-09-05 | 2013-08-07 | 日東電工株式会社 | 粘着剤組成物、粘着シートおよび表面保護フィルム |
KR100830814B1 (ko) * | 2005-10-14 | 2008-05-20 | 주식회사 엘지화학 | 아크릴계 점착제 조성물 |
US20070117259A1 (en) * | 2005-11-18 | 2007-05-24 | Semiconductor Components Industries, Llc. | Semiconductor component and method of manufacture |
FR2895118B1 (fr) * | 2005-12-15 | 2008-06-13 | Arjowiggins Security Soc Par A | Film de pelliculage incorporant une puce |
MXPA06010596A (es) * | 2005-12-23 | 2007-06-22 | 3M Innovative Properties Co | Pelicula adhesiva con resistencia a altas temperaturas y baja generacion de electrostatica, construida con un polimero de polieterimida. |
US7645827B2 (en) * | 2006-03-08 | 2010-01-12 | 3M Innovative Properties Company | High shear pressure-sensitive adhesive |
US7531595B2 (en) * | 2006-03-08 | 2009-05-12 | 3M Innovative Properties Company | Pressure-sensitive adhesive containing silica nanoparticles |
KR100995510B1 (ko) * | 2007-01-16 | 2010-11-19 | 주식회사 엘지화학 | 가소제를 포함하는 아크릴계 점착제 조성물 |
US7393901B1 (en) | 2007-02-16 | 2008-07-01 | 3M Innovative Properties Company | Acrylate adhesives containing silica nanoparticles crosslinked with polyfunctional aziridines |
US20080200587A1 (en) * | 2007-02-16 | 2008-08-21 | 3M Innovative Properties Company | Pressure-sensitive adhesive containing acicular silica particles crosslinked with polyfunctional aziridines |
KR101114354B1 (ko) * | 2008-07-01 | 2012-06-12 | 주식회사 엘지화학 | 광학부재용 아크릴계 조성물,광학부재용 보호필름,편광판 및 액정표시장치 |
JP5623020B2 (ja) | 2009-02-27 | 2014-11-12 | 日東電工株式会社 | 粘着剤組成物、粘着剤層、及び、粘着シート |
KR101550516B1 (ko) * | 2011-05-18 | 2015-09-04 | 헥시온 인코포레이티드 | 감압 접착제 공중합체 조성물 |
JP2013014734A (ja) * | 2011-07-06 | 2013-01-24 | Nitto Denko Corp | 導電性粘着テープ |
WO2018181478A1 (ja) * | 2017-03-28 | 2018-10-04 | 日東電工株式会社 | インセル型液晶パネルおよび液晶表示装置 |
DE102020206126A1 (de) * | 2020-05-14 | 2021-11-18 | Tesa Se | Haftklebriger Elektrolyt |
US11157790B1 (en) * | 2020-08-31 | 2021-10-26 | Christian Smilynov | System and method for transferring an EMV chip from a first card to a second card |
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US3104985A (en) * | 1959-01-06 | 1963-09-24 | Cabot Corp | Conducting polymer compositions |
US3497383A (en) * | 1967-08-22 | 1970-02-24 | Minnesota Mining & Mfg | Electrically conductive adhesive tape |
US3691140A (en) * | 1970-03-09 | 1972-09-12 | Spencer Ferguson Silver | Acrylate copolymer microspheres |
US4098945A (en) * | 1973-07-30 | 1978-07-04 | Minnesota Mining And Manufacturing Company | Soft conductive materials |
US4471037A (en) * | 1982-04-16 | 1984-09-11 | United Kingdom Atomic Energy Authority | Solid state electrochemical cell |
US4606962A (en) * | 1983-06-13 | 1986-08-19 | Minnesota Mining And Manufacturing Company | Electrically and thermally conductive adhesive transfer tape |
FR2568574B1 (fr) * | 1984-07-31 | 1986-12-12 | Comp Generale Electricite | Polymere conducteur ionique et electrolyte solide en faisant application |
US4548862A (en) * | 1984-09-04 | 1985-10-22 | Minnesota Mining And Manufacturing Company | Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer |
DE8434291U1 (de) * | 1984-11-23 | 1986-03-27 | Beiersdorf Ag, 2000 Hamburg | Klebeband |
JPS61272279A (ja) * | 1985-05-29 | 1986-12-02 | Sekisui Chem Co Ltd | 粘着テ−プもしくはシ−ト |
JPS6312681A (ja) * | 1986-07-02 | 1988-01-20 | Sekisui Chem Co Ltd | 帯電防止粘着テ−プもしくはシ−ト |
JPS6341570A (ja) * | 1986-08-06 | 1988-02-22 | Nippon Paint Co Ltd | 電着塗料組成物 |
US4920187A (en) * | 1987-01-12 | 1990-04-24 | Nippon Paint Co., Ltd. | Process for preparing particles having monodisperse particle size |
DE3701757A1 (de) * | 1987-01-22 | 1988-08-04 | Henkel Kgaa | Haftkleber |
IT1236512B (it) * | 1989-10-06 | 1993-03-11 | Eniricerche Spa | Elettrolita polimerico solido a base poliepossidica. |
IE67319B1 (en) * | 1989-10-11 | 1996-03-20 | Waterford Res & Dev Ltd | Antistatic adhesive tape |
TW226406B (ja) * | 1991-04-12 | 1994-07-11 | Minnesota Mining & Mfg | |
US5378405A (en) * | 1993-07-28 | 1995-01-03 | Minnesota Mining And Manufacturing Company | Conductive microparticles and pressure-sensitive adhesive tapes made therefrom |
-
1994
- 1994-12-29 US US08/365,748 patent/US5508107A/en not_active Expired - Lifetime
-
1995
- 1995-11-08 DE DE69505275T patent/DE69505275T2/de not_active Expired - Lifetime
- 1995-11-08 EP EP95939818A patent/EP0800560B1/en not_active Expired - Lifetime
- 1995-11-08 WO PCT/US1995/014486 patent/WO1996020983A1/en active IP Right Grant
- 1995-11-08 JP JP52096196A patent/JP3537143B2/ja not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002235055A (ja) * | 2001-02-13 | 2002-08-23 | Nitto Denko Corp | ダイシング用粘着シート |
JP4674836B2 (ja) * | 2001-02-13 | 2011-04-20 | 日東電工株式会社 | ダイシング用粘着シート |
JP2002285134A (ja) * | 2001-03-26 | 2002-10-03 | Sumitomo Bakelite Co Ltd | 半導体加工用粘着シート |
JP2005306937A (ja) * | 2004-04-19 | 2005-11-04 | Nitto Denko Corp | 粘着剤組成物、および粘着シート類 |
JP4420389B2 (ja) * | 2004-04-19 | 2010-02-24 | 日東電工株式会社 | 粘着剤組成物、および粘着シート類 |
JP2006045475A (ja) * | 2004-08-09 | 2006-02-16 | Nitto Denko Corp | 粘着剤組成物、粘着シート類および表面保護フィルム |
JP4627163B2 (ja) * | 2004-08-09 | 2011-02-09 | 日東電工株式会社 | 粘着剤組成物、粘着シート類および表面保護フィルム |
JP2011038108A (ja) * | 2010-09-28 | 2011-02-24 | Nitto Denko Corp | 粘着剤組成物、粘着シート類および表面保護フィルム |
CN110075934A (zh) * | 2019-03-25 | 2019-08-02 | 绍兴钠钇光电有限公司 | 一种3d打印微流控器件及其大通量制备单分散乳液的方法 |
CN110075934B (zh) * | 2019-03-25 | 2021-06-01 | 绍兴钠钇光电有限公司 | 一种3d打印微流控器件及其大通量制备单分散乳液的方法 |
Also Published As
Publication number | Publication date |
---|---|
JP3537143B2 (ja) | 2004-06-14 |
DE69505275D1 (de) | 1998-11-12 |
EP0800560B1 (en) | 1998-10-07 |
US5508107A (en) | 1996-04-16 |
WO1996020983A1 (en) | 1996-07-11 |
DE69505275T2 (de) | 1999-06-02 |
EP0800560A1 (en) | 1997-10-15 |
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