JPH10303260A5 - - Google Patents

Info

Publication number
JPH10303260A5
JPH10303260A5 JP1998126808A JP12680898A JPH10303260A5 JP H10303260 A5 JPH10303260 A5 JP H10303260A5 JP 1998126808 A JP1998126808 A JP 1998126808A JP 12680898 A JP12680898 A JP 12680898A JP H10303260 A5 JPH10303260 A5 JP H10303260A5
Authority
JP
Japan
Prior art keywords
semiconductor devices
testing
probe card
probe
force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998126808A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10303260A (ja
JP4308938B2 (ja
Filing date
Publication date
Priority claimed from US08/844,577 external-priority patent/US6127831A/en
Application filed filed Critical
Publication of JPH10303260A publication Critical patent/JPH10303260A/ja
Publication of JPH10303260A5 publication Critical patent/JPH10303260A5/ja
Application granted granted Critical
Publication of JP4308938B2 publication Critical patent/JP4308938B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP12680898A 1997-04-21 1998-04-21 プローブ先端パラメータの自動測定による半導体素子の検査方法 Expired - Fee Related JP4308938B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US844577 1986-03-27
US08/844,577 US6127831A (en) 1997-04-21 1997-04-21 Method of testing a semiconductor device by automatically measuring probe tip parameters

Publications (3)

Publication Number Publication Date
JPH10303260A JPH10303260A (ja) 1998-11-13
JPH10303260A5 true JPH10303260A5 (enExample) 2005-10-20
JP4308938B2 JP4308938B2 (ja) 2009-08-05

Family

ID=25293118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12680898A Expired - Fee Related JP4308938B2 (ja) 1997-04-21 1998-04-21 プローブ先端パラメータの自動測定による半導体素子の検査方法

Country Status (2)

Country Link
US (1) US6127831A (enExample)
JP (1) JP4308938B2 (enExample)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5345170A (en) 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US6380751B2 (en) 1992-06-11 2002-04-30 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US5561377A (en) 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6002263A (en) 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6777966B1 (en) * 1999-07-30 2004-08-17 International Test Solutions, Inc. Cleaning system, device and method
US7202683B2 (en) * 1999-07-30 2007-04-10 International Test Solutions Cleaning system, device and method
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
US6970634B2 (en) * 2001-05-04 2005-11-29 Cascade Microtech, Inc. Fiber optic wafer probe
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US6836135B2 (en) 2001-08-31 2004-12-28 Cascade Microtech, Inc. Optical testing device
US6777964B2 (en) 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
US6815963B2 (en) 2002-05-23 2004-11-09 Cascade Microtech, Inc. Probe for testing a device under test
JP3574444B2 (ja) * 2002-08-27 2004-10-06 沖電気工業株式会社 プローブの接触抵抗測定方法及び半導体デバイスの試験方法
US6847219B1 (en) 2002-11-08 2005-01-25 Cascade Microtech, Inc. Probe station with low noise characteristics
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7250779B2 (en) 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US6861856B2 (en) 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
AU2003214771A1 (en) * 2003-02-05 2004-08-30 Systems On Silicon Manufacturing Co. Pte. Ltd. A method for detecting and monitoring wafer probing process instability
AU2003214772A1 (en) * 2003-02-05 2004-08-30 Systems On Silicon Manufacturing Co. Pte. Ltd. Probe card needle cleaning frequency optimization
US6720789B1 (en) 2003-02-13 2004-04-13 International Business Machines Corporation Method for wafer test and wafer test system for implementing the method
US8466703B2 (en) * 2003-03-14 2013-06-18 Rudolph Technologies, Inc. Probe card analysis system and method
US7221172B2 (en) 2003-05-06 2007-05-22 Cascade Microtech, Inc. Switched suspended conductor and connection
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7129733B2 (en) * 2003-12-02 2006-10-31 Intel Corporation Dynamic overdrive compensation test system and method
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
JP4134940B2 (ja) * 2004-04-22 2008-08-20 トヨタ自動車株式会社 パフォーマンスボードの診断方法と診断装置
US7176705B2 (en) 2004-06-07 2007-02-13 Cascade Microtech, Inc. Thermal optical chuck
US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
JP4980903B2 (ja) 2004-07-07 2012-07-18 カスケード マイクロテック インコーポレイテッド 膜懸垂プローブを具えるプローブヘッド
JP2008512680A (ja) 2004-09-13 2008-04-24 カスケード マイクロテック インコーポレイテッド 両面プロービング構造体
US7084648B2 (en) * 2004-09-29 2006-08-01 Agere Systems Inc. Semiconductor testing
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
WO2006137979A2 (en) 2005-06-13 2006-12-28 Cascade Microtech, Inc. Wideband active-passive differential signal probe
KR100647538B1 (ko) 2005-07-12 2006-11-23 (주)피프러스 디캡핑된 반도체 칩 테스트용 프로브 시스템
WO2007146285A2 (en) 2006-06-09 2007-12-21 Cascade Microtech, Inc. Differential signal probe with integral balun
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
WO2008079307A1 (en) * 2006-12-19 2008-07-03 Rudolph Technologies, Inc. Probe card analysis system and method
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
US8838408B2 (en) 2010-11-11 2014-09-16 Optimal Plus Ltd Misalignment indication decision system and method
JP2013064678A (ja) * 2011-09-20 2013-04-11 Renesas Electronics Corp 半導体集積回路装置の製造方法
US10281518B2 (en) 2014-02-25 2019-05-07 Formfactor Beaverton, Inc. Systems and methods for on-wafer dynamic testing of electronic devices
US9915699B2 (en) * 2014-09-17 2018-03-13 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out pillar probe system
CN105629151A (zh) * 2015-12-16 2016-06-01 珠海市运泰利自动化设备有限公司 精密测试探针模组
DE102016106508B9 (de) * 2016-04-08 2018-01-11 Infineon Technologies Ag Verfahren und Vorrichtung zur Waferprüfung
KR102430476B1 (ko) * 2016-05-09 2022-08-08 세메스 주식회사 프로브 카드 관리 방법
TWI631346B (zh) * 2017-03-10 2018-08-01 穩懋半導體股份有限公司 探針機及探針尖端位置定位和獲得探針與清針紙接觸資訊的方法
CN115469203B (zh) * 2022-09-05 2023-09-19 上海泽丰半导体科技有限公司 一种探针卡行程测量系统和方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3628144A (en) * 1969-01-15 1971-12-14 Ibm Electrical contact cleaning device
US4195259A (en) * 1978-04-04 1980-03-25 Texas Instruments Incorporated Multiprobe test system and method of using same
US4590422A (en) * 1981-07-30 1986-05-20 Pacific Western Systems, Inc. Automatic wafer prober having a probe scrub routine
US4673839A (en) * 1986-09-08 1987-06-16 Tektronix, Inc. Piezoelectric pressure sensing apparatus for integrated circuit testing stations
US4918374A (en) * 1988-10-05 1990-04-17 Applied Precision, Inc. Method and apparatus for inspecting integrated circuit probe cards
US5065092A (en) * 1990-05-14 1991-11-12 Triple S Engineering, Inc. System for locating probe tips on an integrated circuit probe card and method therefor
JPH04364746A (ja) * 1991-06-12 1992-12-17 Tokyo Electron Yamanashi Kk プローブ装置
JP3188935B2 (ja) * 1995-01-19 2001-07-16 東京エレクトロン株式会社 検査装置
US5561377A (en) * 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
JP3429995B2 (ja) * 1997-11-10 2003-07-28 東京エレクトロン株式会社 クリーニング方法

Similar Documents

Publication Publication Date Title
JPH10303260A5 (enExample)
US6794889B2 (en) Unified apparatus and method to assure probe card-to-wafer parallelism in semiconductor automatic wafer test, probe card measurement systems, and probe card manufacturing
JP4435328B2 (ja) 基板の試験方法
EP2492636A3 (en) Method of calibrating a scanning system
JP3800394B2 (ja) プローブカード解析及びスクラブマーク解析データを最適化するための方法
US6198280B1 (en) Eddy current flexible field probe deployed through a loading platform
CN117450883B (zh) 一种垂直探针快速测量方法
JP2767291B2 (ja) 検査装置
JPH01227448A (ja) ウエハプローバ
JP3995800B2 (ja) 半導体装置の検査方法
JPS5821838A (ja) ウエハテストシステム
JPH01227450A (ja) ウエハプローバ
JPH0555321A (ja) 半導体装置およびその試験方法
CN117968933A (zh) 一种基于三点弯曲法钢丝绳张力测试仪的校准方法
JPH01227449A (ja) ウエハプローバ
JPH0783041B2 (ja) 半導体装置の検査装置及びその検査方法
JPH0364942A (ja) 半導体装置のウェハープロービング装置
JPS5831549A (ja) 半導体素子検査装置
JPS63207144A (ja) プロ−ブ装置
JPS60116144A (ja) 集積回路のプロ−プ試験方法
JPS60249344A (ja) 半導体装置の検査装置
JPH0964127A (ja) ウェーハプロービングマシン
JPH04299549A (ja) ウエハプローバ装置
JPH0714358U (ja) 芯金付ゴムローラのゴム硬度測定治具
JPH06101496B2 (ja) 半導体デバイスの試験測定装置