JP4308938B2 - プローブ先端パラメータの自動測定による半導体素子の検査方法 - Google Patents

プローブ先端パラメータの自動測定による半導体素子の検査方法 Download PDF

Info

Publication number
JP4308938B2
JP4308938B2 JP12680898A JP12680898A JP4308938B2 JP 4308938 B2 JP4308938 B2 JP 4308938B2 JP 12680898 A JP12680898 A JP 12680898A JP 12680898 A JP12680898 A JP 12680898A JP 4308938 B2 JP4308938 B2 JP 4308938B2
Authority
JP
Japan
Prior art keywords
probe tip
probe
force
inspecting
semiconductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP12680898A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10303260A5 (enExample
JPH10303260A (ja
Inventor
テオドア・アンドリュ−・ホーリー
ラウン・エル・グッディ
ラリー・ジェイ・バストス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
NXP USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JPH10303260A publication Critical patent/JPH10303260A/ja
Publication of JPH10303260A5 publication Critical patent/JPH10303260A5/ja
Application granted granted Critical
Publication of JP4308938B2 publication Critical patent/JP4308938B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/316—Testing of analog circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
JP12680898A 1997-04-21 1998-04-21 プローブ先端パラメータの自動測定による半導体素子の検査方法 Expired - Fee Related JP4308938B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US844577 1986-03-27
US08/844,577 US6127831A (en) 1997-04-21 1997-04-21 Method of testing a semiconductor device by automatically measuring probe tip parameters

Publications (3)

Publication Number Publication Date
JPH10303260A JPH10303260A (ja) 1998-11-13
JPH10303260A5 JPH10303260A5 (enExample) 2005-10-20
JP4308938B2 true JP4308938B2 (ja) 2009-08-05

Family

ID=25293118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12680898A Expired - Fee Related JP4308938B2 (ja) 1997-04-21 1998-04-21 プローブ先端パラメータの自動測定による半導体素子の検査方法

Country Status (2)

Country Link
US (1) US6127831A (enExample)
JP (1) JP4308938B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105629151A (zh) * 2015-12-16 2016-06-01 珠海市运泰利自动化设备有限公司 精密测试探针模组

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6380751B2 (en) 1992-06-11 2002-04-30 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US5345170A (en) 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US5561377A (en) 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6002263A (en) 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US7202683B2 (en) * 1999-07-30 2007-04-10 International Test Solutions Cleaning system, device and method
US6777966B1 (en) * 1999-07-30 2004-08-17 International Test Solutions, Inc. Cleaning system, device and method
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
US6970634B2 (en) * 2001-05-04 2005-11-29 Cascade Microtech, Inc. Fiber optic wafer probe
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
WO2003020467A1 (en) 2001-08-31 2003-03-13 Cascade Microtech, Inc. Optical testing device
US6777964B2 (en) 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
JP2005527823A (ja) 2002-05-23 2005-09-15 カスケード マイクロテック インコーポレイテッド デバイスのテスト用プローブ
JP3574444B2 (ja) * 2002-08-27 2004-10-06 沖電気工業株式会社 プローブの接触抵抗測定方法及び半導体デバイスの試験方法
US6847219B1 (en) 2002-11-08 2005-01-25 Cascade Microtech, Inc. Probe station with low noise characteristics
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7250779B2 (en) 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US6861856B2 (en) 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
US7642798B2 (en) * 2003-02-05 2010-01-05 Systems On Silicon Manufacturing Co. Pte. Ltd. Probe card needle cleaning frequency optimization
US7230439B2 (en) * 2003-02-05 2007-06-12 Systems On Silicon Manufacturing Co. Pte. Ltd. Method for detecting and monitoring wafer probing process instability
US6720789B1 (en) 2003-02-13 2004-04-13 International Business Machines Corporation Method for wafer test and wafer test system for implementing the method
US8466703B2 (en) * 2003-03-14 2013-06-18 Rudolph Technologies, Inc. Probe card analysis system and method
US7221172B2 (en) 2003-05-06 2007-05-22 Cascade Microtech, Inc. Switched suspended conductor and connection
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
WO2006017078A2 (en) 2004-07-07 2006-02-16 Cascade Microtech, Inc. Probe head having a membrane suspended probe
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7129733B2 (en) * 2003-12-02 2006-10-31 Intel Corporation Dynamic overdrive compensation test system and method
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
WO2005065258A2 (en) 2003-12-24 2005-07-21 Cascade Microtech, Inc. Active wafer probe
JP4134940B2 (ja) * 2004-04-22 2008-08-20 トヨタ自動車株式会社 パフォーマンスボードの診断方法と診断装置
US7176705B2 (en) 2004-06-07 2007-02-13 Cascade Microtech, Inc. Thermal optical chuck
US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
KR20070058522A (ko) 2004-09-13 2007-06-08 캐스케이드 마이크로테크 인코포레이티드 양측 프루빙 구조
US7084648B2 (en) * 2004-09-29 2006-08-01 Agere Systems Inc. Semiconductor testing
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
EP1932003A2 (en) 2005-06-13 2008-06-18 Cascade Microtech, Inc. Wideband active-passive differential signal probe
KR100647538B1 (ko) 2005-07-12 2006-11-23 (주)피프러스 디캡핑된 반도체 칩 테스트용 프로브 시스템
DE112007001399T5 (de) 2006-06-09 2009-05-07 Cascade Microtech, Inc., Beaverton Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
KR101516828B1 (ko) 2006-12-19 2015-05-07 루돌프 테크놀로지스 인코퍼레이티드 프로브 카드 분석 시스템 및 방법
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
US8838408B2 (en) 2010-11-11 2014-09-16 Optimal Plus Ltd Misalignment indication decision system and method
JP2013064678A (ja) * 2011-09-20 2013-04-11 Renesas Electronics Corp 半導体集積回路装置の製造方法
US10281518B2 (en) * 2014-02-25 2019-05-07 Formfactor Beaverton, Inc. Systems and methods for on-wafer dynamic testing of electronic devices
US9915699B2 (en) * 2014-09-17 2018-03-13 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out pillar probe system
DE102016106508B9 (de) * 2016-04-08 2018-01-11 Infineon Technologies Ag Verfahren und Vorrichtung zur Waferprüfung
KR102430476B1 (ko) * 2016-05-09 2022-08-08 세메스 주식회사 프로브 카드 관리 방법
TWI631346B (zh) * 2017-03-10 2018-08-01 穩懋半導體股份有限公司 探針機及探針尖端位置定位和獲得探針與清針紙接觸資訊的方法
CN115469203B (zh) * 2022-09-05 2023-09-19 上海泽丰半导体科技有限公司 一种探针卡行程测量系统和方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3628144A (en) * 1969-01-15 1971-12-14 Ibm Electrical contact cleaning device
US4195259A (en) * 1978-04-04 1980-03-25 Texas Instruments Incorporated Multiprobe test system and method of using same
US4590422A (en) * 1981-07-30 1986-05-20 Pacific Western Systems, Inc. Automatic wafer prober having a probe scrub routine
US4673839A (en) * 1986-09-08 1987-06-16 Tektronix, Inc. Piezoelectric pressure sensing apparatus for integrated circuit testing stations
US4918374A (en) * 1988-10-05 1990-04-17 Applied Precision, Inc. Method and apparatus for inspecting integrated circuit probe cards
US5065092A (en) * 1990-05-14 1991-11-12 Triple S Engineering, Inc. System for locating probe tips on an integrated circuit probe card and method therefor
JPH04364746A (ja) * 1991-06-12 1992-12-17 Tokyo Electron Yamanashi Kk プローブ装置
JP3188935B2 (ja) * 1995-01-19 2001-07-16 東京エレクトロン株式会社 検査装置
US5561377A (en) * 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
JP3429995B2 (ja) * 1997-11-10 2003-07-28 東京エレクトロン株式会社 クリーニング方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105629151A (zh) * 2015-12-16 2016-06-01 珠海市运泰利自动化设备有限公司 精密测试探针模组

Also Published As

Publication number Publication date
JPH10303260A (ja) 1998-11-13
US6127831A (en) 2000-10-03

Similar Documents

Publication Publication Date Title
JP4308938B2 (ja) プローブ先端パラメータの自動測定による半導体素子の検査方法
US7504844B2 (en) Inspection apparatus and method
JP4099412B2 (ja) 半導体集積回路装置の製造方法
KR100196195B1 (ko) 프로우브 카드
US7583098B2 (en) Automated probe card planarization and alignment methods and tools
KR100657105B1 (ko) 프로브 방법 및 장치
WO2007089543A2 (en) Active probe contact array management
KR101032959B1 (ko) 웨이퍼 프로버의 니들 클리너 위치제어장치 및 위치제어방법
US6690284B2 (en) Method of controlling IC handler and control system using the same
JP4313827B2 (ja) 球状外部電極を有する半導体装置の検査方法
US20080265920A1 (en) Probe card
CN114994511A (zh) 一种邦定测试器、邦定测试方法和邦定测试装置
JP2005044825A (ja) プローバー装置及びその探針高さ調整方法、半導体装置の製造方法
US6720789B1 (en) Method for wafer test and wafer test system for implementing the method
EP4357793B1 (en) Tilt calibration for probe systems
JP5015672B2 (ja) プローブカード
CN116973602A (zh) 针压装置、半导体测试设备及其测试方法
JP2006128452A (ja) プローブカード及びプローバー装置、半導体装置の製造方法
CN117288987A (zh) 用于芯片测试的插座组件以及芯片测试系统
JPH08330368A (ja) 半導体回路装置群及びそのプローブ試験方法
CN220982920U (zh) 集成电路推力检测装置
KR102469594B1 (ko) 반도체 검사장비 모듈 강성 측정용 지그
JP2006128451A (ja) プローバー装置及びその探針メンテナンス方法、半導体装置の製造方法
JP5443791B2 (ja) 荷重検出センサおよび荷重検出センサの製造方法
SE2251043A1 (en) Microstructure inspection device and system and use of the same

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20040927

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050421

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050624

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080205

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20080507

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20080512

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20080604

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20080609

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080702

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081007

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20090107

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20090113

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090406

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090428

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090507

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120515

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120515

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130515

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140515

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees