JPH10261646A5 - - Google Patents

Info

Publication number
JPH10261646A5
JPH10261646A5 JP1997066789A JP6678997A JPH10261646A5 JP H10261646 A5 JPH10261646 A5 JP H10261646A5 JP 1997066789 A JP1997066789 A JP 1997066789A JP 6678997 A JP6678997 A JP 6678997A JP H10261646 A5 JPH10261646 A5 JP H10261646A5
Authority
JP
Japan
Prior art keywords
insulating film
wiring
spacer
insulating
spacer region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997066789A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10261646A (ja
JP4010425B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP06678997A priority Critical patent/JP4010425B2/ja
Priority claimed from JP06678997A external-priority patent/JP4010425B2/ja
Publication of JPH10261646A publication Critical patent/JPH10261646A/ja
Publication of JPH10261646A5 publication Critical patent/JPH10261646A5/ja
Application granted granted Critical
Publication of JP4010425B2 publication Critical patent/JP4010425B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP06678997A 1997-03-19 1997-03-19 半導体装置及びその製造方法 Expired - Lifetime JP4010425B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06678997A JP4010425B2 (ja) 1997-03-19 1997-03-19 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06678997A JP4010425B2 (ja) 1997-03-19 1997-03-19 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JPH10261646A JPH10261646A (ja) 1998-09-29
JPH10261646A5 true JPH10261646A5 (cg-RX-API-DMAC7.html) 2004-12-02
JP4010425B2 JP4010425B2 (ja) 2007-11-21

Family

ID=13325986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06678997A Expired - Lifetime JP4010425B2 (ja) 1997-03-19 1997-03-19 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP4010425B2 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044294A (ja) * 1999-08-02 2001-02-16 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2001332633A (ja) * 2000-05-24 2001-11-30 Sony Corp 半導体メモリ
JP4530552B2 (ja) * 2001-01-29 2010-08-25 富士通セミコンダクター株式会社 半導体装置及びその製造方法

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