JPH1012994A - 導電性回路を有する成形品の製造方法 - Google Patents

導電性回路を有する成形品の製造方法

Info

Publication number
JPH1012994A
JPH1012994A JP16343696A JP16343696A JPH1012994A JP H1012994 A JPH1012994 A JP H1012994A JP 16343696 A JP16343696 A JP 16343696A JP 16343696 A JP16343696 A JP 16343696A JP H1012994 A JPH1012994 A JP H1012994A
Authority
JP
Japan
Prior art keywords
electroless plating
circuit
active
plating solution
thermoplastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16343696A
Other languages
English (en)
Japanese (ja)
Inventor
Makoto Katsumata
信 勝亦
Hidenori Yamanashi
秀則 山梨
Hitoshi Ushijima
均 牛島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP16343696A priority Critical patent/JPH1012994A/ja
Priority to DE1997126850 priority patent/DE19726850B8/de
Publication of JPH1012994A publication Critical patent/JPH1012994A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP16343696A 1996-06-24 1996-06-24 導電性回路を有する成形品の製造方法 Pending JPH1012994A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP16343696A JPH1012994A (ja) 1996-06-24 1996-06-24 導電性回路を有する成形品の製造方法
DE1997126850 DE19726850B8 (de) 1996-06-24 1997-06-24 Verfahren zur Herstellung von Leiterplatten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16343696A JPH1012994A (ja) 1996-06-24 1996-06-24 導電性回路を有する成形品の製造方法

Publications (1)

Publication Number Publication Date
JPH1012994A true JPH1012994A (ja) 1998-01-16

Family

ID=15773862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16343696A Pending JPH1012994A (ja) 1996-06-24 1996-06-24 導電性回路を有する成形品の製造方法

Country Status (2)

Country Link
JP (1) JPH1012994A (de)
DE (1) DE19726850B8 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007048906A (ja) * 2005-08-09 2007-02-22 Sankyo Kasei Co Ltd 成形回路部品の製造方法
US7211207B2 (en) 2002-05-22 2007-05-01 Hitachi Maxell, Ltd. Injection molding method with surface modification
KR101259641B1 (ko) 2006-07-25 2013-04-30 엘지전자 주식회사 인쇄회로기판의 성형방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2171355B (en) * 1985-02-22 1989-11-22 Kollmorgen Tech Corp Molded articles suitable for adherent metallization, molded metallized articles and processes for making the same
IN167760B (de) * 1986-08-15 1990-12-15 Kollmorgen Tech Corp
JPH0196384A (ja) * 1987-10-08 1989-04-14 Seiko Instr & Electron Ltd 透明導電膜パターン上へのめっき方法
JPH0284790A (ja) * 1988-09-21 1990-03-26 Hitachi Chem Co Ltd 導電性回路を有する成形品の製造法
JPH05125235A (ja) * 1991-11-01 1993-05-21 Kanegafuchi Chem Ind Co Ltd 熱可塑性樹脂組成物
JPH0673264A (ja) * 1992-06-26 1994-03-15 Polyplastics Co ポリエステル樹脂組成物及びその製造法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7211207B2 (en) 2002-05-22 2007-05-01 Hitachi Maxell, Ltd. Injection molding method with surface modification
JP2008143185A (ja) * 2002-05-22 2008-06-26 Hitachi Maxell Ltd 成形品
US7763195B2 (en) 2002-05-22 2010-07-27 Hitachi Maxell, Ltd. Injection molding method with surface modification
JP4522447B2 (ja) * 2002-05-22 2010-08-11 日立マクセル株式会社 成形品の製造方法
JP2007048906A (ja) * 2005-08-09 2007-02-22 Sankyo Kasei Co Ltd 成形回路部品の製造方法
JP4537911B2 (ja) * 2005-08-09 2010-09-08 三共化成株式会社 成形回路部品の製造方法
KR101259641B1 (ko) 2006-07-25 2013-04-30 엘지전자 주식회사 인쇄회로기판의 성형방법

Also Published As

Publication number Publication date
DE19726850B4 (de) 2005-12-08
DE19726850B8 (de) 2006-04-13
DE19726850A1 (de) 1998-01-29

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Legal Events

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Effective date: 20030218