JPH1012994A - Manufacture of molded product provided with conductive circuit - Google Patents
Manufacture of molded product provided with conductive circuitInfo
- Publication number
- JPH1012994A JPH1012994A JP16343696A JP16343696A JPH1012994A JP H1012994 A JPH1012994 A JP H1012994A JP 16343696 A JP16343696 A JP 16343696A JP 16343696 A JP16343696 A JP 16343696A JP H1012994 A JPH1012994 A JP H1012994A
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- circuit
- active
- plating solution
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、導電性回路を有す
る成形品の製造方法に関する。[0001] The present invention relates to a method for producing a molded article having a conductive circuit.
【０００２】[0002]
【従来の技術】プラスチック基材の表面に導電性回路を
有する成形品の製造方法として、特開平１−９６３８４
号公報には、プラスチック基材の表面を回路形成部分を
残してマスキングした後、該回路形成部分を活性化して
触媒溶液に浸漬し、そのあとで無電解めっきを行う方法
が開示されている。この方法は印刷配線板や可撓性印刷
配線板（ＰＣＢ，ＦＰＣ）の二次元的な回路が対象であ
り、製造工程数が多く複雑である。一方、化学的ＣＶＤ
法や物理的ＰＶＤ法による蒸着方法もあるが、真空処理
装置や前処理装置のために多額の設備費用がかかり、イ
ニシャルコストが高くなる。2. Description of the Related Art Japanese Patent Laid-Open Publication No.
Japanese Patent Application Laid-Open Publication No. H11-157, discloses a method in which after masking the surface of a plastic substrate while leaving a circuit forming portion, the circuit forming portion is activated and immersed in a catalyst solution, and then electroless plating is performed. This method is intended for a two-dimensional circuit of a printed wiring board or a flexible printed wiring board (PCB, FPC), and has many manufacturing steps and is complicated. Meanwhile, chemical CVD
There are also a vapor deposition method and a physical PVD method, but a large amount of equipment cost is required for a vacuum processing device and a pre-processing device, and the initial cost is high.
【０００３】また、特開平１−９６３８４号、同２−８
４７９０号公報には、無電解めっき液に対して活性な
（触媒的な）樹脂と不活性な樹脂を２ショットで成形
し、無電解めっきによって回路を形成する方法が開示さ
れている。しかし、これらの方法は無電解めっき処理に
長時間を要し、１μｍのめっき層を形成するのに数時間
かかる。図３は成形過程を示す模式的な断面図である。
（Ａ）において、１１は無電解めっき液に対して活性な
樹脂、１２は不活性な樹脂を示し、活性な樹脂１１には
触媒性充填材（例えば粉末ケイ酸アルミニウム粘土上に
パラジウム触媒を分散させたもの）１３が添加されてい
る。（Ｂ）は無電解めっきによりめっき層１４が活性な
樹脂１１の露出面に形成された状態を示しているが、め
っき層１４と活性な樹脂１１との間にアンカー効果がな
いために、めっきの密着性が劣る。Further, Japanese Patent Application Laid-Open Nos. 1-96384 and 2-8
No. 4790 discloses a method in which a resin active (catalytic) and an inactive resin for an electroless plating solution are molded in two shots, and a circuit is formed by electroless plating. However, these methods require a long time for the electroless plating process, and it takes several hours to form a 1 μm plating layer. FIG. 3 is a schematic sectional view showing a forming process.
In (A), reference numeral 11 denotes a resin active with respect to the electroless plating solution, 12 denotes an inactive resin, and the active resin 11 contains a catalytic filler (for example, a palladium catalyst dispersed on powdered aluminum silicate clay). 13) was added. (B) shows a state in which the plating layer 14 is formed on the exposed surface of the active resin 11 by electroless plating. However, since there is no anchor effect between the plating layer 14 and the active resin 11, Is inferior in adhesion.
【０００４】[0004]
【発明が解決しようとする課題】本発明は従来公知技術
の有する上記問題に着目してなされたものであり、無電
解めっきの処理時間が短くて密着性もよく、三次元的構
造の成形品に対しても容易に適用できる導電性回路を有
する成形品の製造方法を提供することを課題とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems of the prior art, and has a short processing time of electroless plating, good adhesion, and a molded article having a three-dimensional structure. It is an object of the present invention to provide a method for manufacturing a molded article having a conductive circuit which can be easily applied to a molded product.
【０００５】[0005]
【課題を解決するための手段】本発明の導電性回路を有
する成形品の製造方法は、請求項１に記載のように、無
電解めっき液に対して不活性な材料と活性な材料を用
い、第１の段階で活性な材料で成形を行い、その成形品
をインサートして第２段階で不活性な材料で成形して最
終の成形品とし、無電解めっきを行って最終成形品の表
面に回路パターンとして露出させた活性な材料の部分に
選択的に導体を形成する成形品の製造方法において、無
電解めっき液に対して活性な材料として、オレフィン系
熱可塑性樹脂１００重量部、ポリエステル系熱可塑性樹
脂１０〜３０重量部および無電解めっきに活性な触媒２
〜１０重量部からなる組成物を使用することを特徴とす
る。According to a first aspect of the present invention, there is provided a method of manufacturing a molded article having a conductive circuit, comprising the steps of using a material which is inert to an electroless plating solution and an active material. In the first step, molding is performed with an active material, the molded article is inserted and molded in an inactive material in a second step to form a final molded article, and the surface of the final molded article is subjected to electroless plating. In a method of manufacturing a molded article in which a conductor is selectively formed on a portion of an active material exposed as a circuit pattern, 100 parts by weight of an olefin-based thermoplastic resin and a polyester-based material are used as an active material for an electroless plating solution. 10 to 30 parts by weight of thermoplastic resin and catalyst 2 active for electroless plating
It is characterized by using a composition consisting of 10 to 10 parts by weight.
【０００６】本発明において、無電解めっき液に対して
活性な材料として使用する組成物の中で、オレフィン系
熱可塑性樹脂としてはポリエチレン、ポリプロピレン、
ポリブチレンおよびそれらの組み合わせから成る群から
選ばれ、好ましくはポリエチレンを用いる。ポリエステ
ル系熱可塑性樹脂としては、ポリエステル、ポリエチレ
ンテレフタレート、ポリブチレンテレフタレートおよび
それらの組み合わせから成る群から選ばれ、好ましくは
ポリエステルを用いる。また、無電解めっきに活性な触
媒としては、通常無電解めっきに用いられるパラジウ
ム、白金などの１０族(IUPAC) 金属またはその化合が好
適である。また、無電解めっき液に対して不活性な材料
としては、ポリスルホン、ポリエーテルスルホン、ポリ
アリールスルホン、ポリエーテルイミド、アクリロニト
リルブタジエンスルホン等のエンジニャリングプラスチ
ックが用いられる。In the present invention, among the compositions used as active materials for the electroless plating solution, polyethylene, polypropylene,
It is selected from the group consisting of polybutylene and combinations thereof, and preferably uses polyethylene. The polyester-based thermoplastic resin is selected from the group consisting of polyester, polyethylene terephthalate, polybutylene terephthalate, and combinations thereof, and polyester is preferably used. Further, as a catalyst active in electroless plating, a Group 10 (IUPAC) metal such as palladium and platinum usually used for electroless plating or a compound thereof is suitable. Further, as a material inert to the electroless plating solution, an engineering plastic such as polysulfone, polyether sulfone, polyaryl sulfone, polyether imide, acrylonitrile butadiene sulfone, or the like is used.
【０００７】上記組成物において、ポリエステル系熱可
塑性樹脂はオレフィン系熱可塑性樹脂のもつ耐久性（老
化）を向上させる効果があり、オレフィン系熱可塑性樹
脂１００重量部に対して１０重量部よりも少ないと、効
果がなくなり、また３０重量部を越えると、多くなり過
ぎ、逆に成形性が低下する。また、無電解めっきに活性
な触媒がオレフィン系熱可塑性樹脂１００重量部に対し
て２重量部より少ないと、いわゆる分散濃度が低いため
に導体の乗りおよび密着性が悪く、１０重量部を越えて
も密着性がそれ程向上せず、経済的でない。In the above composition, the polyester-based thermoplastic resin has an effect of improving the durability (aging) of the olefin-based thermoplastic resin, and is less than 10 parts by weight based on 100 parts by weight of the olefin-based thermoplastic resin. When the amount exceeds 30 parts by weight, the effect becomes too large, and conversely, the moldability decreases. On the other hand, when the amount of the catalyst active in electroless plating is less than 2 parts by weight based on 100 parts by weight of the olefin-based thermoplastic resin, the so-called dispersion concentration is low, so that the conductor rides and adheres poorly, and exceeds 10 parts by weight. However, the adhesion is not so improved, and it is not economical.
【０００８】本発明において、導電性回路を有する成形
品の製造に際しては、第１段階として無電解めっき液に
活性な材料を用いて射出成形などの既知の成形手段によ
り表面に所望の回路パターンを有する回路基体を形成
し、第２段階として前記回路基体を成形金型内にインサ
ートし、無電解めっき液に不活性な材料を用いて前記回
路パターンが露出するように被覆部を形成した最終成形
品を製作する。次いで、この最終成形品を必要に応じて
脱脂洗浄した後、無電解めっき液に浸漬する。無電解め
っき液はエンプレートＣｕ５１００等の市販品を好適に
使用することができる。無電解めっき液の温度は通常２
０〜２５℃、浸漬時間は５〜１０分の範囲が好適である
が、これは臨界的なものではなく、無電解めっき液の組
成や濃度、被めっき面積などにより適宜変更することが
できる。In the present invention, when a molded article having a conductive circuit is manufactured, as a first step, a desired circuit pattern is formed on the surface by a known molding means such as injection molding using an active material for an electroless plating solution. Final molding in which a circuit substrate having the above is formed, and as a second step, the circuit substrate is inserted into a molding die, and a coating portion is formed using a material inert to an electroless plating solution so that the circuit pattern is exposed. Make goods. Next, the final molded product is degreased and washed as necessary, and then immersed in an electroless plating solution. As the electroless plating solution, a commercially available product such as Enplate Cu5100 can be suitably used. The temperature of the electroless plating solution is usually 2
The immersion time is preferably in the range of 0 to 25 ° C. and the immersion time is in the range of 5 to 10 minutes. However, the immersion time is not critical, and can be appropriately changed depending on the composition and concentration of the electroless plating solution, the area to be plated, and the like.
【０００９】本発明によれば、前処理や後処理が簡単で
工程数が少なく、従って、無電解めっき処理に要する時
間が短く、生産性の大巾な向上を図ることができる。According to the present invention, the pre-processing and post-processing are simple, the number of steps is small, the time required for the electroless plating processing is short, and the productivity can be greatly improved.
【００１０】[0010]
【発明の実施の形態】図１において、１は回路基体であ
り、無電解めっき液に活性な材料を第１のショットで射
出成形したものであり、表面に所望のパターンを有する
回路形成部２が突出して設けられている。３は被覆部で
あり、回路基体１をインサートして無電解めっき液に不
活性な材料を第２のショットで射出成形したものであ
り、上記回路形成部２が表面に露出するように形成さ
れ、最終成形品Ｐ0 が得られる。図２（Ａ）は最終成形
品Ｐ0 の要部の拡大断面図であり、回路基体１の回路形
成部２と被覆部３は面一に形成され、無電解めっき液に
活性な材料から成る回路基体１には該めっき液に活性な
触媒４が分散している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, reference numeral 1 denotes a circuit substrate, which is obtained by injection molding an active material in an electroless plating solution by a first shot, and has a circuit forming portion 2 having a desired pattern on the surface. Are provided to protrude. Numeral 3 denotes a coating portion, which is formed by inserting a circuit base 1 into the electroless plating solution and injecting an inert material into the electroless plating solution by a second shot, and formed so that the circuit forming portion 2 is exposed on the surface. , final molded article P 0 is obtained. 2 (A) is an enlarged sectional view of a main portion of the final molded article P 0, circuit formation portions 2 and the cover portions of the circuit substrate 1 is formed flush, made of active material in an electroless plating solution An active catalyst 4 is dispersed in the circuit board 1 in the plating solution.
【００１１】この最終成形品Ｐ0 を通常の方法に従って
脱脂洗浄等の必要な前処理を行った後、無電解めっき液
に浸漬すると、露出した回路形成部２の表面が該めっき
液により加水分解されて表面が荒れ、図２（Ｂ）のよう
に表面に多数の細孔５が生じて活性化され、図２（Ｃ）
のように回路を構成するめっき層６が形成される。この
めっき層６は、上記活性化によりめっきが速くてのりや
すく、さらにそのめっき成分（銅）が細孔５内にも析出
するので、一種のアンカー効果を発揮し、良好な密着性
が得られる。The final molded product P 0 is subjected to necessary pretreatment such as degreasing and washing in accordance with a usual method, and then immersed in an electroless plating solution, whereby the exposed surface of the circuit forming portion 2 is hydrolyzed by the plating solution. As a result, the surface is roughened, and a large number of pores 5 are generated on the surface as shown in FIG.
The plating layer 6 constituting the circuit is formed as described above. The plating layer 6 can be plated quickly and easily by the above-mentioned activation, and furthermore, its plating component (copper) is precipitated also in the pores 5, so that it exerts a kind of anchor effect and obtains good adhesion. .
【００１２】（試験例）無電解めっき液に活性な材料と
して、ポリエチレン１００重量部、ポリエチレンテレフ
タレート２０重量部、１０％パラジウム／Ｃ５重量部か
ら成る組成物を用いて、第１のショットで図１のような
回路基板１を射出成形し、第２のショットで無電解めっ
き液に不活性な材料としてポリスルホンを用いて被覆部
３を形成して最終成形品Ｐ0 とした。最終成形品Ｐ0 の
寸法は、２００mm×２００mm×４０mm、回路形成部２の
巾１０mm、突出高さ５mmである。この最終成形品Ｐ0 を
脱脂洗浄した後、次の条件で無電解めっきを行った。 無電解めっき液： 硫酸銅（II）５水和物 ７ｇ／Ｌ 酒石酸ナトリウムカリウム４水和物 ２０ｇ／Ｌ 水酸化ナトリウム ５ｇ／Ｌ 炭酸ナトリウム１０水和物 ２ｇ／Ｌ ホルムアルデヒド３５％水溶液 ５ml／Ｌ めっき液温度： ２５±２℃ めっき液量： 回路面積２０cm2 につきめっき液１
Ｌ 浸漬時間： ５〜１０分 以上の結果、厚さ１μｍの均一で密着性良好なめっき層
（導電性回路）を有する成形品が５〜１０分という短時
間で得られた。Test Example As a material active in the electroless plating solution, a composition comprising 100 parts by weight of polyethylene, 20 parts by weight of polyethylene terephthalate, and 5 parts by weight of 10% palladium / C was used, and FIG. the circuit board 1 by injection molding, such as, polysulfone to form a coating portion 3 using as the final molded article P 0 in an electroless plating solution in the second shot as inert material. Dimensions of the final molded product P 0 is, 200mm × 200mm × 40mm, width of the circuit forming section 2 10 mm, a protrusion height 5 mm. After degreasing the final molded article P 0, it was electroless plating under the following conditions. Electroless plating solution: copper sulfate (II) pentahydrate 7 g / L sodium potassium tartrate tetrahydrate 20 g / L sodium hydroxide 5 g / L sodium carbonate decahydrate 2 g / L formaldehyde 35% aqueous solution 5 ml / L plating Solution temperature: 25 ± 2 ° C Plating solution volume: 1 plating solution per 20 cm 2 of circuit area
L Immersion time: 5 to 10 minutes As a result, a molded product having a plating layer (conductive circuit) with a uniform thickness of 1 μm and good adhesion was obtained in a short time of 5 to 10 minutes.
【００１３】[0013]
【発明の効果】以上説明したように、本発明方法によれ
ば、真空蒸着装置などの高価な装置が要らず、従来の成
形装置と無電解めっき浴をそのまま使用して、無電解め
っきを短時間で行うことができ、密着性の良好なめっき
層が得られる。As described above, according to the method of the present invention, an expensive apparatus such as a vacuum evaporation apparatus is not required, and a conventional molding apparatus and an electroless plating bath are used as they are, thereby shortening the electroless plating. It can be performed in a short time, and a plating layer having good adhesion can be obtained.
【図１】本発明方法の説明図である。FIG. 1 is an explanatory diagram of the method of the present invention.
【図２】（Ａ）ないし（Ｃ）はそれぞれ本発明による成
形品の形成過程を示す断面図である。FIGS. 2A to 2C are cross-sectional views each showing a process of forming a molded article according to the present invention.
【図３】（Ａ），（Ｂ）はそれぞれ従来方法による成形
品の形成過程を示す断面図である。FIGS. 3A and 3B are cross-sectional views each showing a process of forming a molded product by a conventional method.
１ 回路基体 ２ 回路形成部 ３ 被覆部 ４ 触媒 ５ 細孔 ６ めっき層 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Circuit formation part 3 Coating part 4 Catalyst 5 Pores 6 Plating layer
Claims (3)
活性な材料を用い、第１の段階で活性な材料で成形を行
い、その成形品をインサートして第２段階で不活性な材
料で成形して最終の成形品とし、無電解めっきを行って
最終成形品の表面に回路パターンとして露出させた活性
な材料の部分に選択的に導体を形成する成形品の製造方
法において、 無電解めっき液に対して活性な材料として、オレフィン
系熱可塑性樹脂１００重量部、ポリエステル系熱可塑性
樹脂１０〜３０重量部および無電解めっき液に活性な触
媒２〜１０重量部からなる組成物を使用することを特徴
とする導電性回路を有する成形品の製造方法。An inactive material and an active material with respect to an electroless plating solution are used for molding in an active material in a first stage, and the molded product is inserted in an inactive in a second stage. In a method of manufacturing a molded article in which a conductor is selectively formed on a portion of the active material exposed as a circuit pattern on the surface of the final molded article by performing electroless plating by forming a final molded article by molding with a material, A composition comprising 100 parts by weight of an olefin-based thermoplastic resin, 10 to 30 parts by weight of a polyester-based thermoplastic resin, and 2 to 10 parts by weight of an active catalyst for an electroless plating solution is used as an active material for an electrolytic plating solution. A method for producing a molded article having a conductive circuit.
チレン、ポリプロピレン、ポリブチレンおよびそれらの
組み合わせから成る群から選ばれることを特徴とする請
求項１の製造方法。2. The method according to claim 1, wherein said olefin-based thermoplastic resin is selected from the group consisting of polyethylene, polypropylene, polybutylene and a combination thereof.
エステル、ポリエチレンテレフタレート、ポリブチレン
テレフタレートおよびそれらの組み合わせから成る群か
ら選ばれることを特徴とする請求項１の製造方法。3. The method according to claim 1, wherein said polyester-based thermoplastic resin is selected from the group consisting of polyester, polyethylene terephthalate, polybutylene terephthalate, and combinations thereof.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16343696A JPH1012994A (en) | 1996-06-24 | 1996-06-24 | Manufacture of molded product provided with conductive circuit |
| DE1997126850 DE19726850B8 (en) | 1996-06-24 | 1997-06-24 | Process for the production of printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16343696A JPH1012994A (en) | 1996-06-24 | 1996-06-24 | Manufacture of molded product provided with conductive circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1012994A true JPH1012994A (en) | 1998-01-16 |
Family
ID=15773862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16343696A Pending JPH1012994A (en) | 1996-06-24 | 1996-06-24 | Manufacture of molded product provided with conductive circuit |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH1012994A (en) |
| DE (1) | DE19726850B8 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007048906A (en) * | 2005-08-09 | 2007-02-22 | Sankyo Kasei Co Ltd | Method of manufacturing molding circuit part |
| US7211207B2 (en) | 2002-05-22 | 2007-05-01 | Hitachi Maxell, Ltd. | Injection molding method with surface modification |
| KR101259641B1 (en) | 2006-07-25 | 2013-04-30 | 엘지전자 주식회사 | Molding method for printed circuit board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2171355B (en) * | 1985-02-22 | 1989-11-22 | Kollmorgen Tech Corp | Molded articles suitable for adherent metallization, molded metallized articles and processes for making the same |
| IN167760B (en) * | 1986-08-15 | 1990-12-15 | Kollmorgen Tech Corp | |
| JPH0196384A (en) * | 1987-10-08 | 1989-04-14 | Seiko Instr & Electron Ltd | Method for plating transparent conductive film pattern |
| JPH0284790A (en) * | 1988-09-21 | 1990-03-26 | Hitachi Chem Co Ltd | Manufacture of molding with conductive circuit |
| JPH05125235A (en) * | 1991-11-01 | 1993-05-21 | Kanegafuchi Chem Ind Co Ltd | Thermoplastic resin composition |
| JPH0673264A (en) * | 1992-06-26 | 1994-03-15 | Polyplastics Co | Polyester resin composition and its production |
-
1996
- 1996-06-24 JP JP16343696A patent/JPH1012994A/en active Pending
-
1997
- 1997-06-24 DE DE1997126850 patent/DE19726850B8/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7211207B2 (en) | 2002-05-22 | 2007-05-01 | Hitachi Maxell, Ltd. | Injection molding method with surface modification |
| JP2008143185A (en) * | 2002-05-22 | 2008-06-26 | Hitachi Maxell Ltd | Molded article |
| US7763195B2 (en) | 2002-05-22 | 2010-07-27 | Hitachi Maxell, Ltd. | Injection molding method with surface modification |
| JP4522447B2 (en) * | 2002-05-22 | 2010-08-11 | 日立マクセル株式会社 | Manufacturing method of molded products |
| JP2007048906A (en) * | 2005-08-09 | 2007-02-22 | Sankyo Kasei Co Ltd | Method of manufacturing molding circuit part |
| JP4537911B2 (en) * | 2005-08-09 | 2010-09-08 | 三共化成株式会社 | Manufacturing method of molded circuit components |
| KR101259641B1 (en) | 2006-07-25 | 2013-04-30 | 엘지전자 주식회사 | Molding method for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19726850B8 (en) | 2006-04-13 |
| DE19726850A1 (en) | 1998-01-29 |
| DE19726850B4 (en) | 2005-12-08 |
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