JPH0284790A - Manufacture of molding with conductive circuit - Google Patents

Abstract

PURPOSE:To manufacture a molding with a conductive circuit having excellent circuit density by forming a plurality of holes to the molding molded through a first shot of a catalytic material. CONSTITUTION:A material catalytically functioning to electroless plating and a material 4 which does not funtion catalytically to electroless plating are used, the catalytic material is injection-molded through a first shot, the material which does not function catalytically is injected through a second shot while employing the molding 1 as an insert and a final molding 5 is manufactured, and a conductor is shaped only to the section of the catalytic material exposed as a circuit pattern from the surface of the molding 5 through electroless plating. Consequently, when the molding is manufactured, a plurality of holes 7 are formed to the molding 1 molded through the first shot of the catalytic material. Accordingly, the material 4, which does not function catalytically to electroless plating, can flow into the holes 7 on the second shot, thus preventing the formation of a section into which the material does not flow, even when circuit density is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method for manufacturing a molded article having a conductive circuit.

(Prior Art) Electronic equipment usually consists of a housing, an electronic circuit section, and an operation section such as a switch.

Due to recent demands for devices to be smaller, lighter, and thinner, many devices are made of plastic for their casings, but the electronic circuitry must be mounted on a wiring board and attached to the casing, making it thinner. was becoming difficult.

Recently, as a method to solve these demands, forming a circuit directly on the housing is being developed.

One such method, as shown in Japanese Unexamined Patent Publication No. 61-239694, utilizes a known multicolor molding method and uses a material that is catalytic for electroless plating and a material that is catalytic for electroless plating. The catalytic material is injection molded in the first shot, and the non-catalytic material is injected in the second shot using the molded part 1 (Figure 4) as an insert to complete the final molding. There is a method for manufacturing a molded product, in which a conductor is formed only on the portion of the catalytic material exposed as a circuit pattern on the surface of the molded product 5 by electroless plating.

(Problem to be Solved by the Invention) When manufacturing a molded product having a circuit on the surface by this method, injection molding must be performed between the protruding parts of the molded product 1 that will become the circuit in the second shot. First, when the circuit density is increased, the narrow spacing between the circuits makes injection molding difficult. The maximum pitch between them is about 1 crane.

The present invention provides a method for manufacturing a molded article having a conductive circuit with excellent circuit density.

(Means for Solving the Problems) The present invention uses a material that is catalytic for electroless plating and a material that is not catalytic for electroless plating, injection molding the catalytic material in the first shot, Using the molded product 1 as an insert, a non-catalytic material is injected in a second shot to form the final molded product 5, and electroless plating is performed to expose the catalytic material as a circuit pattern on the surface of the molded product 5. In the method for manufacturing a molded article in which a conductor is formed only in the part of the molded article 1 formed with the first shot of catalytic material, the molded article 1 having a conductive circuit characterized in that it has a plurality of holes 7 is formed. It is a manufacturing method.

Materials that are catalytic for electroless plating used in the present invention include acrylonitrile butadiene styrene,
There are polysulfone, polyethersulfone, polyetherimide, polyarylsulfone, etc. Materials that are not catalytic for electroless plating include polyester, polyphenylene sulfide, polyetheretherketone, polyvinyl chloride, polyethylene, polypropylene, etc. .

Further, as methods for forming the plurality of holes 7, there are a method of setting pins in the mold (FIG. 1) and a method of providing pieces in the mold (FIG. 2).

(Function) Since there are a plurality of holes 7, a material that is not catalytic for electroless plating can flow into the holes 7 during the second show/ ), and even if the circuit density increases, the material There are no parts where the flow does not occur, and the insulation properties as a circuit are also improved.

EXAMPLE Acrylonitrile butadiene styrene resin was used for the first shot and polyester was used for the second shot.

The pitch of the circuit pattern was 0.5 m.

In the second shot, there was no room for the second resin to flow between the first molded parts that would form the circuit.

(Effects) As explained above, according to the present invention, it was possible to provide a method for manufacturing a molded product having a conductive circuit with excellent wiring density.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a first shot molded product showing one embodiment of the present invention, FIG. 2 is a perspective view of a first shot molded product showing another embodiment of the present invention, and FIG. 4 is a perspective view of the molded product after the second shot showing an embodiment of the present invention, FIG. 4 is a perspective view of the molded product after the first shot showing a conventional example, and FIG. 5 is a perspective view of the molded product after the first shot showing a conventional example. FIG. 3 is a perspective view of the molded product after being shot. Description of symbols 1, molded product 20 circuit pattern 3, through-hole land 4, material not catalytic for electroless plating 5, molded product 6, copper plating 7, hole

Claims (1)

[Claims] 1. Using a material that is catalytic for electroless plating and a material that is not catalytic for electroless plating, the catalytic material is injection molded in the first shot, and the molded product (1) is used as an insert in the second shot. A non-catalytic material is injected with a shot to form the final molded product (5), and electroless plating is performed.
In a method for manufacturing a molded article (5) in which a conductor is formed only in the portion of the catalytic material exposed as a circuit pattern on the surface of the molded article (5), the molded article (1) formed with the first shot of the catalytic material is , a method for producing a molded article having a conductive circuit, characterized in that it has a plurality of holes (7).