JPH0384987A - Cubic wiring board - Google Patents

Abstract

PURPOSE:To simplify the assembling operation by providing molded member pieces, which are to be formed into one body of predetermined shape while their engage parts arranged on their end planes are engaged, and circuit patterns which are formed at least on surfaces of said molded member pieces and composes a required wiring circuit by being connected electrically when said pieces are combinded into one body of predetermined shape. CONSTITUTION:Molded member pieces 1 and 2 are combined into one body of predetermined shape by engaging engage parts 3 and 4 arranged on end planes 1a and 2a of said pieces 1 and 2 respectively. Circuit patterns 5a and 5b are formed at least on surfaces of the molded member pieces 1 and 2. When the pieces 1 and 2 are united into a predetermined shape, these are connected also electrically to compose a required wiring circuit. The circuit patterns 5a and 5b are laid so far as contact the planes of the engage parts 3 and 4 of the molded member pieces 1 and 2 in order to engage the molded member pieces 1 and 2 into one body. If necessary, ultrasonic wave is used to combine the engage parts and to connect them electrically, and a required wiring circuit is composed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a three-dimensional wiring board, and more particularly to a three-dimensional wiring board having a structure in which a plurality of divided molded member pieces are assembled and integrated.

(Prior Art) Attempts have been made to form a required conductor circuit on the inner wall surface of an insulating resin molded product, such as a housing, to make the structure of electronic devices more compact. In other words, it is known that the casing itself, whose original role is a mechanical or electrical protection function, can also be used as a conductive circuit board. However, a wiring board in which a resin molded product such as the above-mentioned casing is also used as a conductive circuit board is generally manufactured in the following manner. That is, the surface of the injection molded product is first subjected to chemical plating (electroless plating) and then to electroplating (electrolytic plating). Thereafter, an etching resist is printed on the electroplated layer, subjected to necessary exposure and development treatment, and then the plated layer other than the conductor circuit pattern forming area is selectively etched away. After forming a required conductor circuit on the surface of the injection molded product in this manner, the etching resist is removed by peeling or the like, thereby obtaining a desired wiring board (three-dimensional wiring board).

It is also known to construct a desired wiring circuit by combining, for example, a plurality of plastic molded products formed with a desired circuit pattern. That is, it is common practice to electrically connect plastic molded products having the circuit patterns to each other using connectors, cables, flexible printed circuit boards, or the like to construct a desired wiring circuit.

(Problems to be Solved by the Invention) However, in the case of the above-mentioned method for manufacturing a three-dimensional wiring board, there are the following problems, and it cannot be said that the method is fully satisfactory in practice. First of all, injection molding.

The process is complicated, including chemical plating pre-treatment (surface roughening treatment and catalyst treatment), chemical plating treatment, electroplating treatment, resist coating, exposure and development treatment, etching treatment, and resist peeling for a given surface of the molded product. Can be mentioned.

Second, since the surface of the substrate (injection molded product) is three-dimensional, it is not only difficult to apply a resist uniformly, but also the production of a mask used for exposure processing is complicated. Third, since conductor circuits are plated on the surface of the base (injection molded product), not only is the adhesion poor and the reliability is not satisfactory, but the resin that makes up the base (injection molded product) There are also problems such as being limited.

On the other hand, in the case of a method in which plastic molded products with circuit patterns are electrically connected to each other using connectors, cables, or flexible printed circuit boards to form a desired wiring circuit, only connecting parts such as the above-mentioned connectors are required. Moreover, there are problems such as the connection operation is complicated and it is impossible to make the device compact.

The present invention has been made in response to the above-mentioned circumstances, and aims to provide a three-dimensional wiring board that is easy to assemble and has high reliability.

[Structure of the Invention] (Means for Solving the Problems) The present invention provides a molded member piece that is integrated into a predetermined shape by engaging retaining portions provided on end faces with each other, and a small number of the molded member pieces. Both devices are characterized in that they include a circuit pattern formed on the surface and electrically connected to each other to form a required wiring circuit when integrated into a predetermined form.

(Function) According to the present invention, a required wiring circuit is constructed by assembling molded pieces having at least a circuit pattern formed on their surfaces and whose end faces are engaged with each other and integrated into a predetermined form. ing. In other words, the respective molded member pieces are integrated into a predetermined form by the engaging portions provided on the end faces, and a required wiring circuit is constructed. Therefore, the configuration of the wiring circuit can be arbitrarily and accurately configured, and connecting parts such as connectors are not required, and complicated assembly operations and processes are also eliminated.

(Example) The present invention will be described in detail below with reference to FIGS. 1 and 2. FIG. 1 is a perspective view showing a main part of a configuration example of a three-dimensional wiring board according to the present invention.

In FIG. 1, 1 and 2 are molded member pieces that are integrated into a predetermined form by engaging the retaining parts 3 and 4 provided on the end faces 1a and 2a, respectively, and 5a and 5b are the molded member pieces 1. ，
The circuit patterns 5a and 5b are formed on at least the surface of the circuit patterns 5a and 5b and are electrically connected to each other to form a required wiring circuit when integrated into a predetermined form. Engagement portions 3, 4 of molded piece 1.2
A structure in which the molded member pieces 1 and 2 are engaged and integrated, and if necessary, the joints are joined using ultrasonic waves or the like to electrically connect each other to form the required wiring circuit. is doing.

Therefore, the molded member piece 1.2 provided with the above circuit pattern
can be manufactured, for example, as follows.

First, an injection mold consisting of a male mold and a female mold is prepared to obtain a desired molded member piece, and a thickness is A dense alumina layer with a thickness of about 0.5μ is deposited. The deposited alumina layer is selectively cut using, for example, a diamond needle to expose the male surface in a desired circuit pattern (leaving the alumina layer in the reverse pattern). Next, a plating resist layer is applied to the surface other than the injection molded surface on which the reverse pattern of the male mold remains, and this is used as one electrode, and copper is used as a counter electrode to conduct electrical steel in a sulfuric acid steel plating bath. After plating, a circuit pattern with a thickness of about 15 μm was applied to the exposed area of the injection molded surface of the male die, and then washed with water.

After sequential drying, the female mold and injection mold prepared in advance are assembled, set in the required injection molding machine, and a desired resin, such as polycarbonate resin, is placed in the injection mold. injection molded. By this injection molding, the circuit pattern on the molded surface of the male mold is transferred or embedded into one side of the resin molded member, and is integrated into the resin molded member piece. Next, the injection molding die is removed from the injection molding machine, and the injection molding piece is taken out from the injection molding die, thereby obtaining a desired molded member piece having a desired circuit pattern formed on its surface.

FIG. 2 is a plan view showing another configuration example of the three-dimensional wiring board according to the present invention. In this embodiment, the engaging portions 3 and 4 provided on the end surface are engaged with each other to form a predetermined shape. This is a case where it is composed of four molded member pieces 6 that are integrated. In this example as well, the circuit pattern 7 formed on the surface of the molded member pieces 6 is electrically connected to each other to form a required wiring circuit when the molded member pieces 6 are integrated into a predetermined form. The basic configuration is the same as the above example (FIG. 1). In the figure, 8 is equipped with electronic components.

Indicates implementation area.

Although the single-sided three-dimensional wiring board is exemplified above, it may be double-sided plastic or multi-layered, and the molded member piece is not limited to polycarbonate resin, but may also be made of ABA resin, for example.
Thermoplastic resin such as vinyl chloride resin or ceramics may be used.

[Effects of the Invention] As described above, according to the present invention, required three-dimensional wiring can be achieved by mutual engagement and integration of molded member pieces that have been previously divided into a plurality of parts and on which are formed a circuit pattern forming a required wiring circuit. The substrate is configured. Therefore, it is easy to construct a wiring circuit or wiring board of any three-dimensional shape. In addition, since the electrical connection between the circuit patterns formed on each divided molded member piece is achieved without using connectors, the miniaturization is achieved in harmony with the ability to form any three-dimensional shape. can also be easily achieved. Furthermore, by dividing or blocking the molded members and circuit patterns, it becomes possible to share a part of the wiring board, which can also contribute to reducing design and manufacturing costs.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an example of the main part configuration of a three-dimensional wiring board according to the present invention, and FIG. 2 is a plan view showing another example of the configuration of the three-dimensional wiring board according to the present invention. 1.2.6...Molded member piece la, 2a...Molded member one end surface 3.4...
...Engaging parts 5a, 5b, 7...Circuit pattern

Claims (1)

[Scope of Claims] A molded member piece that is integrated into a predetermined form by engaging engaging portions provided on end faces with each other, and a molded member piece that is formed on at least a surface of the molded member piece and integrated into a predetermined form. 1. A three-dimensional wiring board, comprising: circuit patterns that are electrically connected to each other to form a required wiring circuit when the wiring board is connected to the wiring board.