DE19726850B8 - Verfahren zur Herstellung von Leiterplatten - Google Patents

Verfahren zur Herstellung von Leiterplatten Download PDF

Info

Publication number
DE19726850B8
DE19726850B8 DE1997126850 DE19726850A DE19726850B8 DE 19726850 B8 DE19726850 B8 DE 19726850B8 DE 1997126850 DE1997126850 DE 1997126850 DE 19726850 A DE19726850 A DE 19726850A DE 19726850 B8 DE19726850 B8 DE 19726850B8
Authority
DE
Germany
Prior art keywords
production
printed circuit
circuit boards
boards
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1997126850
Other languages
English (en)
Other versions
DE19726850A1 (de
DE19726850B4 (de
Inventor
Makoto Gotenba Katsumata
Hidenori Gotenba Yamanashi
Hitoshi Gotenba Ushijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Publication of DE19726850A1 publication Critical patent/DE19726850A1/de
Application granted granted Critical
Publication of DE19726850B4 publication Critical patent/DE19726850B4/de
Publication of DE19726850B8 publication Critical patent/DE19726850B8/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
DE1997126850 1996-06-24 1997-06-24 Verfahren zur Herstellung von Leiterplatten Expired - Fee Related DE19726850B8 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8-163436 1996-06-24
JP16343696A JPH1012994A (ja) 1996-06-24 1996-06-24 導電性回路を有する成形品の製造方法

Publications (3)

Publication Number Publication Date
DE19726850A1 DE19726850A1 (de) 1998-01-29
DE19726850B4 DE19726850B4 (de) 2005-12-08
DE19726850B8 true DE19726850B8 (de) 2006-04-13

Family

ID=15773862

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997126850 Expired - Fee Related DE19726850B8 (de) 1996-06-24 1997-06-24 Verfahren zur Herstellung von Leiterplatten

Country Status (2)

Country Link
JP (1) JPH1012994A (de)
DE (1) DE19726850B8 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100348401C (zh) 2002-05-22 2007-11-14 日立麦克赛尔株式会社 成形件，注射模塑法及装置
JP4537911B2 (ja) * 2005-08-09 2010-09-08 三共化成株式会社 成形回路部品の製造方法
KR101259641B1 (ko) 2006-07-25 2013-04-30 엘지전자 주식회사 인쇄회로기판의 성형방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3605342A1 (de) * 1985-02-22 1986-09-04 AMP-Akzo Corp., Newark, Del. Fuer das aufbringen festhaftender metallbelaege geeignete formkoerper, metallisierte formkoerper sowie verfahren zu deren herstellung
EP0256428A2 (de) * 1986-08-15 1988-02-24 AMP-AKZO CORPORATION (a Delaware corp.) Gegossene metallisierte Kunststoffgegenstände und Verfahren zur Herstellung
JPH0196384A (ja) * 1987-10-08 1989-04-14 Seiko Instr & Electron Ltd 透明導電膜パターン上へのめっき方法
JPH0284790A (ja) * 1988-09-21 1990-03-26 Hitachi Chem Co Ltd 導電性回路を有する成形品の製造法
JPH05125235A (ja) * 1991-11-01 1993-05-21 Kanegafuchi Chem Ind Co Ltd 熱可塑性樹脂組成物
JPH0673264A (ja) * 1992-06-26 1994-03-15 Polyplastics Co ポリエステル樹脂組成物及びその製造法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3605342A1 (de) * 1985-02-22 1986-09-04 AMP-Akzo Corp., Newark, Del. Fuer das aufbringen festhaftender metallbelaege geeignete formkoerper, metallisierte formkoerper sowie verfahren zu deren herstellung
EP0256428A2 (de) * 1986-08-15 1988-02-24 AMP-AKZO CORPORATION (a Delaware corp.) Gegossene metallisierte Kunststoffgegenstände und Verfahren zur Herstellung
JPH0196384A (ja) * 1987-10-08 1989-04-14 Seiko Instr & Electron Ltd 透明導電膜パターン上へのめっき方法
JPH0284790A (ja) * 1988-09-21 1990-03-26 Hitachi Chem Co Ltd 導電性回路を有する成形品の製造法
JPH05125235A (ja) * 1991-11-01 1993-05-21 Kanegafuchi Chem Ind Co Ltd 熱可塑性樹脂組成物
JPH0673264A (ja) * 1992-06-26 1994-03-15 Polyplastics Co ポリエステル樹脂組成物及びその製造法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HERRMANN, G., EGERER, K.: Handbuch der Leiter- plattentechnik, Bd.2: Neue Verfahren, neue Tech- nologie, Eugen Leuze Verlag Saulgau/Württ. 1991, S.388-390 *

Also Published As

Publication number Publication date
DE19726850A1 (de) 1998-01-29
JPH1012994A (ja) 1998-01-16
DE19726850B4 (de) 2005-12-08

Similar Documents

Publication Publication Date Title
DE69418698D1 (de) Verfahren zur Herstellung von Leiterplatten
DE69123120D1 (de) Verfahren zur Herstellung von gedruckten Leiterplatten
DE69431828T2 (de) Verfahren zur Herstellung von gedruckten Schaltungskarten
DE69325936D1 (de) Verfahren zur Herstellung von Platten für gedruckte Schaltungen
DE58907030D1 (de) Verfahren zur Herstellung von Leiterplatten.
DE69105625T2 (de) Verfahren zur Herstellung von gedruckten Mehrschicht-Leiterplatten.
DE59904603D1 (de) Verfahren zur Herstellung von Schaltungsanordnungen
DE68921732T2 (de) Verfahren zur Herstellung von gedruckten Mehrschicht-Leiterplatten.
DE69734947D1 (de) Verfahren zur Herstellung von mehrschichtigen Leiterplatten
DE69125233D1 (de) Verfahren zur Herstellung von gedruckten Schaltungen
DE69122573D1 (de) Verfahren zur Herstellung von Mehrschichtplatinen
DE69419219D1 (de) Leiterplatte und Verfahren zur Herstellung solcher Leiterplatten
DE69104750D1 (de) Verfahren zur Herstellung von Mehrschichtplatinen.
DE69634284D1 (de) Verfahren zur Herstellung von mehrschichtigen Leiterplatten
DE69818485D1 (de) Verfahren zur herstellung von elektronischen bauteilen
DE69824133D1 (de) Verfahren zur Herstellung von mehrschichtigen Leiterplatten
DE69800219D1 (de) Verfahren zur Herstellung einer Mehrlagenleiterplatte
DE69326925D1 (de) Verfahren zur Herstellung von gedruckten Leiterplatten
DE69911902D1 (de) Verfahren zur Herstellung einer gedruckten Schaltung
DE59813367D1 (de) Verfahren zur Herstellung von Druckerzeugnissen
DE69730288D1 (de) Verfahren zur Herstellung gedruckter Leiterplatten mit plattierten Widerständen
DE69803664D1 (de) Verfahren zur herstellung von gedruckten leiterplatten und so hergestellte gedruckte leiterplatten
DE69735750D1 (de) Verfahren zur Herstellung von Leiterplatten
DE69320498D1 (de) Verfahren zur Herstellung von Dünnfilm-Leiterplatten
DE69023816T2 (de) Verfahren zur Herstellung gedruckter Schaltungsplatten.

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8396 Reprint of erroneous front page
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee