DE69122573D1 - Verfahren zur Herstellung von Mehrschichtplatinen - Google Patents

Verfahren zur Herstellung von Mehrschichtplatinen

Info

Publication number
DE69122573D1
DE69122573D1 DE69122573T DE69122573T DE69122573D1 DE 69122573 D1 DE69122573 D1 DE 69122573D1 DE 69122573 T DE69122573 T DE 69122573T DE 69122573 T DE69122573 T DE 69122573T DE 69122573 D1 DE69122573 D1 DE 69122573D1
Authority
DE
Germany
Prior art keywords
production
multilayer boards
boards
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69122573T
Other languages
English (en)
Other versions
DE69122573T2 (de
Inventor
Ando Kazuhiro
Kawakami Takamasa
Shouji Yasuhiro
Tanaka Yasuo
Kanaoka Takeo
Sayama Norio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2199210A external-priority patent/JPH0485989A/ja
Priority claimed from JP2277884A external-priority patent/JPH04154193A/ja
Priority claimed from JP2277885A external-priority patent/JPH04154194A/ja
Priority claimed from JP2284203A external-priority patent/JPH04159797A/ja
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Application granted granted Critical
Publication of DE69122573D1 publication Critical patent/DE69122573D1/de
Publication of DE69122573T2 publication Critical patent/DE69122573T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69122573T 1990-07-30 1991-07-25 Verfahren zur Herstellung von Mehrschichtplatinen Expired - Fee Related DE69122573T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2199210A JPH0485989A (ja) 1990-07-30 1990-07-30 多層プリント板の製造法
JP2277884A JPH04154193A (ja) 1990-10-18 1990-10-18 多層プリント板の製造法
JP2277885A JPH04154194A (ja) 1990-10-18 1990-10-18 多層プリント板の製造法
JP2284203A JPH04159797A (ja) 1990-10-24 1990-10-24 多層プリント板の製造法

Publications (2)

Publication Number Publication Date
DE69122573D1 true DE69122573D1 (de) 1996-11-14
DE69122573T2 DE69122573T2 (de) 1997-03-13

Family

ID=27475957

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69122573T Expired - Fee Related DE69122573T2 (de) 1990-07-30 1991-07-25 Verfahren zur Herstellung von Mehrschichtplatinen

Country Status (4)

Country Link
US (1) US5252355A (de)
EP (1) EP0469470B1 (de)
KR (1) KR940009177B1 (de)
DE (1) DE69122573T2 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0637197A1 (de) * 1993-07-26 1995-02-01 Siemens Nixdorf Informationssysteme AG Verfahren zum Durchkontaktieren von Mehrlagenleiterplatten
JP2694802B2 (ja) * 1993-12-28 1997-12-24 日本電気株式会社 プリント配線板の製造方法
US5789757A (en) * 1996-09-10 1998-08-04 The Dexter Corporation Malemide containing formulations and uses therefor
US7645899B1 (en) 1994-09-02 2010-01-12 Henkel Corporation Vinyl compounds
US6960636B2 (en) 1994-09-02 2005-11-01 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US6852814B2 (en) * 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US20030055121A1 (en) * 1996-09-10 2003-03-20 Dershem Stephen M. Thermosetting resin compositions containing maleimide and/or vinyl compounds
US6121358A (en) * 1997-09-22 2000-09-19 The Dexter Corporation Hydrophobic vinyl monomers, formulations containing same, and uses therefor
ES2367838T3 (es) 1998-09-10 2011-11-10 JX Nippon Mining & Metals Corp. Laminado que comprende una hoja de cobre tratada y procedimiento para su fabricación.
US6117536A (en) * 1998-09-10 2000-09-12 Ga-Tek Inc. Adhesion promoting layer for use with epoxy prepregs
US6132589A (en) * 1998-09-10 2000-10-17 Ga-Tek Inc. Treated copper foil and process for making treated copper foil
US6679951B2 (en) 2000-05-15 2004-01-20 Asm Intenational N.V. Metal anneal with oxidation prevention
US7494927B2 (en) 2000-05-15 2009-02-24 Asm International N.V. Method of growing electrical conductors
US6482740B2 (en) 2000-05-15 2002-11-19 Asm Microchemistry Oy Method of growing electrical conductors by reducing metal oxide film with organic compound containing -OH, -CHO, or -COOH
US6878628B2 (en) 2000-05-15 2005-04-12 Asm International Nv In situ reduction of copper oxide prior to silicon carbide deposition
US9139906B2 (en) 2001-03-06 2015-09-22 Asm America, Inc. Doping with ALD technology
US7491634B2 (en) 2006-04-28 2009-02-17 Asm International N.V. Methods for forming roughened surfaces and applications thereof
US20040091688A1 (en) * 2002-11-11 2004-05-13 Morio Gaku Heat-resistant film base-material-inserted B-staged resin composition sheet excellent in adhesion to resin, multilayer board using the sheet and manufacturing process of the multilayer board
US7067407B2 (en) 2003-08-04 2006-06-27 Asm International, N.V. Method of growing electrical conductors
JP2007516599A (ja) 2003-08-04 2007-06-21 エーエスエム アメリカ インコーポレイテッド ゲルマニウム上の堆積前の表面調製
TW200634982A (en) 2005-02-22 2006-10-01 Asm Inc Plasma pre-treating surfaces for atomic layer deposition
KR20070111549A (ko) * 2005-03-11 2007-11-21 히다치 가세고교 가부시끼가이샤 구리의 표면 처리 방법 및 구리
US8025922B2 (en) 2005-03-15 2011-09-27 Asm International N.V. Enhanced deposition of noble metals
US7666773B2 (en) 2005-03-15 2010-02-23 Asm International N.V. Selective deposition of noble metal thin films
KR101379015B1 (ko) 2006-02-15 2014-03-28 한국에이에스엠지니텍 주식회사 플라즈마 원자층 증착법을 이용한 루테늄 막 증착 방법 및고밀도 루테늄 층
WO2008042981A2 (en) 2006-10-05 2008-04-10 Asm America, Inc. Ald of metal silicate films
KR101544198B1 (ko) 2007-10-17 2015-08-12 한국에이에스엠지니텍 주식회사 루테늄 막 형성 방법
US7655564B2 (en) 2007-12-12 2010-02-02 Asm Japan, K.K. Method for forming Ta-Ru liner layer for Cu wiring
US7799674B2 (en) 2008-02-19 2010-09-21 Asm Japan K.K. Ruthenium alloy film for copper interconnects
US8545936B2 (en) 2008-03-28 2013-10-01 Asm International N.V. Methods for forming carbon nanotubes
US8383525B2 (en) 2008-04-25 2013-02-26 Asm America, Inc. Plasma-enhanced deposition process for forming a metal oxide thin film and related structures
US8084104B2 (en) 2008-08-29 2011-12-27 Asm Japan K.K. Atomic composition controlled ruthenium alloy film formed by plasma-enhanced atomic layer deposition
US8133555B2 (en) 2008-10-14 2012-03-13 Asm Japan K.K. Method for forming metal film by ALD using beta-diketone metal complex
JP5778382B2 (ja) * 2008-10-22 2015-09-16 東ソー株式会社 金属膜製造用組成物、金属膜の製造方法及び金属粉末の製造方法
US7927942B2 (en) 2008-12-19 2011-04-19 Asm International N.V. Selective silicide process
US9379011B2 (en) 2008-12-19 2016-06-28 Asm International N.V. Methods for depositing nickel films and for making nickel silicide and nickel germanide
US8329569B2 (en) 2009-07-31 2012-12-11 Asm America, Inc. Deposition of ruthenium or ruthenium dioxide
US8871617B2 (en) 2011-04-22 2014-10-28 Asm Ip Holding B.V. Deposition and reduction of mixed metal oxide thin films
US9607842B1 (en) 2015-10-02 2017-03-28 Asm Ip Holding B.V. Methods of forming metal silicides
US10913056B2 (en) 2017-07-31 2021-02-09 Honda Motor Co., Ltd. Method for synthesis of copper/copper oxide nanocrystals
US11339487B2 (en) 2019-02-28 2022-05-24 Honda Motor Co., Ltd. Synergistic effects of multi-faceted CU2O nanocrystals for electrochemical CO2 reduction
US11873566B2 (en) 2019-02-28 2024-01-16 Honda Motor Co., Ltd. Cu/Cu2O interface nanostructures for electrochemical CO2 reduction

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810880B2 (ja) * 1979-08-30 1983-02-28 株式会社村田製作所 銅被膜の密着性向上方法
JPS56153797A (en) * 1980-04-28 1981-11-27 Hitachi Chemical Co Ltd Method of manufacturing multilayer printed circuit board substrate
KR890004583B1 (ko) * 1984-06-29 1989-11-16 히다찌가세이고오교 가부시끼가이샤 금속표면 처리공정
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
US4795512A (en) * 1986-02-26 1989-01-03 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a multilayer ceramic body
US4775444A (en) * 1987-08-26 1988-10-04 Macdermid, Incorporated Process for fabricating multilayer circuit boards
MY104191A (en) * 1988-09-06 1994-02-28 Mitsubishi Gas Chemical Co Process for producing multilayer printed wiring board
JPH0387092A (ja) * 1989-06-15 1991-04-11 Matsushita Electric Works Ltd 内層用回路板の銅回路の処理方法

Also Published As

Publication number Publication date
US5252355A (en) 1993-10-12
EP0469470A1 (de) 1992-02-05
EP0469470B1 (de) 1996-10-09
KR920003827A (ko) 1992-02-29
DE69122573T2 (de) 1997-03-13
KR940009177B1 (ko) 1994-10-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee