DE69204571D1 - Verfahren zur Herstellung von elektronischen Mehrschichtschaltungen. - Google Patents
Verfahren zur Herstellung von elektronischen Mehrschichtschaltungen.Info
- Publication number
- DE69204571D1 DE69204571D1 DE69204571T DE69204571T DE69204571D1 DE 69204571 D1 DE69204571 D1 DE 69204571D1 DE 69204571 T DE69204571 T DE 69204571T DE 69204571 T DE69204571 T DE 69204571T DE 69204571 D1 DE69204571 D1 DE 69204571D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- electronic circuits
- multilayer electronic
- multilayer
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
- H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
- C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/14—Silica-free oxide glass compositions containing boron
- C03C3/142—Silica-free oxide glass compositions containing boron containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/725,779 US5162062A (en) | 1991-06-17 | 1991-06-17 | Method for making multilayer electronic circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69204571D1 true DE69204571D1 (de) | 1995-10-12 |
DE69204571T2 DE69204571T2 (de) | 1996-03-21 |
Family
ID=24915936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69204571T Expired - Fee Related DE69204571T2 (de) | 1991-06-17 | 1992-04-15 | Verfahren zur Herstellung von elektronischen Mehrschichtschaltungen. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5162062A (de) |
EP (1) | EP0519175B1 (de) |
JP (1) | JPH0732310B2 (de) |
KR (1) | KR960001353B1 (de) |
CN (1) | CN1031446C (de) |
CA (1) | CA2066069A1 (de) |
DE (1) | DE69204571T2 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5337549A (en) * | 1989-12-20 | 1994-08-16 | Tokusen Kogyo Company Limited | Steel cord for reinforcement of rubber products |
JPH0768673B2 (ja) * | 1991-12-27 | 1995-07-26 | トクセン工業株式会社 | ゴム製品補強用スチールコード |
US5277844A (en) * | 1993-03-29 | 1994-01-11 | Rainey Clifford S | Resistor composition |
US5534194A (en) * | 1993-03-30 | 1996-07-09 | E. I. Du Pont De Nemours And Company | Thick film resistor composition containing pyrochlore and silver-containing binder |
US5632833A (en) * | 1993-10-29 | 1997-05-27 | Nec Corporation | Method of manufacturing laminated ceramic capacitor |
JP3117377B2 (ja) * | 1994-11-29 | 2000-12-11 | 京セラ株式会社 | 半導体装置 |
JP3211641B2 (ja) * | 1995-09-22 | 2001-09-25 | 株式会社村田製作所 | 導電性組成物 |
US5855995A (en) * | 1997-02-21 | 1999-01-05 | Medtronic, Inc. | Ceramic substrate for implantable medical devices |
US6146743A (en) | 1997-02-21 | 2000-11-14 | Medtronic, Inc. | Barrier metallization in ceramic substrate for implantable medical devices |
US20010001406A1 (en) * | 1998-02-17 | 2001-05-24 | Michael James Liberatore | Method of making transmission lines and buried passive components in green tape |
KR100369565B1 (ko) * | 1999-12-17 | 2003-01-29 | 대주정밀화학 주식회사 | 전기발열체용 저항 페이스트 조성물 |
JP3799933B2 (ja) * | 2000-02-09 | 2006-07-19 | 株式会社村田製作所 | 導電性ペーストおよびセラミック電子部品 |
JP2002076638A (ja) * | 2000-08-31 | 2002-03-15 | Kyocera Corp | 低温焼成セラミック回路基板 |
US20040104262A1 (en) * | 2001-04-09 | 2004-06-03 | Mears Sarah Jane | Use of conductor compositions in electronic circuits |
GB0108886D0 (en) * | 2001-04-09 | 2001-05-30 | Du Pont | Conductor composition II |
US7157023B2 (en) * | 2001-04-09 | 2007-01-02 | E. I. Du Pont De Nemours And Company | Conductor compositions and the use thereof |
JP3991218B2 (ja) * | 2002-12-20 | 2007-10-17 | 信越化学工業株式会社 | 導電性接着剤及びその製造方法 |
GB0307547D0 (en) * | 2003-04-01 | 2003-05-07 | Du Pont | Conductor composition V |
US7202154B2 (en) * | 2004-01-05 | 2007-04-10 | International Business Machines Corporation | Suspension for filling via holes in silicon and method for making the same |
US7326367B2 (en) * | 2005-04-25 | 2008-02-05 | E.I. Du Pont De Nemours And Company | Thick film conductor paste compositions for LTCC tape in microwave applications |
JP2007194580A (ja) | 2005-12-21 | 2007-08-02 | E I Du Pont De Nemours & Co | 太陽電池電極用ペースト |
JP5501549B2 (ja) * | 2006-03-29 | 2014-05-21 | 京セラ株式会社 | 光電変換素子、およびそれから構成される光電変換モジュール |
KR100819876B1 (ko) * | 2006-09-19 | 2008-04-07 | 삼성전기주식회사 | 합금배선기판 및 그 제조방법 |
US20090107546A1 (en) | 2007-10-29 | 2009-04-30 | Palo Alto Research Center Incorporated | Co-extruded compositions for high aspect ratio structures |
JP4656140B2 (ja) * | 2007-12-27 | 2011-03-23 | 富士電機システムズ株式会社 | 半導体装置の製造方法 |
US8383011B2 (en) * | 2008-01-30 | 2013-02-26 | Basf Se | Conductive inks with metallo-organic modifiers |
US7736546B2 (en) * | 2008-01-30 | 2010-06-15 | Basf Se | Glass frits |
US8308993B2 (en) * | 2008-01-30 | 2012-11-13 | Basf Se | Conductive inks |
CN101983543B (zh) * | 2008-03-31 | 2012-08-01 | 三菱电机株式会社 | 低温烧成陶瓷电路基板 |
US8080181B2 (en) * | 2008-05-13 | 2011-12-20 | Solarworld Innovations Gmbh | Coextrusion ink chemistry for improved feature definition |
JP2012521947A (ja) * | 2009-03-23 | 2012-09-20 | エスビーエー マテリアルズ インク | 新規な誘電体酸化物膜およびその製造方法 |
JP4888572B2 (ja) * | 2010-01-25 | 2012-02-29 | Tdk株式会社 | 導電性ペーストおよび電子部品の製造方法 |
TW201227761A (en) | 2010-12-28 | 2012-07-01 | Du Pont | Improved thick film resistive heater compositions comprising ag & ruo2, and methods of making same |
CN102450944A (zh) * | 2011-05-30 | 2012-05-16 | 浙江苏泊尔家电制造有限公司 | 一种电热炊具 |
US20130004659A1 (en) * | 2011-06-30 | 2013-01-03 | E I Du Pont De Nemours And Company | Thick film paste and use thereof |
TWM512217U (zh) | 2013-06-20 | 2015-11-11 | Plant PV | 太陽能電池 |
CN103745763B (zh) * | 2014-01-21 | 2016-04-27 | 江苏欧耐尔新型材料有限公司 | 太阳能电池背面电极浆料及其制备方法 |
WO2017035103A1 (en) | 2015-08-25 | 2017-03-02 | Plant Pv, Inc | Core-shell, oxidation-resistant particles for low temperature conductive applications |
WO2017035102A1 (en) | 2015-08-26 | 2017-03-02 | Plant Pv, Inc | Silver-bismuth non-contact metallization pastes for silicon solar cells |
US10000645B2 (en) | 2015-11-24 | 2018-06-19 | PLANT PV, Inc. | Methods of forming solar cells with fired multilayer film stacks |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4090009A (en) * | 1977-03-11 | 1978-05-16 | E. I. Du Pont De Nemours And Company | Novel silver compositions |
US4332343A (en) * | 1978-09-20 | 1982-06-01 | International Business Machines Corporation | Process for in-situ modification of solder comopsition |
US4318830A (en) * | 1979-01-15 | 1982-03-09 | E. I. Du Pont De Nemours And Company | Thick film conductors having improved aged adhesion |
US4414143A (en) * | 1981-05-06 | 1983-11-08 | E. I. Du Pont De Nemours & Co. | Conductor compositions |
US4381945A (en) * | 1981-08-03 | 1983-05-03 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions |
US4416932A (en) * | 1981-08-03 | 1983-11-22 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions |
US4636332A (en) * | 1985-11-01 | 1987-01-13 | E. I. Du Pont De Nemours And Company | Thick film conductor composition |
-
1991
- 1991-06-17 US US07/725,779 patent/US5162062A/en not_active Expired - Fee Related
-
1992
- 1992-04-15 DE DE69204571T patent/DE69204571T2/de not_active Expired - Fee Related
- 1992-04-15 EP EP92106474A patent/EP0519175B1/de not_active Expired - Lifetime
- 1992-04-15 CA CA002066069A patent/CA2066069A1/en not_active Abandoned
- 1992-04-16 JP JP4096582A patent/JPH0732310B2/ja not_active Expired - Lifetime
- 1992-04-16 KR KR1019920006349A patent/KR960001353B1/ko not_active IP Right Cessation
- 1992-04-16 CN CN92102683.8A patent/CN1031446C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69204571T2 (de) | 1996-03-21 |
CN1068007A (zh) | 1993-01-13 |
EP0519175A3 (en) | 1993-12-01 |
CN1031446C (zh) | 1996-03-27 |
JPH05136566A (ja) | 1993-06-01 |
EP0519175B1 (de) | 1995-09-06 |
US5162062A (en) | 1992-11-10 |
CA2066069A1 (en) | 1992-12-18 |
JPH0732310B2 (ja) | 1995-04-10 |
KR960001353B1 (ko) | 1996-01-26 |
EP0519175A2 (de) | 1992-12-23 |
KR930001762A (ko) | 1993-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |