JPH09510927A - 半導体ウェーハをスクライブ及び／又はブレークする方法及び装置 - Google Patents

半導体ウェーハをスクライブ及び／又はブレークする方法及び装置

Info

Publication number
JPH09510927A
JPH09510927A JP7519165A JP51916595A JPH09510927A JP H09510927 A JPH09510927 A JP H09510927A JP 7519165 A JP7519165 A JP 7519165A JP 51916595 A JP51916595 A JP 51916595A JP H09510927 A JPH09510927 A JP H09510927A
Authority
JP
Japan
Prior art keywords
wafer
scribe
scribing
break
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7519165A
Other languages
English (en)
Japanese (ja)
Inventor
ジェームズ アール ターナー
Original Assignee
ダイナテックス インターナショナル インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ダイナテックス インターナショナル インコーポレイテッド filed Critical ダイナテックス インターナショナル インコーポレイテッド
Publication of JPH09510927A publication Critical patent/JPH09510927A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0356—Serially

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP7519165A 1994-01-18 1995-01-12 半導体ウェーハをスクライブ及び／又はブレークする方法及び装置 Pending JPH09510927A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US18361394A 1994-01-18 1994-01-18
US08/183,613 1994-01-18
PCT/US1995/000574 WO1995019247A1 (en) 1994-01-18 1995-01-12 Method and apparatus for scribing and/or breaking semiconductor wafers

Publications (1)

Publication Number Publication Date
JPH09510927A true JPH09510927A (ja) 1997-11-04

Family

ID=22673572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7519165A Pending JPH09510927A (ja) 1994-01-18 1995-01-12 半導体ウェーハをスクライブ及び／又はブレークする方法及び装置

Country Status (9)

Country Link
US (1) US5820006A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0740598B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPH09510927A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) ATE291529T1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AU (1) AU1567895A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE69534098T2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IL (1) IL112346A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW273633B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO1995019247A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6184063B1 (en) * 1996-11-26 2001-02-06 Texas Instruments Incorporated Method and apparatus for breaking and separating a wafer into die using a multi-radii dome
US6470782B1 (en) * 1997-09-25 2002-10-29 Beldex Corporation Scribe device
US6430810B1 (en) * 1997-10-28 2002-08-13 Uniax Corporation Mechanical scribing methods of forming a patterned metal layer in an electronic device
WO1999039885A1 (en) * 1998-02-06 1999-08-12 Dynatex International Apparatus and process for membrane mounted die breaking with automated visualization
JP3326384B2 (ja) * 1998-03-12 2002-09-24 古河電気工業株式会社 半導体ウエハーの劈開方法およびその装置
US6205994B1 (en) 1998-12-23 2001-03-27 Lucent Technologies, Inc. Scriber adapter plate
DE69918114T2 (de) * 1999-01-11 2005-07-07 Beldex Corp. Ritzwerkzeug
JP4203177B2 (ja) * 1999-03-18 2008-12-24 株式会社ベルデックス スクライブ方法および装置
JP4173245B2 (ja) * 1999-04-06 2008-10-29 Ｔｈｋ株式会社 スクライブ方法
DE60024731T2 (de) * 1999-08-06 2006-06-29 Beldex Corp. Ritzgerät
JP2001196328A (ja) * 2000-01-12 2001-07-19 Disco Abrasive Syst Ltd Ｃｓｐ基板の分割方法
US6962279B1 (en) * 2000-10-18 2005-11-08 Ge Medical Systems Global Technology Company, Llc Apparatus and method for glass separation for flat panel displays
JP2002355713A (ja) * 2001-05-31 2002-12-10 Shoda Iron Works Co Ltd 板材の切断方法及び切断装置
JP3656910B2 (ja) * 2002-07-22 2005-06-08 住友電気工業株式会社 スクライブ溝の加工方法及びスクライブ装置
TWI226280B (en) * 2002-09-25 2005-01-11 Au Optronics Corp Precision notching device and method for cutting test piece
JP3867230B2 (ja) * 2002-09-26 2007-01-10 本田技研工業株式会社 メカニカルスクライブ装置
KR100436486B1 (ko) * 2002-11-04 2004-06-22 전성봉 자동 금속 인쇄기
TW549560U (en) * 2002-11-18 2003-08-21 Ind Tech Res Inst Rotational positioning mechanism for separating brittle material
US6826840B1 (en) 2003-06-16 2004-12-07 Micro Processing Technology, Inc. Semiconductor wafer scribing system
TWI249762B (en) * 2003-12-03 2006-02-21 Ind Tech Res Inst Sheet cutting device
US7392732B2 (en) 2005-01-24 2008-07-01 Micro Processing Technology, Inc. Scribing tool and method
US7415916B2 (en) * 2005-01-24 2008-08-26 Micro Processing Technology, Inc. Scribing system with particle remover
US7165331B1 (en) 2005-05-24 2007-01-23 Micro Processing Technology, Inc. Apparatus and method for scribing a semiconductor wafer while controlling scribing forces
KR100637590B1 (ko) * 2005-07-08 2006-10-23 주식회사 탑 엔지니어링 평판표시장치 제조용 기판 스크라이빙장치
US7262115B2 (en) * 2005-08-26 2007-08-28 Dynatex International Method and apparatus for breaking semiconductor wafers
US8220685B1 (en) 2005-09-08 2012-07-17 Micro Processing Technology, Inc. System for breaking a semiconductor wafer or other workpiece along a scribe line
US7302761B2 (en) * 2005-10-05 2007-12-04 Loomis Industries, Inc. Automatic tool tilting apparatus for a scribe tool
US8039283B2 (en) * 2005-12-26 2011-10-18 Panasonic Corporation Nitride compound semiconductor element and method for manufacturing same
US20080014720A1 (en) * 2006-03-16 2008-01-17 Dynatex International Street smart wafer breaking mechanism
DE102006015142B4 (de) * 2006-03-31 2014-02-20 Asys Automatisierungssysteme Gmbh Vorrichtung zum Brechen von Halbleiterscheiben
US9029731B2 (en) 2007-01-26 2015-05-12 Electro Scientific Industries, Inc. Methods and systems for laser processing continuously moving sheet material
US7807479B1 (en) * 2007-02-21 2010-10-05 Micro Processing Technology, Inc. Method and apparatus for improving force control in wafer scribing
DE102008031619A1 (de) 2008-07-07 2010-01-14 Dyntest Technologies Gmbh Verfahren und Vorrichtung zum Brechen von Halbleiterscheiben oder ähnlichen Substraten
JP5308892B2 (ja) * 2009-04-01 2013-10-09 三星ダイヤモンド工業株式会社 集積型薄膜太陽電池の製造装置
TWI508153B (zh) * 2010-04-30 2015-11-11 Mitsuboshi Diamond Ind Co Ltd Disconnection device and disconnection method of brittle material substrate
US8450188B1 (en) * 2011-08-02 2013-05-28 Micro Processing Technology, Inc. Method of removing back metal from an etched semiconductor scribe street
JP6517101B2 (ja) 2015-07-10 2019-05-22 クラリオン株式会社 振動発生装置
CN105590884B (zh) * 2015-12-30 2018-06-01 天津天物金佰微电子有限公司 半自动芯片裂片机及裂片方法
DE102016221626B4 (de) * 2016-11-04 2019-04-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Anordnung zur Überwachung des Ritzprozesses beim Ritzen von Bauteilen mit einem Ritzwerkzeug
US10152990B2 (en) * 2016-12-08 2018-12-11 Océ Holding B.V. Flatbed cutter assembly and a method therefor

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2970730A (en) * 1957-01-08 1961-02-07 Motorola Inc Dicing semiconductor wafers
DE2050488C3 (de) * 1970-10-14 1976-01-08 Karl Suess Kg, Praezisionsgeraete Fuer Wissenschaft Und Industrie, 8046 Garching Vorrichtung zum Anbringen einer Vielzahl äquidistanter Ritznuten auf einer Halbleiterscheibe
US3920168A (en) * 1975-01-15 1975-11-18 Barrie F Regan Apparatus for breaking semiconductor wafers
US4095344A (en) * 1976-08-24 1978-06-20 Loomis James W Scribe tool and mount therefor
US4296542A (en) * 1980-07-11 1981-10-27 Presco, Inc. Control of small parts in a manufacturing operation
KR900001232B1 (ko) * 1984-12-27 1990-03-05 가부시끼 가이샤 디스코 반도체 웨이퍼 방형절단기
US4653680A (en) * 1985-04-25 1987-03-31 Regan Barrie F Apparatus for breaking semiconductor wafers and the like
JPS6278123A (ja) * 1985-09-30 1987-04-10 Bandou Kiko Kk 数値制御によるガラス板加工機械
FR2648274B1 (fr) * 1989-06-07 1994-07-29 Commissariat Energie Atomique Procede et dispositif de marquage et de clivage de plaquettes de materiaux semi-conducteurs monocristallins
AT399865B (de) * 1990-05-15 1995-08-25 Lisec Peter Verfahren und vorrichtung zum brechen von glasscheiben
US5275077A (en) * 1991-02-27 1994-01-04 Mimaki Engineering Co., Ltd. Method of forming perforated cut line by cutting plotter
US5327625A (en) * 1992-08-13 1994-07-12 Massachusetts Institute Of Technology Apparatus for forming nanometric features on surfaces

Also Published As

Publication number Publication date
EP0740598B1 (en) 2005-03-23
AU1567895A (en) 1995-08-01
EP0740598A4 (en) 1997-04-23
WO1995019247A1 (en) 1995-07-20
IL112346A (en) 1998-08-16
DE69534098D1 (de) 2005-04-28
US5820006A (en) 1998-10-13
EP0740598A1 (en) 1996-11-06
ATE291529T1 (de) 2005-04-15
IL112346A0 (en) 1995-03-30
DE69534098T2 (de) 2006-02-09
TW273633B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1996-04-01

Similar Documents

Publication Publication Date Title
JPH09510927A (ja) 半導体ウェーハをスクライブ及び／又はブレークする方法及び装置
JP4289882B2 (ja) 電磁放射線束によって焼結、物質除去および／またはラベリングを行う装置
TWI404153B (zh) 晶圓之加工結果管理方法
JP6935168B2 (ja) 加工装置
JP4879012B2 (ja) 切削ブレードの先端形状検査方法
TWI818995B (zh) 加工裝置的控制方法
CN112225440A (zh) 玻璃切割系统及方法
JP2757036B2 (ja) マーキング方法及び装置
JP4210981B2 (ja) 劈開装置及び劈開方法
JP2008044033A (ja) ワイヤ放電加工機及びワイヤ放電加工方法
JP2008101938A (ja) 検査装置
JPH10258382A (ja) レーザ加工機における焦点位置の調整方法および補正方法並びにレーザ加工機
JP2000218505A (ja) ワーク切断装置およびワーク切断方法
KR100826274B1 (ko) 반도체 웨이퍼 쏘잉 장치를 이용한 부채꼴 패턴의 홈 가공방법
KR102595400B1 (ko) 가공 장치
CN110000936B (zh) 分断装置
CN223198624U (zh) 一种数控车床短料自动检测装置
JPH0655286A (ja) 板材の切断加工確認装置
JP3185295B2 (ja) マーキング装置
JPS6297796A (ja) プリント基板修復溶接機
JPH04106939A (ja) ダイボンディング装置
KR20240026095A (ko) 브레이킹 장치 및 브레이킹 방법
JP2947624B2 (ja) インナリードボンディング装置
JP2022126533A (ja) 材料管理システム
JP2022116492A (ja) 加工装置、プログラム、及び記憶媒体