JPH09219478A - ファン援用熱減少装置 - Google Patents

ファン援用熱減少装置

Info

Publication number
JPH09219478A
JPH09219478A JP9031141A JP3114197A JPH09219478A JP H09219478 A JPH09219478 A JP H09219478A JP 9031141 A JP9031141 A JP 9031141A JP 3114197 A JP3114197 A JP 3114197A JP H09219478 A JPH09219478 A JP H09219478A
Authority
JP
Japan
Prior art keywords
heat
cooling device
fan
cooling
vanes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9031141A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09219478A5 (enExample
Inventor
Guy R Wagner
ガイ・アール・ワグナー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JPH09219478A publication Critical patent/JPH09219478A/ja
Publication of JPH09219478A5 publication Critical patent/JPH09219478A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
JP9031141A 1996-02-01 1997-01-30 ファン援用熱減少装置 Pending JPH09219478A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/593,185 US5785116A (en) 1996-02-01 1996-02-01 Fan assisted heat sink device
US593,185 1996-02-01

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007180902A Division JP4728294B2 (ja) 1996-02-01 2007-07-10 ファン援用熱減少装置

Publications (2)

Publication Number Publication Date
JPH09219478A true JPH09219478A (ja) 1997-08-19
JPH09219478A5 JPH09219478A5 (enExample) 2004-12-24

Family

ID=24373737

Family Applications (2)

Application Number Title Priority Date Filing Date
JP9031141A Pending JPH09219478A (ja) 1996-02-01 1997-01-30 ファン援用熱減少装置
JP2007180902A Expired - Fee Related JP4728294B2 (ja) 1996-02-01 2007-07-10 ファン援用熱減少装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2007180902A Expired - Fee Related JP4728294B2 (ja) 1996-02-01 2007-07-10 ファン援用熱減少装置

Country Status (5)

Country Link
US (3) US5785116A (enExample)
JP (2) JPH09219478A (enExample)
CN (1) CN1132088C (enExample)
DE (1) DE19701938B4 (enExample)
GB (1) GB2309775B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085587A (ja) * 1999-08-13 2001-03-30 Agilent Technol Inc 電子デバイス用冷却装置
JP2008235932A (ja) * 2001-05-15 2008-10-02 Nvidia Corp グラフィックシステム
JP5930250B2 (ja) * 2013-03-06 2016-06-08 三菱電機株式会社 回転電機

Families Citing this family (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
JP2959506B2 (ja) * 1997-02-03 1999-10-06 日本電気株式会社 マルチチップモジュールの冷却構造
US6501652B2 (en) 1997-02-24 2002-12-31 Fujitsu Limited Heat sink and information processor using it
JP4290232B2 (ja) * 1997-02-24 2009-07-01 富士通株式会社 ヒートシンクとそれを使用する情報処理装置
GB2323434B (en) * 1997-03-22 2000-09-20 Imi Marston Ltd Heat sink
IT1294293B1 (it) 1997-07-31 1999-03-24 Maurizio Checchetti Dissipatore di calore
US6109341A (en) * 1998-04-30 2000-08-29 Sanyo Denki Co., Ltd. Electronic component cooling apparatus including elongated heat sink
US5998893A (en) * 1998-12-03 1999-12-07 Emerson Electric Co Integral heat sink and fan rectifier assembly
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6196302B1 (en) * 1999-03-16 2001-03-06 Wen-Hao Chuang Heat sink with multi-layer dispersion space
US6181556B1 (en) 1999-07-21 2001-01-30 Richard K. Allman Thermally-coupled heat dissipation apparatus for electronic devices
US20010050164A1 (en) * 1999-08-18 2001-12-13 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6851467B1 (en) 1999-08-30 2005-02-08 Molex Incorporated Heat sink assembly
USD428857S (en) * 1999-09-03 2000-08-01 Agilent Technologies Cooling device
USD438515S1 (en) 1999-09-20 2001-03-06 Mitsubishi Denki Kabushiki Kaisha Portion of heat sink
US6360816B1 (en) 1999-12-23 2002-03-26 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6557626B1 (en) 2000-01-11 2003-05-06 Molex Incorporated Heat sink retainer and Heat sink assembly using same
JP3869219B2 (ja) 2000-02-08 2007-01-17 山洋電気株式会社 ヒートシンクを備えた冷却装置
US6763881B1 (en) 2000-02-18 2004-07-20 Agilent Technologies, Inc. Thermally matched gradient heat sink
US6377458B1 (en) 2000-07-31 2002-04-23 Hewlett-Packard Company Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump
US6633484B1 (en) 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
WO2002041396A2 (en) * 2000-11-20 2002-05-23 Intel Corporation High performance heat sink configurations for use in high density packaging applications
US6501655B1 (en) 2000-11-20 2002-12-31 Intel Corporation High performance fin configuration for air cooled heat sinks
USD466871S1 (en) 2000-12-12 2002-12-10 Zalman Tech Co., Ltd Radiator for heat generating components in electronic equipment
US20020121365A1 (en) * 2001-03-05 2002-09-05 Kozyra Kazimierz L. Radial folded fin heat sink
JP3686005B2 (ja) 2001-03-30 2005-08-24 山洋電気株式会社 ヒートシンクを備えた冷却装置
US6459578B1 (en) 2001-04-24 2002-10-01 Agilent Technologies, Inc. Chassis having reduced acoustic noise and electromagnetic emissions and method of cooling components within a chassis
US6769175B2 (en) 2001-05-01 2004-08-03 Agilent Technologies, Inc. Heat sink device manufacture
US6479895B1 (en) 2001-05-18 2002-11-12 Intel Corporation High performance air cooled heat sinks used in high density packaging applications
US6517315B2 (en) 2001-05-29 2003-02-11 Hewlett-Packard Company Enhanced performance fan with the use of winglets
US6653755B2 (en) * 2001-05-30 2003-11-25 Intel Corporation Radial air flow fan assembly having stator fins surrounding rotor blades
AU2002316430A1 (en) * 2001-06-27 2003-03-03 Advanced Rotary Systems, Llc Cooler for electronic devices
US6505680B1 (en) * 2001-07-27 2003-01-14 Hewlett-Packard Company High performance cooling device
US6702001B2 (en) 2001-08-21 2004-03-09 Agilent Technologies, Inc. Heat transfer apparatus and method of manufacturing an integrated circuit and heat sink assembly
US6671172B2 (en) * 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US6705144B2 (en) 2001-09-10 2004-03-16 Intel Corporation Manufacturing process for a radial fin heat sink
US6657862B2 (en) 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
GB0129040D0 (en) * 2001-12-05 2002-01-23 Semikron Ltd Heat sinks for electrical or other apparatus
US20030131970A1 (en) * 2002-01-17 2003-07-17 Carter Daniel P. Heat sinks and method of formation
AU2003209610A1 (en) * 2002-01-30 2003-09-02 David Erel Heat-sink with large fins-to-air contact area
US6640883B2 (en) * 2002-02-14 2003-11-04 Glacialtech Inc. Computer heat sink
EP1343362A1 (en) * 2002-03-07 2003-09-10 Hewlett-Packard Company (a Delaware corporation) Cooling system for elecronic devices
USD473529S1 (en) 2002-04-04 2003-04-22 Designs For Vision, Inc. Heat sink for a fiber optic light source
US6650541B1 (en) * 2002-06-25 2003-11-18 Hewlett-Packard Development Company, L.P. Fan-securing device for use with a heat transfer device
USD481688S1 (en) 2002-08-30 2003-11-04 Hon Hai Precision Ind. Co., Ltd. Heat sink
US6631756B1 (en) * 2002-09-10 2003-10-14 Hewlett-Packard Development Company, L.P. High performance passive cooling device with ducting
US6830097B2 (en) 2002-09-27 2004-12-14 Modine Manufacturing Company Combination tower and serpentine fin heat sink device
USD490383S1 (en) 2002-11-15 2004-05-25 Delta Electronics, Inc. Heat sink with a three-dimensional curved surface
US6876550B2 (en) * 2002-12-13 2005-04-05 Hitachi Global Storage Technologies Netherlands B.V. Active heat sink for high power microprocessors
US6892800B2 (en) * 2002-12-31 2005-05-17 International Business Machines Corporation Omnidirectional fan-heatsinks
US20040190245A1 (en) * 2003-03-31 2004-09-30 Murli Tirumala Radial heat sink with skived-shaped fin and methods of making same
WO2004088492A1 (en) * 2003-04-03 2004-10-14 O-Fan Co., Ltd. A radiation body and a device cooling a heating element using the radiation body
JP2004349626A (ja) * 2003-05-26 2004-12-09 Toshiba Corp 冷却装置および冷却装置を搭載した電子機器
US7079390B2 (en) * 2003-06-05 2006-07-18 Hewlett-Packard Development, L.P. System and method for heat dissipation and air flow redirection in a chassis
CN1578614B (zh) * 2003-06-30 2010-04-21 山洋电气株式会社 轴流风扇装置和发热体冷却装置
US6837063B1 (en) 2003-07-31 2005-01-04 Dell Products L.P. Power management of a computer with vapor-cooled processor
CN2682581Y (zh) * 2003-12-11 2005-03-02 东莞莫仕连接器有限公司 散热装置的导风结构
US6963484B2 (en) * 2003-12-17 2005-11-08 Hewlett-Packard Development Company, L.P. Airflow blocker component that comprises a flexible flap portion
USD570301S1 (en) 2004-05-13 2008-06-03 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
USD541229S1 (en) 2004-05-13 2007-04-24 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
USD500745S1 (en) * 2004-05-25 2005-01-11 Cooler Master Co., Ltd. Heat-dissipation fins
US6948555B1 (en) * 2004-06-22 2005-09-27 Hewlett-Packard Development Company, L.P. Heat dissipating system and method
US20060011324A1 (en) * 2004-07-13 2006-01-19 Rogers C J Wound, louvered fin heat sink device
DE102004039228B4 (de) * 2004-08-12 2007-04-19 Fujitsu Siemens Computers Gmbh Kühlvorrichtung
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
US7390172B2 (en) * 2004-10-19 2008-06-24 Ebm-Papst St. Georgen Gmbh & Co. Kg Assembly used for cooling a circuit board or similar
US7296619B2 (en) * 2004-10-21 2007-11-20 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device with heat spreader
US7028757B1 (en) 2004-10-21 2006-04-18 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device with liquid chamber
US7164582B2 (en) * 2004-10-29 2007-01-16 Hewlett-Packard Development Company, L.P. Cooling system with submerged fan
CN2770091Y (zh) * 2004-12-24 2006-04-05 富准精密工业(深圳)有限公司 散热器
DE102005004695B3 (de) * 2005-02-02 2006-09-28 Fpe Fischer Gmbh Kühlkörper für elektrische Bauelemente
US20060256523A1 (en) * 2005-05-11 2006-11-16 Belady Christian L Fan and heat sink combination
US20070014089A1 (en) * 2005-07-18 2007-01-18 Jia-Lie Huang Radiator unit for an electronic component
CN100562232C (zh) * 2005-09-14 2009-11-18 富准精密工业(深圳)有限公司 热管散热装置
US7583502B2 (en) * 2006-06-13 2009-09-01 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)
WO2008035579A1 (fr) * 2006-09-19 2008-03-27 Nec Corporation Appareil de refroidissement
JP2008267176A (ja) * 2007-04-17 2008-11-06 Sony Corp 軸流ファン装置、ハウジング及び電子機器
USD576964S1 (en) * 2007-11-08 2008-09-16 Abl Ip Holding, Llc Heat sink
US7729119B2 (en) * 2007-11-28 2010-06-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CN201248224Y (zh) * 2008-07-18 2009-05-27 鸿富锦精密工业（深圳）有限公司 散热装置
TW201012374A (en) * 2008-09-09 2010-03-16 Sunonwealth Electr Mach Ind Co Heat dissipating device
USD604255S1 (en) 2008-10-23 2009-11-17 Abl Ip Holding Llc Heat sink
USD613257S1 (en) 2008-10-23 2010-04-06 Abl Ip Holding Llc Heat sink
US7972037B2 (en) 2008-11-26 2011-07-05 Deloren E. Anderson High intensity replaceable light emitting diode module and array
USD655833S1 (en) * 2010-04-15 2012-03-13 David Cowan Candle set with decorative overlapping surface
JP5668352B2 (ja) * 2010-07-30 2015-02-12 日本電産株式会社 軸流ファン及びスライド金型
US9810419B1 (en) 2010-12-03 2017-11-07 Gary K. MART LED light bulb
US8787021B2 (en) * 2011-06-17 2014-07-22 Hewlett-Packard Development Company, L.P. Memory cooler
US10174924B1 (en) * 2011-12-30 2019-01-08 Gary K. MART Heat sink for an LED light fixture
US11604035B2 (en) * 2013-09-29 2023-03-14 Huawei Technologies Co., Ltd. Support plateheat dissipation apparatus
US9639125B2 (en) 2013-10-31 2017-05-02 Microsoft Technology Licensing, Llc Centrifugal fan with integrated thermal transfer unit
US9746888B2 (en) 2014-09-12 2017-08-29 Microsoft Technology Licensing, Llc Uniform flow heat sink
JP6255533B2 (ja) * 2014-09-16 2017-12-27 フィリップス ライティング ホールディング ビー ヴィ 冷却ファン
US10393454B2 (en) * 2016-09-28 2019-08-27 The Boeing Company Valve system
USD849567S1 (en) * 2016-12-21 2019-05-28 Mecalc (Pty) Limited Electronic instruments casing
ZAF201602033S (en) * 2016-12-21 2019-10-30 Mecalc Pty Ltd Casing ¿ variations of vertical
CN107620718B (zh) * 2017-08-23 2019-04-09 安徽工程大学 一种微电子设备专用散热风扇结构
JP7205823B2 (ja) * 2018-12-05 2023-01-17 株式会社ニックス 把持機構及び運搬物搬送装置
WO2020231707A1 (en) * 2019-05-14 2020-11-19 The Regents Of The University Of California Illumination device for spatial and temporal control of morphogen signaling in cell cultures
US12054700B2 (en) 2019-05-14 2024-08-06 The Regents Of The University Of California Illumination device for spatial and temporal control of morphogen signaling in cell cultures
US12351605B2 (en) 2020-01-17 2025-07-08 The Johns Hopkins University Optically controllable FGFR stimulation using wireless controlled cellular lighting system
TWI832088B (zh) * 2021-09-13 2024-02-11 伍隆國際有限公司 流體裝置

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3592260A (en) * 1969-12-05 1971-07-13 Espey Mfg & Electronics Corp Heat exchanger with inner guide strip
FR2120197A5 (enExample) * 1970-08-04 1972-08-18 Lannionnais Electronique
DE2743708A1 (de) * 1977-09-28 1979-04-05 Siemens Ag Einrichtung zur ableitung der waerme aus einem hermetisch gekapselten geraet
JPS6047453B2 (ja) * 1978-01-13 1985-10-22 トヨタ自動車株式会社 内燃機関の冷却装置
US4233644A (en) * 1979-06-28 1980-11-11 International Business Machines Corporation Dual-pull air cooling for a computer frame
US4611238A (en) * 1982-05-05 1986-09-09 Burroughs Corporation Integrated circuit package incorporating low-stress omnidirectional heat sink
US4541004A (en) * 1982-11-24 1985-09-10 Burroughs Corporation Aerodynamically enhanced heat sink
US4489363A (en) * 1983-01-31 1984-12-18 Sperry Corporation Apparatus for cooling integrated circuit chips
US4620216A (en) * 1983-04-29 1986-10-28 International Business Machines Corporation Unitary slotted heat sink for semiconductor packages
US4546405A (en) * 1983-05-25 1985-10-08 International Business Machines Corporation Heat sink for electronic package
US4639829A (en) * 1984-06-29 1987-01-27 International Business Machines Corporation Thermal conduction disc-chip cooling enhancement means
US4662830A (en) * 1985-09-06 1987-05-05 Magnetic Peripherals Inc. Quiet centrifugal fan
US4715438A (en) * 1986-06-30 1987-12-29 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
US4784928A (en) * 1986-09-02 1988-11-15 Eastman Kodak Company Reusable electrophotographic element
US4682651A (en) * 1986-09-08 1987-07-28 Burroughs Corporation (Now Unisys Corporation) Segmented heat sink device
US4715430A (en) * 1986-10-27 1987-12-29 International Business Machines Corporation Environmentally secure and thermally efficient heat sink assembly
US4733293A (en) * 1987-02-13 1988-03-22 Unisys Corporation Heat sink device assembly for encumbered IC package
US4812733A (en) * 1987-10-27 1989-03-14 Richard Tobey Computer element performance enhancer
US5019880A (en) * 1988-01-07 1991-05-28 Prime Computer, Inc. Heat sink apparatus
US4884631A (en) * 1988-03-17 1989-12-05 California Institute Of Technology Forced air heat sink apparatus
JPH0286900A (ja) * 1988-06-25 1990-03-27 Nippon Spindle Mfg Co Ltd 研削廃液の濾過方法及びその装置
US4970579A (en) * 1988-09-21 1990-11-13 International Business Machines Corp. Integrated circuit package with improved cooling means
US5191230A (en) * 1989-01-30 1993-03-02 Heung Lap Yan Circuit module fan assembly
US5029236A (en) * 1989-05-10 1991-07-02 Sony Corporation Radiotelephone apparatus
US5000254A (en) * 1989-06-20 1991-03-19 Digital Equipment Corporation Dynamic heat sink
JPH0735727Y2 (ja) * 1989-06-30 1995-08-16 株式会社三井ハイテック 研削砥石の支持構造
JPH03229492A (ja) * 1990-02-05 1991-10-11 Seiko Electronic Components Ltd 遠心送風機
JPH05503300A (ja) * 1990-11-15 1993-06-03 ペンタファルム　アクチェンゲゼルシャフト メタ置換フェニルアラニン誘導体
JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
US5309983B1 (en) * 1992-06-23 1997-02-04 Pcubid Computer Tech Low profile integrated heat sink and fan assembly
DE4231122C2 (de) * 1992-09-17 1997-05-22 Heinrich Ing Grad Cap Kühlkörper mit Lüfter
US5484262A (en) * 1992-10-23 1996-01-16 Nidec Corporation Low profile fan body with heat transfer characteristics
US5288203A (en) * 1992-10-23 1994-02-22 Thomas Daniel L Low profile fan body with heat transfer characteristics
US5297617A (en) * 1992-12-22 1994-03-29 Edward Herbert Fan assembly with heat sink
US5445215A (en) * 1992-12-22 1995-08-29 Herbert; Edward Fan assembly with heat sink
US5299632A (en) * 1993-02-19 1994-04-05 Lee Lien Jung Fin device for an integrated circuit
JP2938704B2 (ja) * 1993-03-19 1999-08-25 富士通株式会社 集積回路パッケージ
US5272599A (en) * 1993-03-19 1993-12-21 Compaq Computer Corporation Microprocessor heat dissipation apparatus for a printed circuit board
US5287249A (en) * 1993-07-07 1994-02-15 Global Win Technology Co., Ltd. Fin assembly for an integrated circuit
JP3236137B2 (ja) * 1993-07-30 2001-12-10 富士通株式会社 半導体素子冷却装置
JP2765801B2 (ja) * 1993-08-20 1998-06-18 山洋電気株式会社 電子部品冷却装置
US5335722A (en) * 1993-09-30 1994-08-09 Global Win Technology Co., Ltd Cooling assembly for an integrated circuit
US5377745A (en) * 1993-11-30 1995-01-03 Hsieh; Hsin M. Cooling device for central processing unit
US5353863A (en) * 1994-03-07 1994-10-11 Yu Chi T Pentium CPU cooling device
GB2287837B (en) * 1994-03-09 1997-10-08 Ming Der Chiou CPU cooling device
DE9404388U1 (de) * 1994-03-16 1994-05-19 Chiou, Ming Der, Chung Ho, Taipeh Kühleinrichtung für eine CPU
US5409352A (en) * 1994-04-18 1995-04-25 Lin; Mike CPU heat dissipating device
US5437327A (en) * 1994-04-18 1995-08-01 Chiou; Ming Der CPU heat dissipating fan device
JPH0811302A (ja) * 1994-06-28 1996-01-16 Sanyo Electric Co Ltd 紙片等への液体インク付与方法
US5582240A (en) * 1994-09-19 1996-12-10 Motorola, Inc. Pneumatically coupled heat sink assembly
GB2295494B (en) * 1994-11-25 1996-10-23 Ming Der Chiou Power supplier of direct current
US5583746A (en) * 1994-12-12 1996-12-10 Tennmax Trading Corp. Heat sink assembly for a central processing unit of a computer
US5519575A (en) * 1995-02-14 1996-05-21 Chiou; Ming D. CPU cooling fan mounting structure
US5615084A (en) * 1995-06-30 1997-03-25 International Business Machines Corporation Enhanced flow distributor for integrated circuit spot coolers
GB2303970A (en) * 1995-07-31 1997-03-05 Ming Der Chiou CPU heat dissipating apparatus
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085587A (ja) * 1999-08-13 2001-03-30 Agilent Technol Inc 電子デバイス用冷却装置
JP2008235932A (ja) * 2001-05-15 2008-10-02 Nvidia Corp グラフィックシステム
JP5930250B2 (ja) * 2013-03-06 2016-06-08 三菱電機株式会社 回転電機

Also Published As

Publication number Publication date
DE19701938A1 (de) 1997-08-07
US6152214A (en) 2000-11-28
DE19701938B4 (de) 2004-12-23
US5785116A (en) 1998-07-28
GB2309775B (en) 2000-08-23
US5975194A (en) 1999-11-02
GB9625787D0 (en) 1997-01-29
JP4728294B2 (ja) 2011-07-20
CN1160240A (zh) 1997-09-24
GB2309775A (en) 1997-08-06
JP2007329490A (ja) 2007-12-20
CN1132088C (zh) 2003-12-24

Similar Documents

Publication Publication Date Title
JP4728294B2 (ja) ファン援用熱減少装置
US6401808B1 (en) Cooling apparatus for electronic devices and method
US6698499B1 (en) Cooling device and method
US5794685A (en) Heat sink device having radial heat and airflow paths
US7458415B2 (en) Cooling apparatus and electronic equipment
US7079394B2 (en) Compact cooling device
US7391611B2 (en) Heat-dissipating device and a housing thereof
US7120019B2 (en) Coaxial air ducts and fans for cooling and electronic component
US6118655A (en) Cooling fan with heat pipe-defined fan housing portion
JP3127821B2 (ja) ヒートシンク装置
JPH10500252A (ja) 熱伝導特性を持った背の低い形態のファンボディ
JP2000012751A (ja) 冷却ファン装置
JP2004104112A (ja) 受動冷却装置
US6769175B2 (en) Heat sink device manufacture
JP2004164492A (ja) コンピュータホストの放熱方法および放熱装置
JP3458527B2 (ja) ヒートシンク装置
KR20030096790A (ko) 컴퓨터 ｃｐｕ의 방열장치 및 방열방법
JP2003258473A (ja) ヒートシンクを備えた冷却装置
GB2348277A (en) A fan assisted heat sink cooling device
US20040080910A1 (en) Heat dissipating device
JPH1066305A (ja) ヒートシンク機能付きファンモータ
JP3662245B2 (ja) 電子部品冷却装置
JP2001185668A (ja) 電子部品冷却装置
JPH08274481A (ja) 電子部品冷却装置
JP3183291B2 (ja) ヒートシンク装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040122

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040122

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20060629

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061130

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070123

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20070329

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20070403

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070710

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080722

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081106

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20081126

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20090116

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100922