JPH09129670A5 - - Google Patents

Info

Publication number
JPH09129670A5
JPH09129670A5 JP1996264094A JP26409496A JPH09129670A5 JP H09129670 A5 JPH09129670 A5 JP H09129670A5 JP 1996264094 A JP1996264094 A JP 1996264094A JP 26409496 A JP26409496 A JP 26409496A JP H09129670 A5 JPH09129670 A5 JP H09129670A5
Authority
JP
Japan
Prior art keywords
package
substrate
conductive layer
conductive
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1996264094A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09129670A (ja
Filing date
Publication date
Priority claimed from US08/538,631 external-priority patent/US5637920A/en
Application filed filed Critical
Publication of JPH09129670A publication Critical patent/JPH09129670A/ja
Publication of JPH09129670A5 publication Critical patent/JPH09129670A5/ja
Pending legal-status Critical Current

Links

JP8264094A 1995-10-04 1996-10-04 フリップチップのための接点高密度型ボール・グリッド・アレー・パッケージ Pending JPH09129670A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US538631 1983-10-03
US08/538,631 US5637920A (en) 1995-10-04 1995-10-04 High contact density ball grid array package for flip-chips

Publications (2)

Publication Number Publication Date
JPH09129670A JPH09129670A (ja) 1997-05-16
JPH09129670A5 true JPH09129670A5 (https=) 2004-10-14

Family

ID=24147740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8264094A Pending JPH09129670A (ja) 1995-10-04 1996-10-04 フリップチップのための接点高密度型ボール・グリッド・アレー・パッケージ

Country Status (2)

Country Link
US (2) US5637920A (https=)
JP (1) JPH09129670A (https=)

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* Cited by examiner, † Cited by third party
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