JPH085826Y2 - Icカード用モジュール基板 - Google Patents
Icカード用モジュール基板Info
- Publication number
- JPH085826Y2 JPH085826Y2 JP4405190U JP4405190U JPH085826Y2 JP H085826 Y2 JPH085826 Y2 JP H085826Y2 JP 4405190 U JP4405190 U JP 4405190U JP 4405190 U JP4405190 U JP 4405190U JP H085826 Y2 JPH085826 Y2 JP H085826Y2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- module substrate
- substrate
- card
- bonding area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Credit Cards Or The Like (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4405190U JPH085826Y2 (ja) | 1990-04-26 | 1990-04-26 | Icカード用モジュール基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4405190U JPH085826Y2 (ja) | 1990-04-26 | 1990-04-26 | Icカード用モジュール基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH045977U JPH045977U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-01-20 |
JPH085826Y2 true JPH085826Y2 (ja) | 1996-02-21 |
Family
ID=31557005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4405190U Expired - Lifetime JPH085826Y2 (ja) | 1990-04-26 | 1990-04-26 | Icカード用モジュール基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH085826Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1990
- 1990-04-26 JP JP4405190U patent/JPH085826Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH045977U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-01-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7013039B2 (en) | Image processing method, an image processing device and a bonding apparatus | |
JPH085826Y2 (ja) | Icカード用モジュール基板 | |
JP2871696B2 (ja) | 集積回路装置 | |
JP2595962B2 (ja) | 半導体装置 | |
JPS62291126A (ja) | パタ−ン認識マ−ク | |
JP2767980B2 (ja) | リード巾の計測方法 | |
JPH07263482A (ja) | パターンマッチング方法及び半導体装置の製造方法 | |
JP2982794B1 (ja) | 半導体装置 | |
JP3447538B2 (ja) | パターン検査方法 | |
JP3528366B2 (ja) | 集積回路装置 | |
JP3480642B2 (ja) | パターンの検査方法 | |
JPH0219976B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JP3480641B2 (ja) | パターンの検査方法 | |
JP2001068820A (ja) | Ic用リードマーク | |
JP2592693Y2 (ja) | Ledプリントヘッド | |
JP2939582B2 (ja) | パターンの位置合わせ方法 | |
KR19990041909A (ko) | 반도체 칩 | |
JPH065729A (ja) | プリント配線板および半導体素子の位置合わせ方法 | |
JPH0612544Y2 (ja) | プローブカード | |
JPS60121793A (ja) | 厚膜混成集積回路基板の製造方法 | |
JPH055605A (ja) | 液晶パネルにおける位置計測方法 | |
JPH0691124B2 (ja) | Icパッケージ | |
JPS6155931A (ja) | 厚膜混成集積回路装置の製造方法 | |
JPS5927095B2 (ja) | フルオ−トワイヤボンディングのパタ−ン検出方法 | |
JPH0524679B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |