JPH045977U - - Google Patents

Info

Publication number
JPH045977U
JPH045977U JP4405190U JP4405190U JPH045977U JP H045977 U JPH045977 U JP H045977U JP 4405190 U JP4405190 U JP 4405190U JP 4405190 U JP4405190 U JP 4405190U JP H045977 U JPH045977 U JP H045977U
Authority
JP
Japan
Prior art keywords
pattern
card
linear
board
module board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4405190U
Other languages
English (en)
Japanese (ja)
Other versions
JPH085826Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4405190U priority Critical patent/JPH085826Y2/ja
Publication of JPH045977U publication Critical patent/JPH045977U/ja
Application granted granted Critical
Publication of JPH085826Y2 publication Critical patent/JPH085826Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Die Bonding (AREA)
JP4405190U 1990-04-26 1990-04-26 Icカード用モジュール基板 Expired - Lifetime JPH085826Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4405190U JPH085826Y2 (ja) 1990-04-26 1990-04-26 Icカード用モジュール基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4405190U JPH085826Y2 (ja) 1990-04-26 1990-04-26 Icカード用モジュール基板

Publications (2)

Publication Number Publication Date
JPH045977U true JPH045977U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-01-20
JPH085826Y2 JPH085826Y2 (ja) 1996-02-21

Family

ID=31557005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4405190U Expired - Lifetime JPH085826Y2 (ja) 1990-04-26 1990-04-26 Icカード用モジュール基板

Country Status (1)

Country Link
JP (1) JPH085826Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPH085826Y2 (ja) 1996-02-21

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term