JPH08173875A - 塗布装置および塗布方法 - Google Patents

塗布装置および塗布方法

Info

Publication number
JPH08173875A
JPH08173875A JP6320497A JP32049794A JPH08173875A JP H08173875 A JPH08173875 A JP H08173875A JP 6320497 A JP6320497 A JP 6320497A JP 32049794 A JP32049794 A JP 32049794A JP H08173875 A JPH08173875 A JP H08173875A
Authority
JP
Japan
Prior art keywords
substrate
coating liquid
coating
liquid supply
nozzle head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6320497A
Other languages
English (en)
Japanese (ja)
Inventor
Takayuki Baba
隆幸 馬場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP6320497A priority Critical patent/JPH08173875A/ja
Priority to KR1019950038686A priority patent/KR0149567B1/ko
Publication of JPH08173875A publication Critical patent/JPH08173875A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0283—Flat jet coaters, i.e. apparatus in which the liquid or other fluent material is projected from the outlet as a cohesive flat jet in direction of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP6320497A 1994-12-22 1994-12-22 塗布装置および塗布方法 Pending JPH08173875A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6320497A JPH08173875A (ja) 1994-12-22 1994-12-22 塗布装置および塗布方法
KR1019950038686A KR0149567B1 (ko) 1994-12-22 1995-10-31 도포장치 및 도포방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6320497A JPH08173875A (ja) 1994-12-22 1994-12-22 塗布装置および塗布方法

Publications (1)

Publication Number Publication Date
JPH08173875A true JPH08173875A (ja) 1996-07-09

Family

ID=18122116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6320497A Pending JPH08173875A (ja) 1994-12-22 1994-12-22 塗布装置および塗布方法

Country Status (2)

Country Link
JP (1) JPH08173875A (ko)
KR (1) KR0149567B1 (ko)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002053297A1 (fr) * 2000-12-27 2002-07-11 Toray Industries, Inc. Embout buccal et dispositif, et procede d'application d'un fluide de revetement
JP2006122891A (ja) * 2004-10-01 2006-05-18 Hirano Tecseed Co Ltd 塗工装置
JP2008043950A (ja) * 2000-12-27 2008-02-28 Toray Ind Inc 口金並びに塗液の塗布装置および塗布方法
JP2011523891A (ja) * 2008-05-19 2011-08-25 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 薄層を溶液コーティングするための装置および方法
JP2012195532A (ja) * 2011-03-18 2012-10-11 Tokyo Electron Ltd 塗布膜形成装置及び塗布膜形成方法
JP2013243262A (ja) * 2012-05-21 2013-12-05 Tokyo Electron Ltd 塗布方法、塗布装置、及びコンピュータ可読記憶媒体
JP2014008424A (ja) * 2012-06-27 2014-01-20 Tokyo Electron Ltd 塗布装置および塗布液充填方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4004216B2 (ja) * 2000-09-04 2007-11-07 東京応化工業株式会社 塗布装置
KR100780718B1 (ko) 2004-12-28 2007-12-26 엘지.필립스 엘시디 주식회사 도포액 공급장치를 구비한 슬릿코터
KR100675643B1 (ko) 2004-12-31 2007-02-02 엘지.필립스 엘시디 주식회사 슬릿코터
KR100700181B1 (ko) 2004-12-31 2007-03-27 엘지.필립스 엘시디 주식회사 노즐대기부를 구비한 슬릿코터 및 이를 이용한 코팅방법
KR102379011B1 (ko) * 2014-12-31 2022-03-29 세메스 주식회사 기판 처리 장치, 토출량 측정 유닛, 그리고 기판 처리 방법

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002053297A1 (fr) * 2000-12-27 2002-07-11 Toray Industries, Inc. Embout buccal et dispositif, et procede d'application d'un fluide de revetement
JP2008043950A (ja) * 2000-12-27 2008-02-28 Toray Ind Inc 口金並びに塗液の塗布装置および塗布方法
KR100855163B1 (ko) * 2000-12-27 2008-08-29 도레이 가부시끼가이샤 구금 및 액체의 도포 장치 및 도포 방법
JP2006122891A (ja) * 2004-10-01 2006-05-18 Hirano Tecseed Co Ltd 塗工装置
JP4673157B2 (ja) * 2004-10-01 2011-04-20 株式会社ヒラノテクシード 塗工装置
JP2011523891A (ja) * 2008-05-19 2011-08-25 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 薄層を溶液コーティングするための装置および方法
JP2012195532A (ja) * 2011-03-18 2012-10-11 Tokyo Electron Ltd 塗布膜形成装置及び塗布膜形成方法
JP2013243262A (ja) * 2012-05-21 2013-12-05 Tokyo Electron Ltd 塗布方法、塗布装置、及びコンピュータ可読記憶媒体
JP2014008424A (ja) * 2012-06-27 2014-01-20 Tokyo Electron Ltd 塗布装置および塗布液充填方法
US9238245B2 (en) 2012-06-27 2016-01-19 Tokyo Electron Limited Coating apparatus and method for filling coating liquid
TWI579054B (zh) * 2012-06-27 2017-04-21 東京威力科創股份有限公司 塗布裝置及塗布液充塡方法

Also Published As

Publication number Publication date
KR0149567B1 (ko) 1998-10-15
KR960021170A (ko) 1996-07-18

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