JPH079614Y2 - 熱硬化性樹脂封止用金型 - Google Patents

熱硬化性樹脂封止用金型

Info

Publication number
JPH079614Y2
JPH079614Y2 JP1989030867U JP3086789U JPH079614Y2 JP H079614 Y2 JPH079614 Y2 JP H079614Y2 JP 1989030867 U JP1989030867 U JP 1989030867U JP 3086789 U JP3086789 U JP 3086789U JP H079614 Y2 JPH079614 Y2 JP H079614Y2
Authority
JP
Japan
Prior art keywords
gate
mold
cavity
resin
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989030867U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02121910U (enExample
Inventor
隆義 古賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Japan Radio Co Ltd
Original Assignee
New Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Japan Radio Co Ltd filed Critical New Japan Radio Co Ltd
Priority to JP1989030867U priority Critical patent/JPH079614Y2/ja
Publication of JPH02121910U publication Critical patent/JPH02121910U/ja
Application granted granted Critical
Publication of JPH079614Y2 publication Critical patent/JPH079614Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1989030867U 1989-03-20 1989-03-20 熱硬化性樹脂封止用金型 Expired - Fee Related JPH079614Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989030867U JPH079614Y2 (ja) 1989-03-20 1989-03-20 熱硬化性樹脂封止用金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989030867U JPH079614Y2 (ja) 1989-03-20 1989-03-20 熱硬化性樹脂封止用金型

Publications (2)

Publication Number Publication Date
JPH02121910U JPH02121910U (enExample) 1990-10-04
JPH079614Y2 true JPH079614Y2 (ja) 1995-03-08

Family

ID=31256302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989030867U Expired - Fee Related JPH079614Y2 (ja) 1989-03-20 1989-03-20 熱硬化性樹脂封止用金型

Country Status (1)

Country Link
JP (1) JPH079614Y2 (enExample)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61186416U (enExample) * 1985-05-15 1986-11-20
JPS6237119A (ja) * 1985-08-10 1987-02-18 Fujitsu Ltd モ−ルド金型およびモ−ルド方法
JPS6311314A (ja) * 1986-07-02 1988-01-18 Matsushita Electric Ind Co Ltd 樹脂成形金型
JPS6448432A (en) * 1987-08-19 1989-02-22 Hitachi Ltd Molding die and manufacture of semiconductor device by using said die

Also Published As

Publication number Publication date
JPH02121910U (enExample) 1990-10-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees