JPH0379431U - - Google Patents
Info
- Publication number
- JPH0379431U JPH0379431U JP1989139774U JP13977489U JPH0379431U JP H0379431 U JPH0379431 U JP H0379431U JP 1989139774 U JP1989139774 U JP 1989139774U JP 13977489 U JP13977489 U JP 13977489U JP H0379431 U JPH0379431 U JP H0379431U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- encapsulation
- board
- hybrid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989139774U JPH0379431U (enExample) | 1989-11-30 | 1989-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989139774U JPH0379431U (enExample) | 1989-11-30 | 1989-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0379431U true JPH0379431U (enExample) | 1991-08-13 |
Family
ID=31686800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989139774U Pending JPH0379431U (enExample) | 1989-11-30 | 1989-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0379431U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009088520A (ja) * | 2007-09-27 | 2009-04-23 | Samsung Electro Mech Co Ltd | 発光素子パッケージの製造方法 |
| JP2013115175A (ja) * | 2011-11-28 | 2013-06-10 | Nissan Motor Co Ltd | 半導体装置、半導体装置の製造装置、および半導体装置の製造方法 |
-
1989
- 1989-11-30 JP JP1989139774U patent/JPH0379431U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009088520A (ja) * | 2007-09-27 | 2009-04-23 | Samsung Electro Mech Co Ltd | 発光素子パッケージの製造方法 |
| US8202746B2 (en) | 2007-09-27 | 2012-06-19 | Samsung Led Co., Ltd. | Method of manufacturing LED package for formation of molding member |
| JP2013115175A (ja) * | 2011-11-28 | 2013-06-10 | Nissan Motor Co Ltd | 半導体装置、半導体装置の製造装置、および半導体装置の製造方法 |