JPH0227745U - - Google Patents

Info

Publication number
JPH0227745U
JPH0227745U JP1988106119U JP10611988U JPH0227745U JP H0227745 U JPH0227745 U JP H0227745U JP 1988106119 U JP1988106119 U JP 1988106119U JP 10611988 U JP10611988 U JP 10611988U JP H0227745 U JPH0227745 U JP H0227745U
Authority
JP
Japan
Prior art keywords
leads
plane
package
chip
built
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988106119U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988106119U priority Critical patent/JPH0227745U/ja
Publication of JPH0227745U publication Critical patent/JPH0227745U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/884
    • H10W90/736
    • H10W90/756

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1988106119U 1988-08-11 1988-08-11 Pending JPH0227745U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988106119U JPH0227745U (enExample) 1988-08-11 1988-08-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988106119U JPH0227745U (enExample) 1988-08-11 1988-08-11

Publications (1)

Publication Number Publication Date
JPH0227745U true JPH0227745U (enExample) 1990-02-22

Family

ID=31339346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988106119U Pending JPH0227745U (enExample) 1988-08-11 1988-08-11

Country Status (1)

Country Link
JP (1) JPH0227745U (enExample)

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