JPH0328756U - - Google Patents
Info
- Publication number
- JPH0328756U JPH0328756U JP1989088726U JP8872689U JPH0328756U JP H0328756 U JPH0328756 U JP H0328756U JP 1989088726 U JP1989088726 U JP 1989088726U JP 8872689 U JP8872689 U JP 8872689U JP H0328756 U JPH0328756 U JP H0328756U
- Authority
- JP
- Japan
- Prior art keywords
- additional functional
- functional component
- lead frame
- semiconductor device
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989088726U JPH0648876Y2 (ja) | 1989-07-27 | 1989-07-27 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989088726U JPH0648876Y2 (ja) | 1989-07-27 | 1989-07-27 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0328756U true JPH0328756U (enExample) | 1991-03-22 |
| JPH0648876Y2 JPH0648876Y2 (ja) | 1994-12-12 |
Family
ID=31638322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989088726U Expired - Fee Related JPH0648876Y2 (ja) | 1989-07-27 | 1989-07-27 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648876Y2 (enExample) |
-
1989
- 1989-07-27 JP JP1989088726U patent/JPH0648876Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648876Y2 (ja) | 1994-12-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |