JPH0328756U - - Google Patents

Info

Publication number
JPH0328756U
JPH0328756U JP1989088726U JP8872689U JPH0328756U JP H0328756 U JPH0328756 U JP H0328756U JP 1989088726 U JP1989088726 U JP 1989088726U JP 8872689 U JP8872689 U JP 8872689U JP H0328756 U JPH0328756 U JP H0328756U
Authority
JP
Japan
Prior art keywords
additional functional
functional component
lead frame
semiconductor device
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989088726U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0648876Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989088726U priority Critical patent/JPH0648876Y2/ja
Publication of JPH0328756U publication Critical patent/JPH0328756U/ja
Application granted granted Critical
Publication of JPH0648876Y2 publication Critical patent/JPH0648876Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/5363
    • H10W72/5475
    • H10W90/756

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1989088726U 1989-07-27 1989-07-27 半導体装置 Expired - Fee Related JPH0648876Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989088726U JPH0648876Y2 (ja) 1989-07-27 1989-07-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989088726U JPH0648876Y2 (ja) 1989-07-27 1989-07-27 半導体装置

Publications (2)

Publication Number Publication Date
JPH0328756U true JPH0328756U (enExample) 1991-03-22
JPH0648876Y2 JPH0648876Y2 (ja) 1994-12-12

Family

ID=31638322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989088726U Expired - Fee Related JPH0648876Y2 (ja) 1989-07-27 1989-07-27 半導体装置

Country Status (1)

Country Link
JP (1) JPH0648876Y2 (enExample)

Also Published As

Publication number Publication date
JPH0648876Y2 (ja) 1994-12-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees