JPH0740626B2 - フレキシブル銅張回路基板 - Google Patents

フレキシブル銅張回路基板

Info

Publication number
JPH0740626B2
JPH0740626B2 JP61-503558A JP50355886A JPH0740626B2 JP H0740626 B2 JPH0740626 B2 JP H0740626B2 JP 50355886 A JP50355886 A JP 50355886A JP H0740626 B2 JPH0740626 B2 JP H0740626B2
Authority
JP
Japan
Prior art keywords
polyimide
dianhydride
bis
circuit board
clad circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61-503558A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO1988000428A1 (ja
JPH0740626B1 (enExample
Inventor
正博 太田
三郎 川島
善穂 園部
正司 玉井
英明 及川
彰宏 山口
Original Assignee
三井東圧化学株式会社
Filing date
Publication date
Application filed by 三井東圧化学株式会社 filed Critical 三井東圧化学株式会社
Publication of JPWO1988000428A1 publication Critical patent/JPWO1988000428A1/ja
Publication of JPH0740626B2 publication Critical patent/JPH0740626B2/ja
Publication of JPH0740626B1 publication Critical patent/JPH0740626B1/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Laminated Bodies (AREA)
JP61-503558A 1986-06-30 フレキシブル銅張回路基板 Expired - Lifetime JPH0740626B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1986/000334 WO1988000428A1 (fr) 1986-06-30 1986-06-30 Carte de circuit imprime flexible revetue de cuivre

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6154587A Division JP2514313B2 (ja) 1994-07-06 1994-07-06 フレキシブル銅張回路基板

Publications (3)

Publication Number Publication Date
JPWO1988000428A1 JPWO1988000428A1 (ja) 1988-04-07
JPH0740626B2 true JPH0740626B2 (ja) 1995-05-01
JPH0740626B1 JPH0740626B1 (enExample) 1995-05-01

Family

ID=13874480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61-503558A Expired - Lifetime JPH0740626B2 (ja) 1986-06-30 フレキシブル銅張回路基板

Country Status (6)

Country Link
EP (1) EP0270672B1 (enExample)
JP (1) JPH0740626B2 (enExample)
KR (1) KR910002267B1 (enExample)
AU (1) AU599325B2 (enExample)
DE (1) DE3689881T2 (enExample)
WO (1) WO1988000428A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0721442B2 (ja) * 1989-03-27 1995-03-08 日本電信電話株式会社 電子顕微鏡検体調整法及び電子顕微鏡検体調整器具
US5192619A (en) * 1988-06-30 1993-03-09 Chisso Corporation Flexible copper-applied substrates
JPH0710583B2 (ja) * 1988-06-30 1995-02-08 チッソ株式会社 可撓性銅張基板
JP3523952B2 (ja) * 1995-12-26 2004-04-26 日東電工株式会社 ポリイミド−金属箔複合フィルム
WO2004085146A1 (en) 2003-03-26 2004-10-07 Lg Chem Ltd Double-sided metallic laminate and method for manufacturing the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5235281A (en) * 1975-09-16 1977-03-17 Sumitomo Bakelite Co Ltd Peparation of flexible base for printed circuit
DE3175384D1 (en) * 1980-09-15 1986-10-30 Ciba Geigy Ag Use of flexible materials in printed circuits
JPS57181857A (en) * 1981-05-06 1982-11-09 Ube Industries Polyimide laminated material and its manufacture
JPS58155790A (ja) * 1982-03-10 1983-09-16 日立化成工業株式会社 可撓性印刷回路用基板の製造法
EP0089387A1 (en) * 1982-03-19 1983-09-28 Uop Inc. Preparation of copper-clad laminates
JPS58190092A (ja) * 1982-04-30 1983-11-05 宇部興産株式会社 フレキシブル配線基板の製造法
EP0116297B1 (de) * 1983-01-15 1987-12-02 Akzo GmbH Polyimid-Laminate mit hoher Schälfestigkeit und Verfahren zu deren Herstellung
JPS60243120A (ja) * 1984-05-18 1985-12-03 Hitachi Ltd フレキシブルプリント基板の製造方法
US4681928A (en) * 1984-06-01 1987-07-21 M&T Chemicals Inc. Poly(amide-amide acid), polyamide acid, poly(esteramide acid), poly(amide-imide), polyimide, poly(esterimide) from poly arylene diamine
US4839232A (en) * 1985-10-31 1989-06-13 Mitsui Toatsu Chemicals, Incorporated Flexible laminate printed-circuit board and methods of making same
JPH05235281A (ja) * 1992-02-19 1993-09-10 Sharp Corp 半導体集積回路

Also Published As

Publication number Publication date
AU599325B2 (en) 1990-07-19
DE3689881T2 (de) 1995-01-05
KR880701520A (ko) 1988-07-27
KR910002267B1 (ko) 1991-04-08
EP0270672B1 (en) 1994-06-01
EP0270672A4 (en) 1989-04-24
DE3689881D1 (de) 1994-07-07
WO1988000428A1 (fr) 1988-01-14
JPH0740626B1 (enExample) 1995-05-01
EP0270672A1 (en) 1988-06-15
AU6122186A (en) 1988-01-29

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