DE3689881T2 - Mit kupfer kaschierte biegsame gedruckte schaltungsplatte. - Google Patents

Mit kupfer kaschierte biegsame gedruckte schaltungsplatte.

Info

Publication number
DE3689881T2
DE3689881T2 DE3689881T DE3689881T DE3689881T2 DE 3689881 T2 DE3689881 T2 DE 3689881T2 DE 3689881 T DE3689881 T DE 3689881T DE 3689881 T DE3689881 T DE 3689881T DE 3689881 T2 DE3689881 T2 DE 3689881T2
Authority
DE
Germany
Prior art keywords
polyimide
radical
copper foil
film
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3689881T
Other languages
German (de)
English (en)
Other versions
DE3689881D1 (de
Inventor
Saburo Kawashima
Masahiro Ohta
Hideaki Oikawa
Yoshiho Sonobe
Shoji Tamai
Akihiro Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Application granted granted Critical
Publication of DE3689881D1 publication Critical patent/DE3689881D1/de
Publication of DE3689881T2 publication Critical patent/DE3689881T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B2037/0092—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding in which absence of adhesives is explicitly presented as an advantage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Laminated Bodies (AREA)
DE3689881T 1986-06-30 1986-06-30 Mit kupfer kaschierte biegsame gedruckte schaltungsplatte. Expired - Fee Related DE3689881T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1986/000334 WO1988000428A1 (fr) 1986-06-30 1986-06-30 Carte de circuit imprime flexible revetue de cuivre

Publications (2)

Publication Number Publication Date
DE3689881D1 DE3689881D1 (de) 1994-07-07
DE3689881T2 true DE3689881T2 (de) 1995-01-05

Family

ID=13874480

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3689881T Expired - Fee Related DE3689881T2 (de) 1986-06-30 1986-06-30 Mit kupfer kaschierte biegsame gedruckte schaltungsplatte.

Country Status (6)

Country Link
EP (1) EP0270672B1 (enExample)
JP (1) JPH0740626B2 (enExample)
KR (1) KR910002267B1 (enExample)
AU (1) AU599325B2 (enExample)
DE (1) DE3689881T2 (enExample)
WO (1) WO1988000428A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0721442B2 (ja) * 1989-03-27 1995-03-08 日本電信電話株式会社 電子顕微鏡検体調整法及び電子顕微鏡検体調整器具
US5192619A (en) * 1988-06-30 1993-03-09 Chisso Corporation Flexible copper-applied substrates
JPH0710583B2 (ja) * 1988-06-30 1995-02-08 チッソ株式会社 可撓性銅張基板
JP3523952B2 (ja) * 1995-12-26 2004-04-26 日東電工株式会社 ポリイミド−金属箔複合フィルム
WO2004085146A1 (en) 2003-03-26 2004-10-07 Lg Chem Ltd Double-sided metallic laminate and method for manufacturing the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5235281A (en) * 1975-09-16 1977-03-17 Sumitomo Bakelite Co Ltd Peparation of flexible base for printed circuit
DE3175384D1 (en) * 1980-09-15 1986-10-30 Ciba Geigy Ag Use of flexible materials in printed circuits
JPS57181857A (en) * 1981-05-06 1982-11-09 Ube Industries Polyimide laminated material and its manufacture
JPS58155790A (ja) * 1982-03-10 1983-09-16 日立化成工業株式会社 可撓性印刷回路用基板の製造法
EP0089387A1 (en) * 1982-03-19 1983-09-28 Uop Inc. Preparation of copper-clad laminates
JPS58190092A (ja) * 1982-04-30 1983-11-05 宇部興産株式会社 フレキシブル配線基板の製造法
EP0116297B1 (de) * 1983-01-15 1987-12-02 Akzo GmbH Polyimid-Laminate mit hoher Schälfestigkeit und Verfahren zu deren Herstellung
JPS60243120A (ja) * 1984-05-18 1985-12-03 Hitachi Ltd フレキシブルプリント基板の製造方法
US4681928A (en) * 1984-06-01 1987-07-21 M&T Chemicals Inc. Poly(amide-amide acid), polyamide acid, poly(esteramide acid), poly(amide-imide), polyimide, poly(esterimide) from poly arylene diamine
US4839232A (en) * 1985-10-31 1989-06-13 Mitsui Toatsu Chemicals, Incorporated Flexible laminate printed-circuit board and methods of making same
JPH05235281A (ja) * 1992-02-19 1993-09-10 Sharp Corp 半導体集積回路

Also Published As

Publication number Publication date
AU599325B2 (en) 1990-07-19
JPH0740626B2 (ja) 1995-05-01
KR880701520A (ko) 1988-07-27
KR910002267B1 (ko) 1991-04-08
EP0270672B1 (en) 1994-06-01
EP0270672A4 (en) 1989-04-24
DE3689881D1 (de) 1994-07-07
WO1988000428A1 (fr) 1988-01-14
JPH0740626B1 (enExample) 1995-05-01
EP0270672A1 (en) 1988-06-15
AU6122186A (en) 1988-01-29

Similar Documents

Publication Publication Date Title
DE3650656T2 (de) Polyimide und diese enthaltende hitzebeständige klebemittel
DE69115171T2 (de) Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.
DE68925490T2 (de) Flexible Grundmaterialen für Leiterplatten
DE3788937T2 (de) Polyimide.
DE3586948T2 (de) Polyamidsaeure-loesung und daraus hergestellter film.
DE3788441T2 (de) Polyimid und seine Verwendung als Hochtemperaturklebstoff.
DE60016217T2 (de) Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung
DE69323899T2 (de) Wärmebeständiger klebefilm für leiterplatten und dessen verwendungsverfahren
DE69125694T2 (de) Tetrapolyimid-Film enthaltend Benzophenon Tetracarboxyl Dianhydrid
DE3789296T2 (de) Polyimid mit Formstabilität beim Erhitzen.
DE69107245T2 (de) Polyimidosiloxan-Harz, Zusammensetzung daraus und Methode zur Anwendung.
DE69118232T2 (de) Copolyimid Film
DE69120379T2 (de) Verfahren zur Herstellung von einer mit einer Deckschicht überzogenen biegsamen Leiterplatte
DE60100329T2 (de) Polyimidfilm sowie Verfahren zu dessen Herstellung und dessen Verwendung als Substrat für Metallverbindungsplatten
DE69225018T2 (de) Hitzebeständiger Klebstoff und Verfahren zur Bindung damit
DE69519919T2 (de) Mehrschichtfilm aus aromatischen Polyimid ohne Klebstoff
DE19756554A1 (de) Siloxan-Polyimid und ein Siloxan-Polyimid-haltiges, wärmebeständiges Haftmittel
DE3783477T2 (de) Hochtemperatur-polyimidklebstoff.
DE3301197A1 (de) Polyimid-laminate mit hoher schaelfestigkeit
DE10008121A1 (de) Verfahren zur Herstellung von Polyamidsäure und Polyimid
DE69318675T2 (de) Klebefilm und seine herstellung
DE69304086T2 (de) Polyimide, ritzehärtbare Harzzusammensetzungen mit den Polyimide, Formkörper auf die Harzzusammensetzungen und Verfahren zur Herstellung von deren Polyimiden
DE19804617A1 (de) Siloxan-Polyimid und wärmebeständiges Haftmittel, das dasselbe enthält
DE602004007068T2 (de) Polyamidimidharz, Verfahren zu seiner Herstellung, Polyamidimidzusammensetzung, daraus hergestellte filmbildendes Material und Klebstoff für elektronische Teile
DE3587722T2 (de) Klebstoff, Überzüge und vorimprägnierte Harzfasermatten auf Basis von Polyimiden.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: MITSUI CHEMICALS, INC., TOKIO/TOKYO, JP

8339 Ceased/non-payment of the annual fee