DE69118232T2 - Copolyimid Film - Google Patents

Copolyimid Film

Info

Publication number
DE69118232T2
DE69118232T2 DE69118232T DE69118232T DE69118232T2 DE 69118232 T2 DE69118232 T2 DE 69118232T2 DE 69118232 T DE69118232 T DE 69118232T DE 69118232 T DE69118232 T DE 69118232T DE 69118232 T2 DE69118232 T2 DE 69118232T2
Authority
DE
Germany
Prior art keywords
copolyimide film
copolyimide
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69118232T
Other languages
English (en)
Other versions
DE69118232D1 (de
Inventor
John Anthony Kreuz
Richard Frederich Sutton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE69118232D1 publication Critical patent/DE69118232D1/de
Application granted granted Critical
Publication of DE69118232T2 publication Critical patent/DE69118232T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Moulding By Coating Moulds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE69118232T 1990-04-30 1991-04-30 Copolyimid Film Expired - Fee Related DE69118232T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/516,887 US5166308A (en) 1990-04-30 1990-04-30 Copolyimide film with improved properties

Publications (2)

Publication Number Publication Date
DE69118232D1 DE69118232D1 (de) 1996-05-02
DE69118232T2 true DE69118232T2 (de) 1996-12-12

Family

ID=24057502

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69118232T Expired - Fee Related DE69118232T2 (de) 1990-04-30 1991-04-30 Copolyimid Film

Country Status (5)

Country Link
US (1) US5166308A (de)
EP (1) EP0455208B1 (de)
JP (1) JP3103398B2 (de)
CA (1) CA2041545A1 (de)
DE (1) DE69118232T2 (de)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
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KR100229637B1 (ko) * 1991-03-12 1999-11-15 엔다 나오또 2층 tab 테이프의 제조방법
US5393864A (en) * 1993-04-26 1995-02-28 E. I. Du Pont De Nemours And Company Wet-etchable random polyimide copolymer for multichip module applications
US5830564A (en) * 1996-03-01 1998-11-03 Ube Industries, Ltd. Aromatic polyimide film
US5716677A (en) * 1996-03-21 1998-02-10 Ohio Aerospace Institute Protective coatings for polyimide composites
US6143399A (en) * 1997-03-03 2000-11-07 Ube Industries, Ltd. Aromatic polyimide film
US5859171A (en) * 1997-05-21 1999-01-12 Dupont Toray Polyimide copolymer, polyimide copolymer resin molded products and their preparation
US6277495B1 (en) 1997-07-18 2001-08-21 E. I. Du Pont De Nemours And Company Polyimide film, a method for its manufacture and a polyimide film containing metal laminated plate
TW531547B (en) * 1998-08-25 2003-05-11 Kaneka Corp Polyimide film and process for producing the same
KR100657729B1 (ko) * 1999-10-21 2006-12-13 신닛테츠가가쿠 가부시키가이샤 적층체 및 그의 제조방법
US6476182B1 (en) 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6444783B1 (en) 2000-12-21 2002-09-03 E. I. Du Pont De Nemours And Company Melt-processible semicrystalline block copolyimides
US6469126B1 (en) 2000-12-21 2002-10-22 E. I. Du Pont De Nmeours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6476177B2 (en) 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6956098B2 (en) * 2002-09-20 2005-10-18 E. I. Du Pont De Nemours And Company High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto
US7267883B2 (en) * 2002-09-25 2007-09-11 Kaneka Corporation Polyimide film and laminate having metal layer and same
US7026436B2 (en) * 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
US6949296B2 (en) 2002-12-31 2005-09-27 E. I. Du Pont De Nemours And Company Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto
US7442727B2 (en) * 2003-06-04 2008-10-28 Degussa Ag Pyrogenically prepared, surface modified aluminum oxide
US7285321B2 (en) 2003-11-12 2007-10-23 E.I. Du Pont De Nemours And Company Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto
JP4686742B2 (ja) * 2004-12-27 2011-05-25 大阪府 ポリイミド湿潤ゲル及びその製造方法
US7504150B2 (en) 2005-06-15 2009-03-17 E.I. Du Pont De Nemours & Company Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto
US20090226642A1 (en) * 2005-08-03 2009-09-10 E. I. Du Pont De Nemours And Company Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
US7550194B2 (en) * 2005-08-03 2009-06-23 E. I. Du Pont De Nemours And Company Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
KR100789616B1 (ko) 2005-08-19 2007-12-27 주식회사 엘지화학 폴리이미드 필름 및 이를 이용한 동장 적층판
US7338715B2 (en) * 2005-12-30 2008-03-04 E.I. Du Pont De Nemours And Company Low temperature cure polyimide compositions resistant to arc tracking and methods relating thereto
US20070231588A1 (en) * 2006-03-31 2007-10-04 Karthikeyan Kanakarajan Capacitive polyimide laminate
US20070232734A1 (en) * 2006-03-31 2007-10-04 Karthikeyan Kanakarajan Polyimide based compositions useful in high frequency circuitry applications and methods relating thereto
JPWO2008004496A1 (ja) * 2006-07-06 2009-12-03 東レ株式会社 熱可塑性ポリイミド、これを用いた積層ポリイミドフィルムならびに金属箔積層ポリイミドフィルム
US20080213605A1 (en) * 2006-12-07 2008-09-04 Briney Gary C Multi-functional circuitry substrates and compositions and methods relating thereto
US8475924B2 (en) 2007-07-09 2013-07-02 E.I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
JP5346078B2 (ja) * 2008-05-20 2013-11-20 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 熱および寸法安定性ポリイミドフィルム、ならびに、これに関する方法
US9631054B2 (en) 2010-07-23 2017-04-25 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US11203192B2 (en) 2009-08-03 2021-12-21 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US8574720B2 (en) 2009-08-03 2013-11-05 E.I. Du Pont De Nemours & Company Matte finish polyimide films and methods relating thereto
US8541107B2 (en) 2009-08-13 2013-09-24 E. I. Du Pont De Nemours And Company Pigmented polyimide films and methods relating thereto
US9926415B2 (en) 2010-08-05 2018-03-27 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US20110220179A1 (en) * 2009-09-17 2011-09-15 E. I. Du Pont De Nemours And Company Assemblies comprising a thermally and dimensionally stable polyimide film, an electrode and an absorber layer, and methods relating thereto
WO2011063209A1 (en) 2009-11-20 2011-05-26 E. I. Du Pont De Nemours And Company Thin film transistor compositions, and methods relating thereto
US20110124806A1 (en) 2009-11-20 2011-05-26 E.I. Du Pont De Nemours And Company Dimensionally stable polyimides, and methods relating thereto
CN101798463B (zh) * 2010-03-26 2013-07-17 上海缘达聚合材料有限公司 聚酰亚胺膜及其制备方法
JP2013532752A (ja) 2010-07-23 2013-08-19 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 艶消仕上げポリイミドフィルムおよびそれに関連する方法
US8853723B2 (en) 2010-08-18 2014-10-07 E. I. Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
JP5727885B2 (ja) * 2010-09-07 2015-06-03 Ｊｆｅケミカル株式会社 ポリイミドおよびポリイミドフィルム
US9050784B2 (en) 2010-12-22 2015-06-09 E I Du Pont De Nemours And Company Fire resistant back-sheet for photovoltaic module
KR101259543B1 (ko) * 2011-06-29 2013-04-30 웅진케미칼 주식회사 열안정성이 우수한 폴리이미드 필름
KR101258432B1 (ko) * 2011-06-29 2013-04-26 웅진케미칼 주식회사 고온에서의 열적 치수안정성이 우수한 폴리이미드 필름 및 그를 이용한 디스플레이 소자용 기판
KR101928598B1 (ko) * 2013-09-30 2018-12-12 주식회사 엘지화학 폴리이미드 필름 및 그 제조방법
KR20150095113A (ko) * 2014-02-12 2015-08-20 에스케이씨코오롱피아이 주식회사 폴리이미드 필름
JP6247112B2 (ja) * 2014-02-20 2017-12-13 東京応化工業株式会社 ポリイミド樹脂の製造方法、ポリイミド膜の製造方法、ポリアミック酸溶液の製造方法、ポリイミド膜、及びポリアミック酸溶液
US11021606B2 (en) 2017-09-13 2021-06-01 E I Du Pont De Nemours And Company Multilayer film for electronic circuitry applications
US11104801B2 (en) 2018-03-09 2021-08-31 Dupont Electronics, Inc. Low haze polyimide film
TWI832882B (zh) 2018-08-08 2024-02-21 美商杜邦電子股份有限公司 用於電子裝置中之聚合物
CN112840747A (zh) 2018-10-09 2021-05-25 杜邦电子公司 热基板
US11256001B2 (en) 2018-10-23 2022-02-22 Dupont Electronics, Inc. Low haze polymer films and electronic devices
TW202041571A (zh) 2019-02-22 2020-11-16 美商杜邦電子股份有限公司 聚醯亞胺膜及電子裝置
US11248143B2 (en) 2019-05-24 2022-02-15 Dupont Electronics, Inc. Coated films and electronic devices
TW202110948A (zh) * 2019-06-14 2021-03-16 美商杜邦電子股份有限公司 聚合物膜及電子裝置
KR102347634B1 (ko) * 2019-11-13 2022-01-10 피아이첨단소재 주식회사 고접착 저유전 폴리이미드 필름 및 이의 제조방법
KR102347632B1 (ko) * 2019-11-13 2022-01-10 피아이첨단소재 주식회사 저유전 폴리이미드 필름 및 이의 제조방법
US11718728B2 (en) 2019-11-21 2023-08-08 Dupont Electronics, Inc. Single layer polymer films and electronic devices
KR102347593B1 (ko) * 2019-11-21 2022-01-10 피아이첨단소재 주식회사 폴리이미드 필름 및 이의 제조 방법
US11898011B2 (en) 2020-02-19 2024-02-13 Dupont Electronics, Inc. Polymers for use in electronic devices
US20210310126A1 (en) 2020-04-03 2021-10-07 Dupont Electronics, Inc. Metal-clad polymer films and electronic devices
US20230082265A1 (en) 2021-09-15 2023-03-16 Dupont Electronics, Inc. Articles having inorganic substrates and polymer film layers

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CH621768A5 (de) * 1976-06-15 1981-02-27 Ciba Geigy Ag
US4426253A (en) 1981-12-03 1984-01-17 E. I. Du Pont De Nemours & Co. High speed etching of polyimide film
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JPS61111359A (ja) * 1984-11-06 1986-05-29 Ube Ind Ltd ポリイミド膜
JP2625689B2 (ja) * 1985-11-18 1997-07-02 淑夫 今井 単分子又は単分子累積膜の製造方法
JPS63297029A (ja) * 1987-05-29 1988-12-05 Ube Ind Ltd 芳香族ポリイミド延伸成形体の製法
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Also Published As

Publication number Publication date
DE69118232D1 (de) 1996-05-02
US5166308A (en) 1992-11-24
JPH0578503A (ja) 1993-03-30
CA2041545A1 (en) 1991-10-31
EP0455208A3 (en) 1992-09-02
EP0455208A2 (de) 1991-11-06
EP0455208B1 (de) 1996-03-27
JP3103398B2 (ja) 2000-10-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee