DE69118232D1 - Copolyimid Film - Google Patents
Copolyimid FilmInfo
- Publication number
- DE69118232D1 DE69118232D1 DE69118232T DE69118232T DE69118232D1 DE 69118232 D1 DE69118232 D1 DE 69118232D1 DE 69118232 T DE69118232 T DE 69118232T DE 69118232 T DE69118232 T DE 69118232T DE 69118232 D1 DE69118232 D1 DE 69118232D1
- Authority
- DE
- Germany
- Prior art keywords
- copolyimide film
- copolyimide
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Moulding By Coating Moulds (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/516,887 US5166308A (en) | 1990-04-30 | 1990-04-30 | Copolyimide film with improved properties |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69118232D1 true DE69118232D1 (de) | 1996-05-02 |
DE69118232T2 DE69118232T2 (de) | 1996-12-12 |
Family
ID=24057502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69118232T Expired - Fee Related DE69118232T2 (de) | 1990-04-30 | 1991-04-30 | Copolyimid Film |
Country Status (5)
Country | Link |
---|---|
US (1) | US5166308A (de) |
EP (1) | EP0455208B1 (de) |
JP (1) | JP3103398B2 (de) |
CA (1) | CA2041545A1 (de) |
DE (1) | DE69118232T2 (de) |
Families Citing this family (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0529097B1 (de) * | 1991-03-12 | 2003-01-15 | Sumitomo Bakelite Company Limited | Herstellungsverfahren fuer zweischichtenband vom tab-typ |
US5393864A (en) * | 1993-04-26 | 1995-02-28 | E. I. Du Pont De Nemours And Company | Wet-etchable random polyimide copolymer for multichip module applications |
US5830564A (en) * | 1996-03-01 | 1998-11-03 | Ube Industries, Ltd. | Aromatic polyimide film |
US5716677A (en) * | 1996-03-21 | 1998-02-10 | Ohio Aerospace Institute | Protective coatings for polyimide composites |
US6143399A (en) * | 1997-03-03 | 2000-11-07 | Ube Industries, Ltd. | Aromatic polyimide film |
US5859171A (en) * | 1997-05-21 | 1999-01-12 | Dupont Toray | Polyimide copolymer, polyimide copolymer resin molded products and their preparation |
US6277495B1 (en) | 1997-07-18 | 2001-08-21 | E. I. Du Pont De Nemours And Company | Polyimide film, a method for its manufacture and a polyimide film containing metal laminated plate |
TW531547B (en) * | 1998-08-25 | 2003-05-11 | Kaneka Corp | Polyimide film and process for producing the same |
KR100657729B1 (ko) * | 1999-10-21 | 2006-12-13 | 신닛테츠가가쿠 가부시키가이샤 | 적층체 및 그의 제조방법 |
US6476177B2 (en) | 2000-12-21 | 2002-11-05 | E. I. Du Pont De Nemours And Company | Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes |
US6469126B1 (en) | 2000-12-21 | 2002-10-22 | E. I. Du Pont De Nmeours And Company | Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes |
US6444783B1 (en) | 2000-12-21 | 2002-09-03 | E. I. Du Pont De Nemours And Company | Melt-processible semicrystalline block copolyimides |
US6476182B1 (en) | 2000-12-21 | 2002-11-05 | E. I. Du Pont De Nemours And Company | Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes |
US6956098B2 (en) | 2002-09-20 | 2005-10-18 | E. I. Du Pont De Nemours And Company | High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto |
US7267883B2 (en) * | 2002-09-25 | 2007-09-11 | Kaneka Corporation | Polyimide film and laminate having metal layer and same |
US7026436B2 (en) * | 2002-11-26 | 2006-04-11 | E.I. Du Pont De Nemours And Company | Low temperature polyimide adhesive compositions and methods relating thereto |
US6949296B2 (en) | 2002-12-31 | 2005-09-27 | E. I. Du Pont De Nemours And Company | Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto |
US7442727B2 (en) * | 2003-06-04 | 2008-10-28 | Degussa Ag | Pyrogenically prepared, surface modified aluminum oxide |
US7285321B2 (en) | 2003-11-12 | 2007-10-23 | E.I. Du Pont De Nemours And Company | Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto |
JP4686742B2 (ja) * | 2004-12-27 | 2011-05-25 | 大阪府 | ポリイミド湿潤ゲル及びその製造方法 |
US7504150B2 (en) | 2005-06-15 | 2009-03-17 | E.I. Du Pont De Nemours & Company | Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto |
US7550194B2 (en) * | 2005-08-03 | 2009-06-23 | E. I. Du Pont De Nemours And Company | Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto |
US20090226642A1 (en) * | 2005-08-03 | 2009-09-10 | E. I. Du Pont De Nemours And Company | Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto |
KR100789616B1 (ko) | 2005-08-19 | 2007-12-27 | 주식회사 엘지화학 | 폴리이미드 필름 및 이를 이용한 동장 적층판 |
US7338715B2 (en) * | 2005-12-30 | 2008-03-04 | E.I. Du Pont De Nemours And Company | Low temperature cure polyimide compositions resistant to arc tracking and methods relating thereto |
US20070231588A1 (en) * | 2006-03-31 | 2007-10-04 | Karthikeyan Kanakarajan | Capacitive polyimide laminate |
US20070232734A1 (en) * | 2006-03-31 | 2007-10-04 | Karthikeyan Kanakarajan | Polyimide based compositions useful in high frequency circuitry applications and methods relating thereto |
EP2039715A4 (de) * | 2006-07-06 | 2010-07-21 | Toray Industries | Thermoplastisches polyimid und kaschierte polyimidfolie und metallfolienkaschierte polyimidfolie unter verwendung des thermoplastischen polyimids |
US20080213605A1 (en) * | 2006-12-07 | 2008-09-04 | Briney Gary C | Multi-functional circuitry substrates and compositions and methods relating thereto |
US8475924B2 (en) | 2007-07-09 | 2013-07-02 | E.I. Du Pont De Nemours And Company | Compositions and methods for creating electronic circuitry |
WO2009142938A1 (en) * | 2008-05-20 | 2009-11-26 | E. I. Du Pont De Nemours And Company | Thermally and dimensionally stable polyimide films and methods relating thereto |
US11203192B2 (en) | 2009-08-03 | 2021-12-21 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
US9631054B2 (en) | 2010-07-23 | 2017-04-25 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
US8574720B2 (en) | 2009-08-03 | 2013-11-05 | E.I. Du Pont De Nemours & Company | Matte finish polyimide films and methods relating thereto |
US8541107B2 (en) | 2009-08-13 | 2013-09-24 | E. I. Du Pont De Nemours And Company | Pigmented polyimide films and methods relating thereto |
US9926415B2 (en) | 2010-08-05 | 2018-03-27 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
US20110220178A1 (en) * | 2009-09-17 | 2011-09-15 | E. I. Du Pont De Nemours And Company | Assemblies comprising a thermally and dimensionally stable polyimide film, an electrode and a light absorber layer, and methods relating thereto |
WO2011063209A1 (en) | 2009-11-20 | 2011-05-26 | E. I. Du Pont De Nemours And Company | Thin film transistor compositions, and methods relating thereto |
US20110124806A1 (en) | 2009-11-20 | 2011-05-26 | E.I. Du Pont De Nemours And Company | Dimensionally stable polyimides, and methods relating thereto |
CN101798463B (zh) * | 2010-03-26 | 2013-07-17 | 上海缘达聚合材料有限公司 | 聚酰亚胺膜及其制备方法 |
EP2596052A1 (de) | 2010-07-23 | 2013-05-29 | E.I. Du Pont De Nemours And Company | Polyimidfolien mit matter oberfläche und verfahren im zusammenhang damit |
US8853723B2 (en) | 2010-08-18 | 2014-10-07 | E. I. Du Pont De Nemours And Company | Light emitting diode assembly and thermal control blanket and methods relating thereto |
JP5727885B2 (ja) * | 2010-09-07 | 2015-06-03 | Jfeケミカル株式会社 | ポリイミドおよびポリイミドフィルム |
US9050784B2 (en) | 2010-12-22 | 2015-06-09 | E I Du Pont De Nemours And Company | Fire resistant back-sheet for photovoltaic module |
KR101259543B1 (ko) * | 2011-06-29 | 2013-04-30 | 웅진케미칼 주식회사 | 열안정성이 우수한 폴리이미드 필름 |
KR101258432B1 (ko) * | 2011-06-29 | 2013-04-26 | 웅진케미칼 주식회사 | 고온에서의 열적 치수안정성이 우수한 폴리이미드 필름 및 그를 이용한 디스플레이 소자용 기판 |
KR101928598B1 (ko) * | 2013-09-30 | 2018-12-12 | 주식회사 엘지화학 | 폴리이미드 필름 및 그 제조방법 |
KR20150095113A (ko) * | 2014-02-12 | 2015-08-20 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 필름 |
JP6247112B2 (ja) * | 2014-02-20 | 2017-12-13 | 東京応化工業株式会社 | ポリイミド樹脂の製造方法、ポリイミド膜の製造方法、ポリアミック酸溶液の製造方法、ポリイミド膜、及びポリアミック酸溶液 |
US11021606B2 (en) | 2017-09-13 | 2021-06-01 | E I Du Pont De Nemours And Company | Multilayer film for electronic circuitry applications |
US11104801B2 (en) | 2018-03-09 | 2021-08-31 | Dupont Electronics, Inc. | Low haze polyimide film |
TWI832882B (zh) | 2018-08-08 | 2024-02-21 | 美商杜邦電子股份有限公司 | 用於電子裝置中之聚合物 |
DE112019005062T5 (de) | 2018-10-09 | 2021-06-24 | Dupont Electronics, Inc. | Thermische Substrate |
US11256001B2 (en) | 2018-10-23 | 2022-02-22 | Dupont Electronics, Inc. | Low haze polymer films and electronic devices |
TW202041571A (zh) | 2019-02-22 | 2020-11-16 | 美商杜邦電子股份有限公司 | 聚醯亞胺膜及電子裝置 |
US11248143B2 (en) | 2019-05-24 | 2022-02-15 | Dupont Electronics, Inc. | Coated films and electronic devices |
TW202110948A (zh) * | 2019-06-14 | 2021-03-16 | 美商杜邦電子股份有限公司 | 聚合物膜及電子裝置 |
KR102347634B1 (ko) * | 2019-11-13 | 2022-01-10 | 피아이첨단소재 주식회사 | 고접착 저유전 폴리이미드 필름 및 이의 제조방법 |
KR102347632B1 (ko) * | 2019-11-13 | 2022-01-10 | 피아이첨단소재 주식회사 | 저유전 폴리이미드 필름 및 이의 제조방법 |
KR102347593B1 (ko) * | 2019-11-21 | 2022-01-10 | 피아이첨단소재 주식회사 | 폴리이미드 필름 및 이의 제조 방법 |
US11718728B2 (en) | 2019-11-21 | 2023-08-08 | Dupont Electronics, Inc. | Single layer polymer films and electronic devices |
US11898011B2 (en) | 2020-02-19 | 2024-02-13 | Dupont Electronics, Inc. | Polymers for use in electronic devices |
US20210310126A1 (en) | 2020-04-03 | 2021-10-07 | Dupont Electronics, Inc. | Metal-clad polymer films and electronic devices |
US20230082265A1 (en) | 2021-09-15 | 2023-03-16 | Dupont Electronics, Inc. | Articles having inorganic substrates and polymer film layers |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH621768A5 (de) * | 1976-06-15 | 1981-02-27 | Ciba Geigy Ag | |
US4426253A (en) | 1981-12-03 | 1984-01-17 | E. I. Du Pont De Nemours & Co. | High speed etching of polyimide film |
EP0162017B1 (de) * | 1984-05-17 | 1991-08-21 | Ciba-Geigy Ag | Homo- und Copolymere, Verfahren zu deren Vernetzung und derenVerwendung |
JPS61111359A (ja) * | 1984-11-06 | 1986-05-29 | Ube Ind Ltd | ポリイミド膜 |
JP2625689B2 (ja) * | 1985-11-18 | 1997-07-02 | 淑夫 今井 | 単分子又は単分子累積膜の製造方法 |
JPS63297029A (ja) * | 1987-05-29 | 1988-12-05 | Ube Ind Ltd | 芳香族ポリイミド延伸成形体の製法 |
US4906731A (en) * | 1987-06-01 | 1990-03-06 | E. I. Du Pont De Nemours And Company | Polyimide molecular weight enhancement by solvent extraction |
US5003030A (en) * | 1988-05-17 | 1991-03-26 | Idemitsu Petrochemical Co., Ltd. | Thermoplastic wholly aromatic copolyimide ester and process for producing the same |
-
1990
- 1990-04-30 US US07/516,887 patent/US5166308A/en not_active Expired - Lifetime
-
1991
- 1991-04-30 DE DE69118232T patent/DE69118232T2/de not_active Expired - Fee Related
- 1991-04-30 JP JP03228217A patent/JP3103398B2/ja not_active Expired - Lifetime
- 1991-04-30 CA CA002041545A patent/CA2041545A1/en not_active Abandoned
- 1991-04-30 EP EP91106976A patent/EP0455208B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3103398B2 (ja) | 2000-10-30 |
CA2041545A1 (en) | 1991-10-31 |
JPH0578503A (ja) | 1993-03-30 |
EP0455208A3 (en) | 1992-09-02 |
EP0455208A2 (de) | 1991-11-06 |
EP0455208B1 (de) | 1996-03-27 |
DE69118232T2 (de) | 1996-12-12 |
US5166308A (en) | 1992-11-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |