JPH0731540Y2 - 加熱硬化装置 - Google Patents

加熱硬化装置

Info

Publication number
JPH0731540Y2
JPH0731540Y2 JP1990029296U JP2929690U JPH0731540Y2 JP H0731540 Y2 JPH0731540 Y2 JP H0731540Y2 JP 1990029296 U JP1990029296 U JP 1990029296U JP 2929690 U JP2929690 U JP 2929690U JP H0731540 Y2 JPH0731540 Y2 JP H0731540Y2
Authority
JP
Japan
Prior art keywords
gas
gas supply
supply chamber
plate
heating chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990029296U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03120037U (enExample
Inventor
武 木本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1990029296U priority Critical patent/JPH0731540Y2/ja
Priority to KR2019910003484U priority patent/KR970004979Y1/ko
Publication of JPH03120037U publication Critical patent/JPH03120037U/ja
Application granted granted Critical
Publication of JPH0731540Y2 publication Critical patent/JPH0731540Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

Landscapes

  • Die Bonding (AREA)
  • Sampling And Sample Adjustment (AREA)
JP1990029296U 1990-03-22 1990-03-22 加熱硬化装置 Expired - Lifetime JPH0731540Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1990029296U JPH0731540Y2 (ja) 1990-03-22 1990-03-22 加熱硬化装置
KR2019910003484U KR970004979Y1 (ko) 1990-03-22 1991-03-15 가열경화장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990029296U JPH0731540Y2 (ja) 1990-03-22 1990-03-22 加熱硬化装置

Publications (2)

Publication Number Publication Date
JPH03120037U JPH03120037U (enExample) 1991-12-10
JPH0731540Y2 true JPH0731540Y2 (ja) 1995-07-19

Family

ID=12272281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990029296U Expired - Lifetime JPH0731540Y2 (ja) 1990-03-22 1990-03-22 加熱硬化装置

Country Status (2)

Country Link
JP (1) JPH0731540Y2 (enExample)
KR (1) KR970004979Y1 (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS539838B2 (enExample) * 1973-01-05 1978-04-08
JPS59131154U (ja) * 1983-02-22 1984-09-03 株式会社東芝 マウントキユア装置
JPS59208734A (ja) * 1983-05-13 1984-11-27 Hitachi Ltd ペレツトボンデイング装置
JPS63144528A (ja) * 1986-12-09 1988-06-16 Nec Corp 半導体装置の製造装置
JPH01295428A (ja) * 1988-05-24 1989-11-29 Mitsubishi Electric Corp ダイボンダ用の樹脂硬化装置

Also Published As

Publication number Publication date
KR970004979Y1 (ko) 1997-05-22
KR910017378U (ko) 1991-10-28
JPH03120037U (enExample) 1991-12-10

Similar Documents

Publication Publication Date Title
KR100209564B1 (ko) 액 도포 시스템 및 액 도포방법
ATE388482T1 (de) Örtliche erwärmung und kühlung von substraten
CN100505158C (zh) 在可变温度下可控地加热混合物的炉体
CN103374709A (zh) 化学气相沉积系统
JPH0731540Y2 (ja) 加熱硬化装置
DE3471274D1 (en) Impingement oven module, oven comprising said module and method of heating a thermoplastic chip
KR910005979B1 (ko) 기판가열방법
JPH0619546Y2 (ja) 加熱硬化装置
KR20210054105A (ko) 기판 처리 장치 및 방법
CN114497327A (zh) 一种高亮度色域MiniLED封装结构
US5154604A (en) Curing apparatus
JPS57128940A (en) Heat treating method for substrate
JPH0298948A (ja) ダイボンダ用の樹脂硬化装置
JP4620536B2 (ja) 基板処理装置
JP2998603B2 (ja) チップのボンディング装置
JPS62193248A (ja) レジスト塗布・ベ−ク装置
KR950001297B1 (ko) 큐어(cure)장치
JP2605859Y2 (ja) 薄膜形成装置
JPH0749150B2 (ja) 基板加熱装置
JPS63166217A (ja) 半導体製造装置
JP2002067051A (ja) 処理炉
JP3156500B2 (ja) キュア装置
JPH01295428A (ja) ダイボンダ用の樹脂硬化装置
JPH10223661A (ja) キュア装置
JPH0483351A (ja) キュア装置

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R323531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R323533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

EXPY Cancellation because of completion of term