JPH0731540Y2 - 加熱硬化装置 - Google Patents

加熱硬化装置

Info

Publication number
JPH0731540Y2
JPH0731540Y2 JP1990029296U JP2929690U JPH0731540Y2 JP H0731540 Y2 JPH0731540 Y2 JP H0731540Y2 JP 1990029296 U JP1990029296 U JP 1990029296U JP 2929690 U JP2929690 U JP 2929690U JP H0731540 Y2 JPH0731540 Y2 JP H0731540Y2
Authority
JP
Japan
Prior art keywords
gas
gas supply
supply chamber
plate
heating chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990029296U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03120037U (enExample
Inventor
武 木本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1990029296U priority Critical patent/JPH0731540Y2/ja
Priority to KR2019910003484U priority patent/KR970004979Y1/ko
Publication of JPH03120037U publication Critical patent/JPH03120037U/ja
Application granted granted Critical
Publication of JPH0731540Y2 publication Critical patent/JPH0731540Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Sampling And Sample Adjustment (AREA)
JP1990029296U 1990-03-22 1990-03-22 加熱硬化装置 Expired - Lifetime JPH0731540Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1990029296U JPH0731540Y2 (ja) 1990-03-22 1990-03-22 加熱硬化装置
KR2019910003484U KR970004979Y1 (ko) 1990-03-22 1991-03-15 가열경화장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990029296U JPH0731540Y2 (ja) 1990-03-22 1990-03-22 加熱硬化装置

Publications (2)

Publication Number Publication Date
JPH03120037U JPH03120037U (enExample) 1991-12-10
JPH0731540Y2 true JPH0731540Y2 (ja) 1995-07-19

Family

ID=12272281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990029296U Expired - Lifetime JPH0731540Y2 (ja) 1990-03-22 1990-03-22 加熱硬化装置

Country Status (2)

Country Link
JP (1) JPH0731540Y2 (enExample)
KR (1) KR970004979Y1 (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS539838B2 (enExample) * 1973-01-05 1978-04-08
JPS59131154U (ja) * 1983-02-22 1984-09-03 株式会社東芝 マウントキユア装置
JPS59208734A (ja) * 1983-05-13 1984-11-27 Hitachi Ltd ペレツトボンデイング装置
JPS63144528A (ja) * 1986-12-09 1988-06-16 Nec Corp 半導体装置の製造装置
JPH01295428A (ja) * 1988-05-24 1989-11-29 Mitsubishi Electric Corp ダイボンダ用の樹脂硬化装置

Also Published As

Publication number Publication date
KR970004979Y1 (ko) 1997-05-22
KR910017378U (ko) 1991-10-28
JPH03120037U (enExample) 1991-12-10

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