JPS57178351A - Cooling unit for semiconductor integrated circuit device - Google Patents

Cooling unit for semiconductor integrated circuit device

Info

Publication number
JPS57178351A
JPS57178351A JP6364481A JP6364481A JPS57178351A JP S57178351 A JPS57178351 A JP S57178351A JP 6364481 A JP6364481 A JP 6364481A JP 6364481 A JP6364481 A JP 6364481A JP S57178351 A JPS57178351 A JP S57178351A
Authority
JP
Japan
Prior art keywords
concaved surface
heat conducting
conducting material
substrate
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6364481A
Other languages
Japanese (ja)
Inventor
Toru Kishimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP6364481A priority Critical patent/JPS57178351A/en
Publication of JPS57178351A publication Critical patent/JPS57178351A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To perform a uniform cooling on the entire surface of a substrate by a method wherein a heat conducting material, having a concaved surface on the side opposite to the substrate, is coupled and an inflow and an outflow nozzles are provided along the extending direction of the concaved surface. CONSTITUTION:A heat conducting material 32, with a concaved surface on the side opposite to a wiring substrate 21, is coupled to a circuit substrate 22 of the circuit device 24. Then, the flowin nozzle 42 and the flowout nozzle 44, which were formed in parallel with the extending direction of the concaved surface 31, are provided back to back. As a result, cooling gas 5 runs smoothly along one half of the heat conducting material 32 in the extending direction of the concaved surface 31, smoothly runs along the other half of the concaved surface 31, and then runs into the flowout nozzle 44 from the side of an opening 43. Accordingly, there generates no temperature difference between the center part and the outer circumferential part of the heat conducting material 32.
JP6364481A 1981-04-27 1981-04-27 Cooling unit for semiconductor integrated circuit device Pending JPS57178351A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6364481A JPS57178351A (en) 1981-04-27 1981-04-27 Cooling unit for semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6364481A JPS57178351A (en) 1981-04-27 1981-04-27 Cooling unit for semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS57178351A true JPS57178351A (en) 1982-11-02

Family

ID=13235262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6364481A Pending JPS57178351A (en) 1981-04-27 1981-04-27 Cooling unit for semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS57178351A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63261865A (en) * 1987-04-06 1988-10-28 インターナショナル・ビジネス・マシーンズ・コーポレーシヨン Cooler
FR2631433A1 (en) * 1988-05-10 1989-11-17 Sagem IMPROVEMENTS IN OR RELATING TO DEVICES FOR ADJUSTING THE TEMPERATURE OF AN ELEMENT BY BLOWING A GAS TO THE APPROPRIATE TEMPERATURE
JPH0282561A (en) * 1988-09-19 1990-03-23 Hitachi Ltd Semiconductor cooling apparatus and its manufacture

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63261865A (en) * 1987-04-06 1988-10-28 インターナショナル・ビジネス・マシーンズ・コーポレーシヨン Cooler
JPH053141B2 (en) * 1987-04-06 1993-01-14 Intaanashonaru Bijinesu Mashiinzu Corp
FR2631433A1 (en) * 1988-05-10 1989-11-17 Sagem IMPROVEMENTS IN OR RELATING TO DEVICES FOR ADJUSTING THE TEMPERATURE OF AN ELEMENT BY BLOWING A GAS TO THE APPROPRIATE TEMPERATURE
JPH0282561A (en) * 1988-09-19 1990-03-23 Hitachi Ltd Semiconductor cooling apparatus and its manufacture

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