JPS54112170A - Molding method for electronic parts - Google Patents
Molding method for electronic partsInfo
- Publication number
- JPS54112170A JPS54112170A JP1944978A JP1944978A JPS54112170A JP S54112170 A JPS54112170 A JP S54112170A JP 1944978 A JP1944978 A JP 1944978A JP 1944978 A JP1944978 A JP 1944978A JP S54112170 A JPS54112170 A JP S54112170A
- Authority
- JP
- Japan
- Prior art keywords
- molding material
- substrate
- electronic parts
- gas
- sprayed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To shorten a resin sealing time and to obtain a desirable sealing shape by surrounding electronic parts arrayed on an electronic circuit substrate with a frame, by charging its inside with a molding material, and by spraying alternate heating gas and cooling gas to the molding material while the substrate is passed through a heating oven.
CONSTITUTION: On substrate 1 where an electronic circuit is formed, several electronic parts are arranged and surrounded with frames 2 respectively, and each inside is charged with molding material 3. Next, the substrate 1 processed in the above- mentioned way is passed through heating oven 4 with heater 5 and temperature detector 6 and during that, molding material 3 is fused and hardened. Namely, heating gas 17 is sprayed from nuzzle 16 at the tip of pipe 15 connected to controller 14 controlling pressure, etc., to fuse molding material 3 and after substrate 1 is moved away, cooling gas 21 is sprayed from nozzle 20 at the tip of pipe 19 connected to controller 18, thereby hardening it by cooling. In this way, molding material 2 is made thin at its center and thick at its circumference, and the upper part of the wire part is also coated.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1944978A JPS6054779B2 (en) | 1978-02-22 | 1978-02-22 | Electronic component molding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1944978A JPS6054779B2 (en) | 1978-02-22 | 1978-02-22 | Electronic component molding method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54112170A true JPS54112170A (en) | 1979-09-01 |
JPS6054779B2 JPS6054779B2 (en) | 1985-12-02 |
Family
ID=11999608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1944978A Expired JPS6054779B2 (en) | 1978-02-22 | 1978-02-22 | Electronic component molding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6054779B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62149141A (en) * | 1985-12-23 | 1987-07-03 | Toshiba Mach Co Ltd | Cooling apparatus for molded ic part |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61186720U (en) * | 1985-05-14 | 1986-11-21 | ||
JPS62133914U (en) * | 1986-02-19 | 1987-08-24 |
-
1978
- 1978-02-22 JP JP1944978A patent/JPS6054779B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62149141A (en) * | 1985-12-23 | 1987-07-03 | Toshiba Mach Co Ltd | Cooling apparatus for molded ic part |
Also Published As
Publication number | Publication date |
---|---|
JPS6054779B2 (en) | 1985-12-02 |
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