JPS54112170A - Molding method for electronic parts - Google Patents

Molding method for electronic parts

Info

Publication number
JPS54112170A
JPS54112170A JP1944978A JP1944978A JPS54112170A JP S54112170 A JPS54112170 A JP S54112170A JP 1944978 A JP1944978 A JP 1944978A JP 1944978 A JP1944978 A JP 1944978A JP S54112170 A JPS54112170 A JP S54112170A
Authority
JP
Japan
Prior art keywords
molding material
substrate
electronic parts
gas
sprayed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1944978A
Other languages
Japanese (ja)
Other versions
JPS6054779B2 (en
Inventor
Takashi Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP1944978A priority Critical patent/JPS6054779B2/en
Publication of JPS54112170A publication Critical patent/JPS54112170A/en
Publication of JPS6054779B2 publication Critical patent/JPS6054779B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To shorten a resin sealing time and to obtain a desirable sealing shape by surrounding electronic parts arrayed on an electronic circuit substrate with a frame, by charging its inside with a molding material, and by spraying alternate heating gas and cooling gas to the molding material while the substrate is passed through a heating oven.
CONSTITUTION: On substrate 1 where an electronic circuit is formed, several electronic parts are arranged and surrounded with frames 2 respectively, and each inside is charged with molding material 3. Next, the substrate 1 processed in the above- mentioned way is passed through heating oven 4 with heater 5 and temperature detector 6 and during that, molding material 3 is fused and hardened. Namely, heating gas 17 is sprayed from nuzzle 16 at the tip of pipe 15 connected to controller 14 controlling pressure, etc., to fuse molding material 3 and after substrate 1 is moved away, cooling gas 21 is sprayed from nozzle 20 at the tip of pipe 19 connected to controller 18, thereby hardening it by cooling. In this way, molding material 2 is made thin at its center and thick at its circumference, and the upper part of the wire part is also coated.
COPYRIGHT: (C)1979,JPO&Japio
JP1944978A 1978-02-22 1978-02-22 Electronic component molding method Expired JPS6054779B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1944978A JPS6054779B2 (en) 1978-02-22 1978-02-22 Electronic component molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1944978A JPS6054779B2 (en) 1978-02-22 1978-02-22 Electronic component molding method

Publications (2)

Publication Number Publication Date
JPS54112170A true JPS54112170A (en) 1979-09-01
JPS6054779B2 JPS6054779B2 (en) 1985-12-02

Family

ID=11999608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1944978A Expired JPS6054779B2 (en) 1978-02-22 1978-02-22 Electronic component molding method

Country Status (1)

Country Link
JP (1) JPS6054779B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149141A (en) * 1985-12-23 1987-07-03 Toshiba Mach Co Ltd Cooling apparatus for molded ic part

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61186720U (en) * 1985-05-14 1986-11-21
JPS62133914U (en) * 1986-02-19 1987-08-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149141A (en) * 1985-12-23 1987-07-03 Toshiba Mach Co Ltd Cooling apparatus for molded ic part

Also Published As

Publication number Publication date
JPS6054779B2 (en) 1985-12-02

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