KR970004979Y1 - 가열경화장치 - Google Patents

가열경화장치 Download PDF

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Publication number
KR970004979Y1
KR970004979Y1 KR2019910003484U KR910003484U KR970004979Y1 KR 970004979 Y1 KR970004979 Y1 KR 970004979Y1 KR 2019910003484 U KR2019910003484 U KR 2019910003484U KR 910003484 U KR910003484 U KR 910003484U KR 970004979 Y1 KR970004979 Y1 KR 970004979Y1
Authority
KR
South Korea
Prior art keywords
gas
gas supply
plate
sample member
heating chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR2019910003484U
Other languages
English (en)
Korean (ko)
Other versions
KR910017378U (ko
Inventor
타케시 끼모토
Original Assignee
소니 가부시끼 가이샤
오오가 노리오
닛폰 산소 가부시끼 가이샤
마부찌 히데오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 소니 가부시끼 가이샤, 오오가 노리오, 닛폰 산소 가부시끼 가이샤, 마부찌 히데오 filed Critical 소니 가부시끼 가이샤
Publication of KR910017378U publication Critical patent/KR910017378U/ko
Application granted granted Critical
Publication of KR970004979Y1 publication Critical patent/KR970004979Y1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

Landscapes

  • Die Bonding (AREA)
  • Sampling And Sample Adjustment (AREA)
KR2019910003484U 1990-03-22 1991-03-15 가열경화장치 Expired - Lifetime KR970004979Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1990029296U JPH0731540Y2 (ja) 1990-03-22 1990-03-22 加熱硬化装置
JP2-29296 1990-03-22

Publications (2)

Publication Number Publication Date
KR910017378U KR910017378U (ko) 1991-10-28
KR970004979Y1 true KR970004979Y1 (ko) 1997-05-22

Family

ID=12272281

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910003484U Expired - Lifetime KR970004979Y1 (ko) 1990-03-22 1991-03-15 가열경화장치

Country Status (2)

Country Link
JP (1) JPH0731540Y2 (enExample)
KR (1) KR970004979Y1 (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS539838B2 (enExample) * 1973-01-05 1978-04-08
JPS59131154U (ja) * 1983-02-22 1984-09-03 株式会社東芝 マウントキユア装置
JPS59208734A (ja) * 1983-05-13 1984-11-27 Hitachi Ltd ペレツトボンデイング装置
JPS63144528A (ja) * 1986-12-09 1988-06-16 Nec Corp 半導体装置の製造装置
JPH01295428A (ja) * 1988-05-24 1989-11-29 Mitsubishi Electric Corp ダイボンダ用の樹脂硬化装置

Also Published As

Publication number Publication date
KR910017378U (ko) 1991-10-28
JPH0731540Y2 (ja) 1995-07-19
JPH03120037U (enExample) 1991-12-10

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