JPH07221291A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法Info
- Publication number
- JPH07221291A JPH07221291A JP6011240A JP1124094A JPH07221291A JP H07221291 A JPH07221291 A JP H07221291A JP 6011240 A JP6011240 A JP 6011240A JP 1124094 A JP1124094 A JP 1124094A JP H07221291 A JPH07221291 A JP H07221291A
- Authority
- JP
- Japan
- Prior art keywords
- gate electrode
- polysilicon
- resistance portion
- drain
- high resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
- H10D30/0227—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0147—Manufacturing their gate sidewall spacers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/416—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials of highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6011240A JPH07221291A (ja) | 1994-02-02 | 1994-02-02 | 半導体装置及びその製造方法 |
| KR1019950001980A KR950034841A (ko) | 1994-02-02 | 1995-01-28 | 반도체 장치 및 그 제조방법 |
| TW084101933A TW283262B (enExample) | 1994-02-02 | 1995-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6011240A JPH07221291A (ja) | 1994-02-02 | 1994-02-02 | 半導体装置及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07221291A true JPH07221291A (ja) | 1995-08-18 |
Family
ID=11772420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6011240A Pending JPH07221291A (ja) | 1994-02-02 | 1994-02-02 | 半導体装置及びその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH07221291A (enExample) |
| KR (1) | KR950034841A (enExample) |
| TW (1) | TW283262B (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7170137B2 (en) | 2004-06-17 | 2007-01-30 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
| JP2009170468A (ja) * | 2008-01-10 | 2009-07-30 | Sharp Corp | Mos電界効果トランジスタ |
| JP2012142441A (ja) * | 2010-12-28 | 2012-07-26 | Fujitsu Semiconductor Ltd | Mosトランジスタおよびその製造方法 |
| US9425197B2 (en) | 2014-04-04 | 2016-08-23 | Seiko Epson Corporation | Semiconductor device and manufacturing method for the same |
-
1994
- 1994-02-02 JP JP6011240A patent/JPH07221291A/ja active Pending
-
1995
- 1995-01-28 KR KR1019950001980A patent/KR950034841A/ko not_active Withdrawn
- 1995-02-28 TW TW084101933A patent/TW283262B/zh not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7170137B2 (en) | 2004-06-17 | 2007-01-30 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
| JP2009170468A (ja) * | 2008-01-10 | 2009-07-30 | Sharp Corp | Mos電界効果トランジスタ |
| JP2012142441A (ja) * | 2010-12-28 | 2012-07-26 | Fujitsu Semiconductor Ltd | Mosトランジスタおよびその製造方法 |
| US9425197B2 (en) | 2014-04-04 | 2016-08-23 | Seiko Epson Corporation | Semiconductor device and manufacturing method for the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR950034841A (ko) | 1995-12-28 |
| TW283262B (enExample) | 1996-08-11 |
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