JPH071801Y2 - イメージセンサ - Google Patents

イメージセンサ

Info

Publication number
JPH071801Y2
JPH071801Y2 JP1988063877U JP6387788U JPH071801Y2 JP H071801 Y2 JPH071801 Y2 JP H071801Y2 JP 1988063877 U JP1988063877 U JP 1988063877U JP 6387788 U JP6387788 U JP 6387788U JP H071801 Y2 JPH071801 Y2 JP H071801Y2
Authority
JP
Japan
Prior art keywords
drive circuit
circuit board
insulating substrate
support plate
image sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988063877U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01167060U (enExample
Inventor
啓志 藤曲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP1988063877U priority Critical patent/JPH071801Y2/ja
Publication of JPH01167060U publication Critical patent/JPH01167060U/ja
Application granted granted Critical
Publication of JPH071801Y2 publication Critical patent/JPH071801Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
JP1988063877U 1988-05-14 1988-05-14 イメージセンサ Expired - Lifetime JPH071801Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988063877U JPH071801Y2 (ja) 1988-05-14 1988-05-14 イメージセンサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988063877U JPH071801Y2 (ja) 1988-05-14 1988-05-14 イメージセンサ

Publications (2)

Publication Number Publication Date
JPH01167060U JPH01167060U (enExample) 1989-11-22
JPH071801Y2 true JPH071801Y2 (ja) 1995-01-18

Family

ID=31289365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988063877U Expired - Lifetime JPH071801Y2 (ja) 1988-05-14 1988-05-14 イメージセンサ

Country Status (1)

Country Link
JP (1) JPH071801Y2 (enExample)

Also Published As

Publication number Publication date
JPH01167060U (enExample) 1989-11-22

Similar Documents

Publication Publication Date Title
US5032718A (en) Photo sensor array and reader with hexagonal fiber bundles
JP2970411B2 (ja) 半導体装置
JPH06186578A (ja) 液晶表示装置
JPH071801Y2 (ja) イメージセンサ
JP2005018594A (ja) 指紋入力装置、その製造方法、及び個人認証システム
JPH06130408A (ja) 液晶表示装置
JPH075644Y2 (ja) イメージセンサ
JPH1096948A (ja) 液晶表示装置
JPH079386Y2 (ja) イメージセンサ
JPH0621249Y2 (ja) 電子部品の封止構造
JPH1058873A (ja) Ｉｃモジュール
JP2522641Y2 (ja) 導波路型光デバイス
CN221841449U (zh) 超声波传感器、超声波指纹模组和电子设备
JPH01212064A (ja) 長尺接続イメージセンサ
JP2685004B2 (ja) 密着型イメージセンサ及びその製造方法
JPH0625018Y2 (ja) 密着型イメージセンサ
JPH0511183U (ja) プラズマデイスプレイ装置
JP2549465Y2 (ja) 光プリントヘッド
JPS6360533B2 (enExample)
JP3214996B2 (ja) 液晶表示装置の製造方法
WO2000008517A1 (en) Liquid crystal display device
JPS61222358A (ja) 半導体装置
JPS61222359A (ja) 半導体装置
JP2574593B2 (ja) 密着型イメージセンサ
JPH03142880A (ja) 半導体装置とそれを用いたイメージセンサ及びイメージセンサユニット