JPH071801Y2 - イメージセンサ - Google Patents

イメージセンサ

Info

Publication number
JPH071801Y2
JPH071801Y2 JP1988063877U JP6387788U JPH071801Y2 JP H071801 Y2 JPH071801 Y2 JP H071801Y2 JP 1988063877 U JP1988063877 U JP 1988063877U JP 6387788 U JP6387788 U JP 6387788U JP H071801 Y2 JPH071801 Y2 JP H071801Y2
Authority
JP
Japan
Prior art keywords
drive circuit
circuit board
insulating substrate
support plate
image sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988063877U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01167060U (enExample
Inventor
啓志 藤曲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP1988063877U priority Critical patent/JPH071801Y2/ja
Publication of JPH01167060U publication Critical patent/JPH01167060U/ja
Application granted granted Critical
Publication of JPH071801Y2 publication Critical patent/JPH071801Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
JP1988063877U 1988-05-14 1988-05-14 イメージセンサ Expired - Lifetime JPH071801Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988063877U JPH071801Y2 (ja) 1988-05-14 1988-05-14 イメージセンサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988063877U JPH071801Y2 (ja) 1988-05-14 1988-05-14 イメージセンサ

Publications (2)

Publication Number Publication Date
JPH01167060U JPH01167060U (enExample) 1989-11-22
JPH071801Y2 true JPH071801Y2 (ja) 1995-01-18

Family

ID=31289365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988063877U Expired - Lifetime JPH071801Y2 (ja) 1988-05-14 1988-05-14 イメージセンサ

Country Status (1)

Country Link
JP (1) JPH071801Y2 (enExample)

Also Published As

Publication number Publication date
JPH01167060U (enExample) 1989-11-22

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