JPH01167060U - - Google Patents
Info
- Publication number
- JPH01167060U JPH01167060U JP1988063877U JP6387788U JPH01167060U JP H01167060 U JPH01167060 U JP H01167060U JP 1988063877 U JP1988063877 U JP 1988063877U JP 6387788 U JP6387788 U JP 6387788U JP H01167060 U JPH01167060 U JP H01167060U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- insulating substrate
- image sensor
- support plate
- driving circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063877U JPH071801Y2 (ja) | 1988-05-14 | 1988-05-14 | イメージセンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063877U JPH071801Y2 (ja) | 1988-05-14 | 1988-05-14 | イメージセンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01167060U true JPH01167060U (enExample) | 1989-11-22 |
| JPH071801Y2 JPH071801Y2 (ja) | 1995-01-18 |
Family
ID=31289365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988063877U Expired - Lifetime JPH071801Y2 (ja) | 1988-05-14 | 1988-05-14 | イメージセンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071801Y2 (enExample) |
-
1988
- 1988-05-14 JP JP1988063877U patent/JPH071801Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH071801Y2 (ja) | 1995-01-18 |