JPH01167060U - - Google Patents
Info
- Publication number
- JPH01167060U JPH01167060U JP6387788U JP6387788U JPH01167060U JP H01167060 U JPH01167060 U JP H01167060U JP 6387788 U JP6387788 U JP 6387788U JP 6387788 U JP6387788 U JP 6387788U JP H01167060 U JPH01167060 U JP H01167060U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- insulating substrate
- image sensor
- support plate
- driving circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
Description
第１図は本考案実施例のイメージセンサを示す
断面説明図、第２図は本考案の他の実施例を示す
断面説明図、第３図は従来のイメージセンサを示
す平面説明図、第４図は第３図のイメージセンサ
の―′線断面説明図である。
１……絶縁基板、２……駆動回路基板、３……
支持板、４，７ａ，７ｂ……溝部。
FIG. 1 is a cross-sectional explanatory diagram showing an image sensor according to an embodiment of the present invention, FIG. 2 is a cross-sectional explanatory diagram showing another embodiment of the present invention, FIG. 3 is a plan explanatory diagram showing a conventional image sensor, and FIG. The figure is an explanatory cross-sectional view taken along the line -' of the image sensor in FIG. 3. 1...Insulating board, 2...Drive circuit board, 3...
Support plate, 4, 7a, 7b...Groove portion.
Claims (1)
互いに当接させて支持板上に固定するイメージセ
ンサにおいて、 前記絶縁基板と駆動回路基板の当接面に臨む溝
部を、前記絶縁基板、駆動回路基板、支持板のう
ちいずれか一つ以上に形成することを特徴とする
イメージセンサ。[Claims for Utility Model Registration] An image sensor in which an insulating substrate having a sensor portion and a driving circuit board are brought into contact with each other and fixed on a support plate, wherein a groove portion facing the contact surface of the insulating substrate and the driving circuit board is provided. , an image sensor formed on one or more of the insulating substrate, the drive circuit board, and the support plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6387788U JPH071801Y2 (en) | 1988-05-14 | 1988-05-14 | Image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6387788U JPH071801Y2 (en) | 1988-05-14 | 1988-05-14 | Image sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01167060U true JPH01167060U (en) | 1989-11-22 |
| JPH071801Y2 JPH071801Y2 (en) | 1995-01-18 |
Family
ID=31289365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6387788U Expired - Lifetime JPH071801Y2 (en) | 1988-05-14 | 1988-05-14 | Image sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071801Y2 (en) |
-
1988
- 1988-05-14 JP JP6387788U patent/JPH071801Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH071801Y2 (en) | 1995-01-18 |