JPH0682604B2 - X線マスク - Google Patents
X線マスクInfo
- Publication number
- JPH0682604B2 JPH0682604B2 JP19570687A JP19570687A JPH0682604B2 JP H0682604 B2 JPH0682604 B2 JP H0682604B2 JP 19570687 A JP19570687 A JP 19570687A JP 19570687 A JP19570687 A JP 19570687A JP H0682604 B2 JPH0682604 B2 JP H0682604B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- ray
- transparent
- transparent conductive
- ray mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 claims description 92
- 239000011358 absorbing material Substances 0.000 claims description 16
- 239000010408 film Substances 0.000 claims description 6
- 238000007689 inspection Methods 0.000 description 11
- 238000010894 electron beam technology Methods 0.000 description 10
- 238000010030 laminating Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000006096 absorbing agent Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007687 exposure technique Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/167—X-ray
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19570687A JPH0682604B2 (ja) | 1987-08-04 | 1987-08-04 | X線マスク |
DE3820421A DE3820421A1 (de) | 1987-08-04 | 1988-06-15 | Maske zur roentgenlithographie und verfahren zur herstellung einer solchen |
US07/405,583 US5023156A (en) | 1987-08-04 | 1989-09-11 | Mask for X-ray lityhography and method of manufacturing the same |
US07/678,423 US5132186A (en) | 1987-08-04 | 1991-04-01 | Mask for x-ray lithography and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19570687A JPH0682604B2 (ja) | 1987-08-04 | 1987-08-04 | X線マスク |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6439021A JPS6439021A (en) | 1989-02-09 |
JPH0682604B2 true JPH0682604B2 (ja) | 1994-10-19 |
Family
ID=16345621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19570687A Expired - Lifetime JPH0682604B2 (ja) | 1987-08-04 | 1987-08-04 | X線マスク |
Country Status (3)
Country | Link |
---|---|
US (2) | US5023156A (en, 2012) |
JP (1) | JPH0682604B2 (en, 2012) |
DE (1) | DE3820421A1 (en, 2012) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0682604B2 (ja) * | 1987-08-04 | 1994-10-19 | 三菱電機株式会社 | X線マスク |
JP2723600B2 (ja) * | 1989-03-31 | 1998-03-09 | キヤノン株式会社 | X線露光装置及びx線露光方法 |
DE69033996T2 (de) * | 1989-04-28 | 2002-12-05 | Fujitsu Ltd., Kawasaki | Maske, Verfahren zur Herstellung der Maske und Verfahren zur Musterherstellung mit einer Maske |
JPH03228053A (ja) * | 1990-02-01 | 1991-10-09 | Fujitsu Ltd | 光露光レチクル |
US5217829A (en) * | 1990-02-22 | 1993-06-08 | Presstek, Inc. | Method for producing photomasks |
JP2728971B2 (ja) * | 1990-10-02 | 1998-03-18 | キヤノン株式会社 | X線露光装置およびx線露光方法 |
ATE184711T1 (de) * | 1991-11-15 | 1999-10-15 | Canon Kk | Röntgenstrahlmaskenstruktur und - belichtungsverfahren sowie damit hergestelltes halbleiterbauelement und herstellungsverfahren für die röntgenstrahlmaskenstruktur |
JPH05343299A (ja) * | 1992-06-08 | 1993-12-24 | Mitsubishi Electric Corp | X線マスク及びx線マスクの製造方法 |
JPH0611376A (ja) * | 1992-06-26 | 1994-01-21 | Komatsu Ltd | 油圧回路の金属粉量検出装置 |
US5354633A (en) * | 1993-09-22 | 1994-10-11 | Presstek, Inc. | Laser imageable photomask constructions |
US5538151A (en) * | 1995-01-20 | 1996-07-23 | International Business Machines Corp. | Recovery of an anodically bonded glass device from a susstrate by use of a metal interlayer |
KR0138278B1 (ko) * | 1995-01-24 | 1998-04-27 | 김광호 | 엑스레이 리소그래피용 마스크 및 그의 제조방법 |
US5677090A (en) * | 1995-02-23 | 1997-10-14 | Mitsubishi Denki Kabushiki Kaisha | Method of making X-ray mask having reduced stress |
JP3578872B2 (ja) * | 1995-10-26 | 2004-10-20 | 三菱電機株式会社 | X線マスクの製造方法および加熱装置 |
KR100244458B1 (ko) * | 1997-03-26 | 2000-03-02 | 김영환 | 마스크 및 그 제조방법 |
JP4725729B2 (ja) * | 2006-01-19 | 2011-07-13 | 株式会社ニコン | 多層膜反射鏡、及びeuv露光装置 |
JP2010027743A (ja) | 2008-07-16 | 2010-02-04 | Ebara Corp | インプリント用ガラス基板、レジストパターン形成方法、インプリント用ガラス基板の検査方法及び検査装置 |
US9612522B2 (en) * | 2014-07-11 | 2017-04-04 | Applied Materials, Inc. | Extreme ultraviolet mask blank production system with thin absorber and manufacturing system therefor |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3873824A (en) * | 1973-10-01 | 1975-03-25 | Texas Instruments Inc | X-ray lithography mask |
US3892973A (en) * | 1974-02-15 | 1975-07-01 | Bell Telephone Labor Inc | Mask structure for X-ray lithography |
DE3119682A1 (de) * | 1981-05-18 | 1982-12-02 | Philips Patentverwaltung Gmbh, 2000 Hamburg | "verfahren zur herstellung einer maske fuer die mustererzeugung in lackschichten mittels strahlungslithographie" |
US4453086A (en) * | 1981-12-31 | 1984-06-05 | International Business Machines Corporation | Electron beam system with reduced charge buildup |
JPH0812839B2 (ja) * | 1985-03-20 | 1996-02-07 | 株式会社日立製作所 | X線露光用マスク |
US4595649A (en) * | 1985-02-19 | 1986-06-17 | Allied Corporation | Glassy TiO2 polymer films as electron beam charge dissipation layers |
JPS61200415A (ja) * | 1985-03-01 | 1986-09-05 | Mitsubishi Electric Corp | 微細パタ−ン検査装置 |
US4680243A (en) * | 1985-08-02 | 1987-07-14 | Micronix Corporation | Method for producing a mask for use in X-ray photolithography and resulting structure |
JPS6240146A (ja) * | 1985-08-14 | 1987-02-21 | Mitsubishi Electric Corp | 荷電ビ−ムパタ−ン欠陥検査装置 |
JPS62202518A (ja) * | 1986-02-03 | 1987-09-07 | Fujitsu Ltd | X線露光用マスク |
DE3605916A1 (de) * | 1986-02-25 | 1987-09-10 | Licentia Gmbh | Verfahren zur kontrasterhoehung bei der roentgenstrahl-lithographie und anordnung zur durchfuehrung des verfahrens |
JPH0682604B2 (ja) * | 1987-08-04 | 1994-10-19 | 三菱電機株式会社 | X線マスク |
-
1987
- 1987-08-04 JP JP19570687A patent/JPH0682604B2/ja not_active Expired - Lifetime
-
1988
- 1988-06-15 DE DE3820421A patent/DE3820421A1/de active Granted
-
1989
- 1989-09-11 US US07/405,583 patent/US5023156A/en not_active Expired - Fee Related
-
1991
- 1991-04-01 US US07/678,423 patent/US5132186A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5132186A (en) | 1992-07-21 |
JPS6439021A (en) | 1989-02-09 |
DE3820421A1 (de) | 1989-02-16 |
US5023156A (en) | 1991-06-11 |
DE3820421C2 (en, 2012) | 1992-08-13 |
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