JPH0680762B2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0680762B2
JPH0680762B2 JP63007389A JP738988A JPH0680762B2 JP H0680762 B2 JPH0680762 B2 JP H0680762B2 JP 63007389 A JP63007389 A JP 63007389A JP 738988 A JP738988 A JP 738988A JP H0680762 B2 JPH0680762 B2 JP H0680762B2
Authority
JP
Japan
Prior art keywords
conductor
semiconductor device
substrate
connection
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63007389A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63193553A (ja
Inventor
ハインツ、アマン
レオ、ローレンツ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS63193553A publication Critical patent/JPS63193553A/ja
Publication of JPH0680762B2 publication Critical patent/JPH0680762B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP63007389A 1987-01-21 1988-01-14 半導体装置 Expired - Lifetime JPH0680762B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3701650.4 1987-01-21
DE3701650 1987-01-21

Publications (2)

Publication Number Publication Date
JPS63193553A JPS63193553A (ja) 1988-08-10
JPH0680762B2 true JPH0680762B2 (ja) 1994-10-12

Family

ID=6319219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63007389A Expired - Lifetime JPH0680762B2 (ja) 1987-01-21 1988-01-14 半導体装置

Country Status (4)

Country Link
US (1) US4907068A (fr)
EP (1) EP0277546B1 (fr)
JP (1) JPH0680762B2 (fr)
DE (1) DE3871968D1 (fr)

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US5210439A (en) * 1988-01-30 1993-05-11 Robert Bosch Gmbh Power transistor monolithic integrated structure
US5202578A (en) * 1989-09-11 1993-04-13 Kabushiki Kaisha Toshiba Module-type semiconductor device of high power capacity
JPH0671063B2 (ja) * 1989-09-11 1994-09-07 株式会社東芝 大電力半導体装置
FR2652983B1 (fr) * 1989-10-11 1993-04-30 Alsthom Gec Montage en cascade d'etages de transistors en parallele realise en circuit hybride.
DE3937045A1 (de) * 1989-11-07 1991-05-08 Abb Ixys Semiconductor Gmbh Leistungshalbleitermodul
JPH0724270B2 (ja) * 1989-12-14 1995-03-15 株式会社東芝 半導体装置及びその製造方法
US5731970A (en) * 1989-12-22 1998-03-24 Hitachi, Ltd. Power conversion device and semiconductor module suitable for use in the device
US5185097A (en) * 1989-12-29 1993-02-09 Canon Kabushiki Kaisha Polymeric liquid-crystalline compound, liquid-crystal composition containing it, and liquid-crystal drive
JP2585834B2 (ja) * 1990-04-11 1997-02-26 オークマ株式会社 インバータモジュール
US5038197A (en) * 1990-06-26 1991-08-06 Harris Semiconductor Patents, Inc. Hermetically sealed die package with floating source
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JPS63193553A (ja) 1988-08-10
EP0277546B1 (fr) 1992-06-17
EP0277546A1 (fr) 1988-08-10
US4907068A (en) 1990-03-06
DE3871968D1 (de) 1992-07-23

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