JPH06506321A - 高熱伝導率の表装装置 - Google Patents

高熱伝導率の表装装置

Info

Publication number
JPH06506321A
JPH06506321A JP4509057A JP50905792A JPH06506321A JP H06506321 A JPH06506321 A JP H06506321A JP 4509057 A JP4509057 A JP 4509057A JP 50905792 A JP50905792 A JP 50905792A JP H06506321 A JPH06506321 A JP H06506321A
Authority
JP
Japan
Prior art keywords
package
metal
ceramic
copper
tungsten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4509057A
Other languages
English (en)
Japanese (ja)
Inventor
メディロス，マニエル，ザ　サード
グリーンスパン，ジェイ，エス．
Original Assignee
オリン コーポレイション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オリン コーポレイション filed Critical オリン コーポレイション
Publication of JPH06506321A publication Critical patent/JPH06506321A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
JP4509057A 1991-03-29 1992-02-12 高熱伝導率の表装装置 Pending JPH06506321A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/677,078 US5111277A (en) 1991-03-29 1991-03-29 Surface mount device with high thermal conductivity
US677,078 1991-03-29
PCT/US1992/001166 WO1992017902A2 (en) 1991-03-29 1992-02-12 Surface mount device with high thermal conductivity

Publications (1)

Publication Number Publication Date
JPH06506321A true JPH06506321A (ja) 1994-07-14

Family

ID=24717229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4509057A Pending JPH06506321A (ja) 1991-03-29 1992-02-12 高熱伝導率の表装装置

Country Status (5)

Country Link
US (1) US5111277A (cg-RX-API-DMAC7.html)
EP (1) EP0577731A1 (cg-RX-API-DMAC7.html)
JP (1) JPH06506321A (cg-RX-API-DMAC7.html)
AU (1) AU1684792A (cg-RX-API-DMAC7.html)
WO (1) WO1992017902A2 (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015029907A1 (ja) * 2013-08-29 2015-03-05 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP2018142568A (ja) * 2017-02-27 2018-09-13 日本電気硝子株式会社 パッケージ基体及びそれを用いた気密パッケージ

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* Cited by examiner, † Cited by third party
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US5289336A (en) * 1992-01-14 1994-02-22 Harris Corporation Static electricity dispersant
US5306891A (en) * 1992-04-02 1994-04-26 Motorola, Inc. Laser welding process for attaching metal to ceramic substrate
US5481136A (en) * 1992-10-28 1996-01-02 Sumitomo Electric Industries, Ltd. Semiconductor element-mounting composite heat-sink base
JPH06244231A (ja) * 1993-02-01 1994-09-02 Motorola Inc 気密半導体デバイスおよびその製造方法
US5343360A (en) * 1993-03-31 1994-08-30 Ncr Corporation Containing and cooling apparatus for an integrated circuit device having a thermal insulator
US5436793A (en) * 1993-03-31 1995-07-25 Ncr Corporation Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member
US5650592A (en) * 1993-04-05 1997-07-22 Olin Corporation Graphite composites for electronic packaging
US5540378A (en) * 1993-09-27 1996-07-30 Olin Corporation Method for the assembly of an electronic package
US5559373A (en) * 1994-12-21 1996-09-24 Solid State Devices, Inc. Hermetically sealed surface mount diode package
US5616886A (en) * 1995-06-05 1997-04-01 Motorola Wirebondless module package
SG59997A1 (en) * 1995-06-07 1999-02-22 Ibm Apparatus and process for improved die adhesion to organic chip carries
US5898128A (en) * 1996-09-11 1999-04-27 Motorola, Inc. Electronic component
US6119920A (en) * 1996-12-20 2000-09-19 Rf Monolithics, Inc. Method of forming an electronic package with a solder seal
US5942796A (en) * 1997-11-17 1999-08-24 Advanced Packaging Concepts, Inc. Package structure for high-power surface-mounted electronic devices
US6261868B1 (en) 1999-04-02 2001-07-17 Motorola, Inc. Semiconductor component and method for manufacturing the semiconductor component
US6371760B1 (en) * 1999-12-22 2002-04-16 Tony Zavilenski Method and apparatus for welding orthodontic article and an orthodontic article
US20040046247A1 (en) * 2002-09-09 2004-03-11 Olin Corporation, A Corporation Of The Commonwealth Of Virginia Hermetic semiconductor package
US7741158B2 (en) * 2006-06-08 2010-06-22 Unisem (Mauritius) Holdings Limited Method of making thermally enhanced substrate-base package
US8450842B2 (en) * 2007-03-20 2013-05-28 Kyocera Corporation Structure and electronics device using the structure
US8143717B2 (en) * 2008-06-16 2012-03-27 Hcc Aegis, Inc. Surface mount package with ceramic sidewalls
US8080872B2 (en) * 2008-06-16 2011-12-20 Hcc Aegis, Inc. Surface mount package with high thermal conductivity
US9392713B2 (en) 2014-10-17 2016-07-12 Rsm Electron Power, Inc. Low cost high strength surface mount package

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3685134A (en) * 1970-05-15 1972-08-22 Mallory & Co Inc P R Method of making electrical contact materials
US4025997A (en) * 1975-12-23 1977-05-31 International Telephone & Telegraph Corporation Ceramic mounting and heat sink device
JPS5386576A (en) * 1977-01-10 1978-07-31 Nec Corp Package for semiconductor element
US4427993A (en) * 1980-11-21 1984-01-24 General Electric Company Thermal stress relieving bimetallic plate
JPS5939949U (ja) * 1982-09-08 1984-03-14 アルプス電気株式会社 高周波回路装置
JPS5946050A (ja) * 1982-09-09 1984-03-15 Narumi China Corp 半導体用セラミツクパツケ−ジ
JPS6041244A (ja) * 1983-08-17 1985-03-04 Nec Corp 半導体装置用外囲器
US4943844A (en) * 1985-11-22 1990-07-24 Texas Instruments Incorporated High-density package
GB2197540B (en) * 1986-11-12 1991-04-17 Murata Manufacturing Co A circuit structure.
JPS63166774A (ja) * 1986-12-27 1988-07-09 同和鉱業株式会社 銅板とアルミナ基板との接合体の製造方法
JP2579315B2 (ja) * 1987-06-17 1997-02-05 新光電気工業株式会社 セラミツクパツケ−ジ
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015029907A1 (ja) * 2013-08-29 2015-03-05 京セラ株式会社 電子部品収納用パッケージおよび電子装置
US10645824B2 (en) 2013-08-29 2020-05-05 Kyocera Corporation Electronic component housing package and electronic apparatus
JP2018142568A (ja) * 2017-02-27 2018-09-13 日本電気硝子株式会社 パッケージ基体及びそれを用いた気密パッケージ
KR20190118150A (ko) * 2017-02-27 2019-10-17 니폰 덴키 가라스 가부시키가이샤 패키지 기체 및 그것을 사용한 기밀 패키지

Also Published As

Publication number Publication date
EP0577731A1 (en) 1994-01-12
AU1684792A (en) 1992-11-02
WO1992017902A2 (en) 1992-10-15
US5111277A (en) 1992-05-05
WO1992017902A3 (en) 1992-12-10
EP0577731A4 (cg-RX-API-DMAC7.html) 1994-01-19

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