JPS5939949U - 高周波回路装置 - Google Patents
高周波回路装置Info
- Publication number
- JPS5939949U JPS5939949U JP1982136313U JP13631382U JPS5939949U JP S5939949 U JPS5939949 U JP S5939949U JP 1982136313 U JP1982136313 U JP 1982136313U JP 13631382 U JP13631382 U JP 13631382U JP S5939949 U JPS5939949 U JP S5939949U
- Authority
- JP
- Japan
- Prior art keywords
- high frequency
- frequency circuit
- electrode
- dielectric
- grounded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は高周波回路の一例を示す回路図、第2図および
第3図は第1図図水高周波回路をハイブリッドICによ
って構成した従来の高周波回路装置を説明するための説
明図、第4図は本考案の一実施例における要部の平面図
、第5図は第4図図示実施例の底面図、第6図は第4図
および第5図図示矢印B−Bにおける断面図を示す。 図中、4はトランジスタ、4Eはエミッタ端子、5はバ
イパス・コンデンサ、13はセラミック基板、14およ
び15はリード電極、17はスルー・ホール、18は接
地導体、22は裏面電極、23は裏面上部電極、24は
誘電体、25は保護被覆膜を表わす。
第3図は第1図図水高周波回路をハイブリッドICによ
って構成した従来の高周波回路装置を説明するための説
明図、第4図は本考案の一実施例における要部の平面図
、第5図は第4図図示実施例の底面図、第6図は第4図
および第5図図示矢印B−Bにおける断面図を示す。 図中、4はトランジスタ、4Eはエミッタ端子、5はバ
イパス・コンデンサ、13はセラミック基板、14およ
び15はリード電極、17はスルー・ホール、18は接
地導体、22は裏面電極、23は裏面上部電極、24は
誘電体、25は保護被覆膜を表わす。
Claims (2)
- (1) ハイブリッドICを用いて構成されている高
周波回路装置において、絶縁基板の一方の面に、搭載き
した能動素子の高周波的に接地されるべき接地端子に接
続される第1の電極をもうける′ と共に、上記絶縁
基板の他方の面に、接地される接地導体と該接地導体に
誘電体を介して対向しかつスルー・ホールによって上記
第1の電極に接続された第2の電極とをそなえ、上記能
動素子の接地端子は上記第1の電極、スルー・ホール、
第2の電極、誘電体および接地導体を介して高周波的に
接地されるように構成されていることを特徴とする高周
波回路装置。 - (2)上記誘電体は環状に形成されると共に該環状の誘
電体の全周面が上記接地導体に接していることを特徴と
する実用新案登録請求の範囲第(1)項記載の高周波回
路装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982136313U JPS5939949U (ja) | 1982-09-08 | 1982-09-08 | 高周波回路装置 |
US06/530,237 US4611882A (en) | 1982-09-08 | 1983-09-08 | High-frequency circuit device with an annular capacitor on the back of an insulated substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982136313U JPS5939949U (ja) | 1982-09-08 | 1982-09-08 | 高周波回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5939949U true JPS5939949U (ja) | 1984-03-14 |
JPH046222Y2 JPH046222Y2 (ja) | 1992-02-20 |
Family
ID=15172277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982136313U Granted JPS5939949U (ja) | 1982-09-08 | 1982-09-08 | 高周波回路装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4611882A (ja) |
JP (1) | JPS5939949U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02101768A (ja) * | 1988-10-11 | 1990-04-13 | Rohm Co Ltd | 複合電子部品 |
JP2002299480A (ja) * | 2001-03-30 | 2002-10-11 | Diamond Electric Mfg Co Ltd | 混成集積回路の誘電体におけるサージ保護構造 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4768079A (en) * | 1984-08-07 | 1988-08-30 | M/A Com, Inc. | Field effect transistor device |
US4922324A (en) * | 1987-01-20 | 1990-05-01 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device |
US4839773A (en) * | 1987-06-22 | 1989-06-13 | Murata Manufacturing Co., Ltd. | Dielectric filter |
KR910004957B1 (ko) * | 1987-10-29 | 1991-07-18 | 가부시끼가이샤 도시바 | 고주파 회로장치 |
WO1989005570A1 (en) * | 1987-12-08 | 1989-06-15 | Rogers Corporation | Mounting substrate for leadless ceramic chip carrier |
US4967258A (en) * | 1989-03-02 | 1990-10-30 | Ball Corporation | Structure for use in self-biasing and source bypassing a packaged, field-effect transistor and method for making same |
DE3934224A1 (de) * | 1989-07-04 | 1991-01-10 | Licentia Gmbh | Anordnung zur mikrowellen-integration |
US5188985A (en) * | 1991-03-29 | 1993-02-23 | Aegis, Inc. | Surface mount device with high thermal conductivity |
US5111277A (en) * | 1991-03-29 | 1992-05-05 | Aegis, Inc. | Surface mount device with high thermal conductivity |
NL9201753A (nl) * | 1992-10-09 | 1994-05-02 | Du Pont Nederland | Afdeklaag in filtereenheid voor konnektoren. |
DE4304437A1 (de) * | 1993-02-13 | 1994-08-18 | Ego Elektro Blanc & Fischer | Integrierte Schaltung, insbesondere für Berührungsschalter, sowie Verfahren zur Herstellung einer integrierten Schaltung |
US5684326A (en) * | 1995-02-24 | 1997-11-04 | Telefonaktiebolaget L.M. Ericsson | Emitter ballast bypass for radio frequency power transistors |
RU2190284C2 (ru) | 1998-07-07 | 2002-09-27 | Закрытое акционерное общество "Техно-ТМ" | Двусторонний электронный прибор |
DE10035584A1 (de) * | 2000-07-21 | 2002-01-31 | Philips Corp Intellectual Pty | Mobilfunkgerät |
JP4572759B2 (ja) | 2005-07-06 | 2010-11-04 | セイコーエプソン株式会社 | 半導体装置及び電子機器 |
EP3920200A1 (en) * | 2014-05-05 | 2021-12-08 | 3D Glass Solutions, Inc. | 2d and 3d inductors antenna and transformers fabricating photoactive substrates |
JP7008824B2 (ja) | 2017-12-15 | 2022-01-25 | スリーディー グラス ソリューションズ,インク | 接続伝送線路共振rfフィルタ |
US11677373B2 (en) | 2018-01-04 | 2023-06-13 | 3D Glass Solutions, Inc. | Impedence matching conductive structure for high efficiency RF circuits |
WO2020139951A1 (en) | 2018-12-28 | 2020-07-02 | 3D Glass Solutions, Inc. | Heterogenous integration for rf, microwave and mm wave systems in photoactive glass substrates |
KR102392858B1 (ko) * | 2018-12-28 | 2022-05-03 | 3디 글래스 솔루션즈 인코포레이티드 | 환상형 커패시터 rf, 마이크로파, 및 mm 파 시스템들 |
CA3172853A1 (en) | 2019-04-05 | 2020-10-08 | 3D Glass Solutions, Inc. | Glass based empty substrate integrated waveguide devices |
CA3177603C (en) | 2020-04-17 | 2024-01-09 | 3D Glass Solutions, Inc. | Broadband induction |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5398341U (ja) * | 1977-01-13 | 1978-08-09 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1370855A (en) * | 1972-06-12 | 1974-10-16 | Electrical Res Ass | Electrical capacitors |
US3936866A (en) * | 1974-06-14 | 1976-02-03 | Northrop Corporation | Heat conductive mounting and connection of semiconductor chips in micro-circuitry on a substrate |
JPS51150068A (en) * | 1975-06-19 | 1976-12-23 | Citizen Watch Co Ltd | Electronic circuit block |
US4445274A (en) * | 1977-12-23 | 1984-05-01 | Ngk Insulators, Ltd. | Method of manufacturing a ceramic structural body |
-
1982
- 1982-09-08 JP JP1982136313U patent/JPS5939949U/ja active Granted
-
1983
- 1983-09-08 US US06/530,237 patent/US4611882A/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5398341U (ja) * | 1977-01-13 | 1978-08-09 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02101768A (ja) * | 1988-10-11 | 1990-04-13 | Rohm Co Ltd | 複合電子部品 |
JP2002299480A (ja) * | 2001-03-30 | 2002-10-11 | Diamond Electric Mfg Co Ltd | 混成集積回路の誘電体におけるサージ保護構造 |
Also Published As
Publication number | Publication date |
---|---|
JPH046222Y2 (ja) | 1992-02-20 |
US4611882A (en) | 1986-09-16 |
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