JPS5939949U - 高周波回路装置 - Google Patents

高周波回路装置

Info

Publication number
JPS5939949U
JPS5939949U JP1982136313U JP13631382U JPS5939949U JP S5939949 U JPS5939949 U JP S5939949U JP 1982136313 U JP1982136313 U JP 1982136313U JP 13631382 U JP13631382 U JP 13631382U JP S5939949 U JPS5939949 U JP S5939949U
Authority
JP
Japan
Prior art keywords
high frequency
frequency circuit
electrode
dielectric
grounded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982136313U
Other languages
English (en)
Other versions
JPH046222Y2 (ja
Inventor
牛田　進
Original Assignee
アルプス電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アルプス電気株式会社 filed Critical アルプス電気株式会社
Priority to JP1982136313U priority Critical patent/JPS5939949U/ja
Priority to US06/530,237 priority patent/US4611882A/en
Publication of JPS5939949U publication Critical patent/JPS5939949U/ja
Application granted granted Critical
Publication of JPH046222Y2 publication Critical patent/JPH046222Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は高周波回路の一例を示す回路図、第２図および
第３図は第１図図水高周波回路をハイブリッドＩＣによ
って構成した従来の高周波回路装置を説明するための説
明図、第４図は本考案の一実施例における要部の平面図
、第５図は第４図図示実施例の底面図、第６図は第４図
および第５図図示矢印Ｂ−Ｂにおける断面図を示す。 図中、４はトランジスタ、４Ｅはエミッタ端子、５はバ
イパス・コンデンサ、１３はセラミック基板、１４およ
び１５はリード電極、１７はスルー・ホール、１８は接
地導体、２２は裏面電極、２３は裏面上部電極、２４は
誘電体、２５は保護被覆膜を表わす。

Claims (2)

    【実用新案登録請求の範囲】
  1. （１）　　ハイブリッドＩＣを用いて構成されている高
    周波回路装置において、絶縁基板の一方の面に、搭載き
    した能動素子の高周波的に接地されるべき接地端子に接
    続される第１の電極をもうける′　　と共に、上記絶縁
    基板の他方の面に、接地される接地導体と該接地導体に
    誘電体を介して対向しかつスルー・ホールによって上記
    第１の電極に接続された第２の電極とをそなえ、上記能
    動素子の接地端子は上記第１の電極、スルー・ホール、
    第２の電極、誘電体および接地導体を介して高周波的に
    接地されるように構成されていることを特徴とする高周
    波回路装置。
  2. （２）上記誘電体は環状に形成されると共に該環状の誘
    電体の全周面が上記接地導体に接していることを特徴と
    する実用新案登録請求の範囲第（１）項記載の高周波回
    路装置。
JP1982136313U 1982-09-08 1982-09-08 高周波回路装置 Granted JPS5939949U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1982136313U JPS5939949U (ja) 1982-09-08 1982-09-08 高周波回路装置
US06/530,237 US4611882A (en) 1982-09-08 1983-09-08 High-frequency circuit device with an annular capacitor on the back of an insulated substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982136313U JPS5939949U (ja) 1982-09-08 1982-09-08 高周波回路装置

Publications (2)

Publication Number Publication Date
JPS5939949U true JPS5939949U (ja) 1984-03-14
JPH046222Y2 JPH046222Y2 (ja) 1992-02-20

Family

ID=15172277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982136313U Granted JPS5939949U (ja) 1982-09-08 1982-09-08 高周波回路装置

Country Status (2)

Country Link
US (1) US4611882A (ja)
JP (1) JPS5939949U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02101768A (ja) * 1988-10-11 1990-04-13 Rohm Co Ltd 複合電子部品
JP2002299480A (ja) * 2001-03-30 2002-10-11 Diamond Electric Mfg Co Ltd 混成集積回路の誘電体におけるサージ保護構造

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4768079A (en) * 1984-08-07 1988-08-30 M/A Com, Inc. Field effect transistor device
US4922324A (en) * 1987-01-20 1990-05-01 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device
US4839773A (en) * 1987-06-22 1989-06-13 Murata Manufacturing Co., Ltd. Dielectric filter
KR910004957B1 (ko) * 1987-10-29 1991-07-18 가부시끼가이샤 도시바 고주파 회로장치
WO1989005570A1 (en) * 1987-12-08 1989-06-15 Rogers Corporation Mounting substrate for leadless ceramic chip carrier
US4967258A (en) * 1989-03-02 1990-10-30 Ball Corporation Structure for use in self-biasing and source bypassing a packaged, field-effect transistor and method for making same
DE3934224A1 (de) * 1989-07-04 1991-01-10 Licentia Gmbh Anordnung zur mikrowellen-integration
US5188985A (en) * 1991-03-29 1993-02-23 Aegis, Inc. Surface mount device with high thermal conductivity
US5111277A (en) * 1991-03-29 1992-05-05 Aegis, Inc. Surface mount device with high thermal conductivity
NL9201753A (nl) * 1992-10-09 1994-05-02 Du Pont Nederland Afdeklaag in filtereenheid voor konnektoren.
DE4304437A1 (de) * 1993-02-13 1994-08-18 Ego Elektro Blanc & Fischer Integrierte Schaltung, insbesondere für Berührungsschalter, sowie Verfahren zur Herstellung einer integrierten Schaltung
US5684326A (en) * 1995-02-24 1997-11-04 Telefonaktiebolaget L.M. Ericsson Emitter ballast bypass for radio frequency power transistors
RU2190284C2 (ru) 1998-07-07 2002-09-27 Закрытое акционерное общество "Техно-ТМ" Двусторонний электронный прибор
DE10035584A1 (de) * 2000-07-21 2002-01-31 Philips Corp Intellectual Pty Mobilfunkgerät
JP4572759B2 (ja) 2005-07-06 2010-11-04 セイコーエプソン株式会社 半導体装置及び電子機器
EP3920200A1 (en) * 2014-05-05 2021-12-08 3D Glass Solutions, Inc. 2d and 3d inductors antenna and transformers fabricating photoactive substrates
JP7008824B2 (ja) 2017-12-15 2022-01-25 スリーディー グラス ソリューションズ，インク 接続伝送線路共振ｒｆフィルタ
US11677373B2 (en) 2018-01-04 2023-06-13 3D Glass Solutions, Inc. Impedence matching conductive structure for high efficiency RF circuits
WO2020139951A1 (en) 2018-12-28 2020-07-02 3D Glass Solutions, Inc. Heterogenous integration for rf, microwave and mm wave systems in photoactive glass substrates
KR102392858B1 (ko) * 2018-12-28 2022-05-03 3디 글래스 솔루션즈 인코포레이티드 환상형 커패시터 ｒｆ, 마이크로파, 및 ｍｍ 파 시스템들
CA3172853A1 (en) 2019-04-05 2020-10-08 3D Glass Solutions, Inc. Glass based empty substrate integrated waveguide devices
CA3177603C (en) 2020-04-17 2024-01-09 3D Glass Solutions, Inc. Broadband induction

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5398341U (ja) * 1977-01-13 1978-08-09

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1370855A (en) * 1972-06-12 1974-10-16 Electrical Res Ass Electrical capacitors
US3936866A (en) * 1974-06-14 1976-02-03 Northrop Corporation Heat conductive mounting and connection of semiconductor chips in micro-circuitry on a substrate
JPS51150068A (en) * 1975-06-19 1976-12-23 Citizen Watch Co Ltd Electronic circuit block
US4445274A (en) * 1977-12-23 1984-05-01 Ngk Insulators, Ltd. Method of manufacturing a ceramic structural body

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5398341U (ja) * 1977-01-13 1978-08-09

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02101768A (ja) * 1988-10-11 1990-04-13 Rohm Co Ltd 複合電子部品
JP2002299480A (ja) * 2001-03-30 2002-10-11 Diamond Electric Mfg Co Ltd 混成集積回路の誘電体におけるサージ保護構造

Also Published As

Publication number Publication date
JPH046222Y2 (ja) 1992-02-20
US4611882A (en) 1986-09-16

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