JPH06500427A - ウエファーの搬送ならびに処理の為の改良された装置 - Google Patents

ウエファーの搬送ならびに処理の為の改良された装置

Info

Publication number
JPH06500427A
JPH06500427A JP3504796A JP50479691A JPH06500427A JP H06500427 A JPH06500427 A JP H06500427A JP 3504796 A JP3504796 A JP 3504796A JP 50479691 A JP50479691 A JP 50479691A JP H06500427 A JPH06500427 A JP H06500427A
Authority
JP
Japan
Prior art keywords
chamber
section
wafer
cleaning
medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3504796A
Other languages
English (en)
Japanese (ja)
Inventor
ボック、エドワード
バーラグ、ロナルド、ヨハネス、ウイルフェルムス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPH06500427A publication Critical patent/JPH06500427A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP3504796A 1990-02-16 1991-02-15 ウエファーの搬送ならびに処理の為の改良された装置 Pending JPH06500427A (ja)

Applications Claiming Priority (16)

Application Number Priority Date Filing Date Title
NL9000374 1990-02-16
NL9000376 1990-02-16
NL9000374 1990-02-16
NL9000376 1990-02-16
NL9000579 1990-03-14
NL9000579 1990-03-14
NL9000903 1990-04-17
NL9000903 1990-04-17
NL9001177 1990-05-21
NL9001177 1990-05-21
NL9001400 1990-06-20
NL9001400 1990-06-20
NL9001862 1990-08-23
NL9001862 1990-08-23
NL9100237 1991-02-11
NL9100237 1991-02-11

Publications (1)

Publication Number Publication Date
JPH06500427A true JPH06500427A (ja) 1994-01-13

Family

ID=27573824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3504796A Pending JPH06500427A (ja) 1990-02-16 1991-02-15 ウエファーの搬送ならびに処理の為の改良された装置

Country Status (4)

Country Link
EP (1) EP0515488A1 (fr)
JP (1) JPH06500427A (fr)
KR (1) KR920704332A (fr)
WO (1) WO1991012629A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06262150A (ja) * 1992-05-12 1994-09-20 Matsui Mfg Co 付着物除去方法とその装置
US5275690A (en) * 1992-06-17 1994-01-04 Santa Barbara Research Center Method and apparatus for wet chemical processing of semiconductor wafers and other objects
NL1007357C2 (nl) * 1997-10-24 1999-04-27 Edward Bok Verbeterde inrichting ten behoeve van wafer reiniging.
CA2387341A1 (fr) 1999-11-02 2001-05-10 Tokyo Electron Limited Procede et appareil destines au traitement supercritique de multiples pieces
US6487792B2 (en) 2000-05-08 2002-12-03 Tokyo Electron Limited Method and apparatus for agitation of workpiece in high pressure environment
NL1037065C2 (nl) * 2009-06-23 2010-12-27 Edward Bok Stripvormige transducer-opstelling, welke is opgenomen in een stripvormig gedeelte van een tunnelblok van een semiconductor substraat transfer/behandelings-tunnelopstelling ten behoeve van het daarmede tenminste mede plaatsvinden van een semiconductor behandeling van de opvolgende semiconductor substraat-gedeeltes, welke gedurende de werking ervan ononderbroken erlangs verplaatsen.
NL1037069C2 (nl) * 2009-06-23 2010-12-27 Edward Bok Semiconductor substraat transfer/behandelings-tunnel-opsteling, waarin tenminste mede in het boven- en/of onder tunnelblok de opname van een zich in dwarsrichting ervan uitstrekkende stripvormige inrichting ten behoeve van tijdens de werking ervan het ononderbroken opvolgend op- en neerwaarts verplaatsen van het stripvormige drukplaat-gedeelte ervan.
NL1037192C2 (nl) * 2009-08-11 2011-11-24 Edward Bok Semiconductor tunnel-opstelling, bevattende in het boventunnelblok ervan meerdere inrichtingen ten behoeve van het daarmede opbrengen van een nanometer hoge vloeibare hecht-substantie op de opvolgende, ononderbroken erdoorheen verplaatsende semiconductor substraat-gedeeltes.
NL1037193C2 (nl) * 2009-08-11 2011-11-24 Edward Bok Semiconductor tunnel-opstelling, bevattende in het boventunnelblok ervan een medium-toevoerinrichting.
NL1039188C2 (nl) * 2011-11-24 2013-05-27 Edward Bok Een aantal opvolgende individuele semiconductor inrichtingen, waarbij in de eerste inrichting de opname van een folie-opslagrol en in de daaropvolgende inrichtingen daarop de bewerkstelliging van opvolgende individuele rechthoekige semiconductor substraat-gedeeltes, met in de laatste inrichting door opvolgende delingen ervan het verkrijgen daaruit van semiconductor chips.
NL1039189C2 (nl) * 2011-11-24 2013-05-27 Edward Bok Semiconductor chip, vervaardigd in een aantal opvolgende individuele semiconductor inrichtingen en waarbij in de eerste inrichting de opname van een folie-opslagrol, bevattende een zeer lange folie, in de daaropvolgende inrichtingen daarop de bewerkstelliging van opvolgende individuele rechthoekige substraat-gedeeltes, met in de laatste inrichting door opvolgende delingen ervan het verkrijgen daaruit daarvan.
CN109560030B (zh) * 2017-09-26 2024-02-09 Tcl环鑫半导体(天津)有限公司 一种自动圆形硅片倒片机
KR20210143917A (ko) * 2019-04-18 2021-11-29 램 리써치 코포레이션 고밀도, 제어된 집적 회로들 공장
CN112185852B (zh) * 2020-09-21 2023-08-18 武汉光谷航天三江激光产业技术研究院有限公司 用于半导体器件封装的可搬运级联式百级洁净装置及方法
CN113143476B (zh) * 2021-05-26 2023-02-28 青岛市口腔医院 一种便于取放的消毒供应室用器械转移装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8401776A (nl) * 1984-06-04 1986-01-02 Bok Edward Verbeterde double-floating wafer transport/processing installatie.
NL8402410A (nl) * 1984-08-01 1986-03-03 Bok Edward Verbeterde proces installatie met double-floating transport en processing van wafers en tape.
WO1987004853A1 (fr) * 1986-02-03 1987-08-13 Edward Bok Installation permettant le traitement de tranches et leur transport par flottage

Also Published As

Publication number Publication date
KR920704332A (ko) 1992-12-19
WO1991012629A1 (fr) 1991-08-22
EP0515488A1 (fr) 1992-12-02

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