JPH0648865Y2 - 半導体装置の放熱フイン取付機構 - Google Patents

半導体装置の放熱フイン取付機構

Info

Publication number
JPH0648865Y2
JPH0648865Y2 JP1989091910U JP9191089U JPH0648865Y2 JP H0648865 Y2 JPH0648865 Y2 JP H0648865Y2 JP 1989091910 U JP1989091910 U JP 1989091910U JP 9191089 U JP9191089 U JP 9191089U JP H0648865 Y2 JPH0648865 Y2 JP H0648865Y2
Authority
JP
Japan
Prior art keywords
semiconductor device
heat dissipation
dissipation fin
outer frame
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989091910U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0332432U (
Inventor
篤雄 小西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989091910U priority Critical patent/JPH0648865Y2/ja
Publication of JPH0332432U publication Critical patent/JPH0332432U/ja
Application granted granted Critical
Publication of JPH0648865Y2 publication Critical patent/JPH0648865Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
JP1989091910U 1989-08-03 1989-08-03 半導体装置の放熱フイン取付機構 Expired - Fee Related JPH0648865Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989091910U JPH0648865Y2 (ja) 1989-08-03 1989-08-03 半導体装置の放熱フイン取付機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989091910U JPH0648865Y2 (ja) 1989-08-03 1989-08-03 半導体装置の放熱フイン取付機構

Publications (2)

Publication Number Publication Date
JPH0332432U JPH0332432U ( ) 1991-03-29
JPH0648865Y2 true JPH0648865Y2 (ja) 1994-12-12

Family

ID=31641369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989091910U Expired - Fee Related JPH0648865Y2 (ja) 1989-08-03 1989-08-03 半導体装置の放熱フイン取付機構

Country Status (1)

Country Link
JP (1) JPH0648865Y2 ( )

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101043369B1 (ko) * 2009-03-06 2011-06-21 현대로템 주식회사 소화기 상태 감지 시스템

Also Published As

Publication number Publication date
JPH0332432U ( ) 1991-03-29

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